200423414 五、發明說明（l) 發明--所 ，發明為一種錯位打線影像 別係指一種打線距離短二，哀方法，特 法。 夂錯位打線式之影像感測器封裝方 先前技術 按，請參閱圖1，為習知影像感測器 圖’其包括有；-基板Π，其設有-第」表上的剖， 表面14，第-表面12形成有訊號輸 5 ^ 成有訊號輸出端16 ; 一凸緣川，設有一上= 4: 表面22，下表面22係黏著固定於基板10之第一表面12上 而與基板10形成-凹槽24 ; 一影像 板 =凸，層U所形成之凹槽24内，並固定於基 ^面^上，禝數條導線28，其具有一第一端點3〇及一第二 鈿點2 /第一端點3 〇係電連接至該影像感測晶片2 6，第二 立而點3 2係電連接至基板丨〇之訊號輸入端丨5 ;及一透光層^ 係設置於凸緣層18之上表面2〇。 如疋’上述習知之打線方式，導線2 8連接影像感測晶 片26至基板1〇之訊號輸入端15之距離很長，使得其訊號傳 遞速2較慢，影響到其實用性，且增加導線之成本。 請參閱圖2，為申請人於91/〇3/27申請之第〇912〇3873 號專利，其導線3 6之長度亦長，使得其訊號傳遞之速度 慢，無法具有高傳遞效率之需求。 有鑑於此’本發明人乃本於精益求精、創新突破之精 神’戮力於影像感測晶器封裝之研發，而發明出本發明錯200423414 V. Description of the invention (l) Invention-So, the invention is a misaligned wire image. It does not refer to a wire with a shorter distance of two wires, a method, a special method.夂 Displaced wire-type image sensor package according to the previous technology, please refer to Figure 1, which is a conventional image sensor diagram 'which includes;-the substrate Π, which is provided-the section on the table ", surface 14 The first surface 12 is formed with a signal output 5 ^ into a signal output terminal 16; a flange is provided with an upper = 4: surface 22, the lower surface 22 is adhered and fixed to the first surface 12 of the substrate 10 and the substrate 10form-groove 24; an image plate = convex, the groove 24 formed by the layer U is fixed on the base surface ^, a plurality of wires 28 having a first end point 30 and a first The second point 2 / the first terminal 3 0 is electrically connected to the image sensing chip 26, and the second standing point 3 2 is electrically connected to the signal input terminal 5 of the substrate 丨 〇; and a light-transmitting layer ^ It is provided on the upper surface 20 of the flange layer 18. For example, the above-mentioned conventional wiring method, the distance between the lead 28 connecting the image sensing chip 26 to the signal input terminal 15 of the substrate 10 is very long, which makes its signal transmission speed 2 slower, affecting its practicality, and increasing the lead Cost. Please refer to FIG. 2, which is the No. 0912208387 patent filed by the applicant on 91 / 〇3 / 27. The length of the wire 36 is also long, which makes the signal transmission speed slow and cannot have the requirement of high transmission efficiency. In view of this, the inventor is based on the spirit of excellence, innovation and breakthrough, and devoted himself to the research and development of image sensor crystal package, and invented the error of the present invention.
Η 第4頁 五、發明說明（2) :打線式之影像感測器封裝方法， 者。 八」提訊號傳遞效率 發明内^ 感測器封裝方：要i Ϊ右f艺提供-種錯位打線式之影像 到更為實用之目的了八有南訊號傳遞效率之功效，以達 感測器封裝方、、去一 i:古i於提供一種錯位打線式之影像 產成本之=其具有縮短導線之功效，以達到降低成 提供目：排徵在於包括下列步驟； ^ ^ ^不目互間隔排列之金屬片，該等金屬片形成不同 =又s ϋ — ί及第二板，且該等金屬片底面形成有一容置 至’提供一影像感測晶片，將其設於該等金屬片之容置室 並固定於該等金屬片上，其上相對於該等金屬片之第 一板位置形成有複數個焊墊，使其上之焊墊與該等金屬片 之第一板形成錯位排列，使每一焊墊位於每兩個第一板之 間；提供複數條導線，該每一導線設有一第一端點及一第 二端點’該第一端點係電連接至該影像感測晶片之焊墊 上’該第二端點電連接至該等金屬片之第一板上；提供一 透光層，其係藉由黏著層黏設於該等金屬片之第一板上； 及提供一封膠層，其係將該影像感測晶片及該複屬個金屬 片包覆住，使影像感測晶片可透過該透光層接收光訊號。 如是，可縮短訊號傳遞之距離，以提高訊號傳遞之速4 Page 4 5. Description of the invention (2): Packaging method of wire-type image sensor. Eight "mentions the invention of signal transmission efficiency ^ Sensor package side: I want to provide a kind of misaligned wire-type image to more practical purposes, have the effectiveness of the signal transmission efficiency of the South to achieve the sensor Encapsulation side, go to i: ancient i is to provide a misaligned wire-type image production cost = it has the effect of shortening the wire to achieve a reduction in supply goals: the exclusion is to include the following steps; ^ ^ ^ not separated from each other Arranged metal sheets, the metal sheets form different = again ϋ — ί and the second plate, and the bottom surface of the metal sheets is formed with a container to 'provide an image sensing chip, which is placed on the metal sheets The accommodating chamber is fixed on the metal sheets, and a plurality of solder pads are formed on the positions of the first plates relative to the metal sheets, so that the solder pads thereon and the first plates of the metal sheets form an offset arrangement, Each pad is located between every two first boards; a plurality of wires are provided, and each wire is provided with a first terminal and a second terminal; the first terminal is electrically connected to the image sensor; The second end of the wafer's pad is electrically connected to the A first plate of a metal sheet; a light-transmitting layer provided on the first plate of the metal sheets by an adhesive layer; and an adhesive layer provided on the image sensing chip and the Multiple metal sheets are covered so that the image sensing chip can receive light signals through the light transmitting layer. If so, the distance of signal transmission can be shortened to increase the speed of signal transmission
第5頁 200423414 、發明說明（3) 度’及有效降低生產成本。 ^ 本發明之上述及其他目的、優點和特色由以下較佳實 施例之詳細說明並參考圖式俾得以更深入了解。 f施足立 、、請參閱圖3、圖4及圖5，為本發明錯位打線式之影像 感，器封裝方法之第一及第二示意圖，該影像感測器包括 有複數個相互排列之金屬片4〇、一影像感測晶片42、一封 膠層44、複數條導線46及一透光層47，其封裝方法包括下 列步驟： 一，供複數個相互排列之金屬片4 〇，每一金屬片4 〇形成 不，南度之第一板48及第二板5〇，且第一板48與第二板50 間藉由第三板52相互連接，第二板50底面係電連接至印刷 電路板54上，用以將訊號傳遞至印刷電路板54，且該等金 屬^5 40底面形成一容置室56。本發明之該等金屬片4〇係以 j壓方式直接形成第一板48、第二板50、第三板52及容置 室56，其製造上相當便利。 ❿ 二 請配合參閱圖5，提供一影像感測晶片42，係設置於 =複數個金屬片之容置室56内，並藉由黏著層59黏著於第 一板48底面，其上相對於金屬片4〇之每一個第_板“位置 形成有複數個焊墊58，且每一焊墊58與每一個第一板48形 成錯位排列，使每一焊墊58位於二個第一板48之間。 提供複數條導線46，其設有一第一端點60及一第二端 點62 ’第一端點60係電連接至影像感測晶片42之悍墊Page 5 200423414, description of invention (3) degrees' and effectively reduce production costs. ^ The above and other objects, advantages and features of the present invention will be further understood from the detailed description of the following preferred embodiments and with reference to the drawings. f Shizuli, please refer to FIG. 3, FIG. 4, and FIG. 5, which are the first and second schematic diagrams of the packaging method of the dislocated wire-type image sensor according to the present invention. The image sensor includes a plurality of metals arranged in an array. A sheet 40, an image sensing chip 42, an adhesive layer 44, a plurality of wires 46, and a light-transmitting layer 47. The packaging method includes the following steps: First, a plurality of metal sheets 40 arranged one above the other, each The metal sheet 40 is not formed. The first plate 48 and the second plate 50 of Nandu are connected to each other through a third plate 52. The bottom surface of the second plate 50 is electrically connected to The printed circuit board 54 is used to transmit signals to the printed circuit board 54, and the bottom surface of the metal ^ 5 40 forms an accommodation chamber 56. The metal sheets 40 of the present invention directly form the first plate 48, the second plate 50, the third plate 52, and the accommodating chamber 56 in a j-press manner, which is quite convenient in manufacturing. ❿ Please refer to FIG. 5 to provide an image sensing chip 42 which is disposed in a receiving chamber 56 of a plurality of metal sheets and is adhered to the bottom surface of the first plate 48 by an adhesive layer 59, which is opposite to the metal A plurality of pads 58 are formed at each of the first plate of the sheet 40, and each pad 58 is in a misaligned arrangement with each of the first plates 48, so that each pad 58 is located between the two first plates 48. A plurality of wires 46 are provided, which are provided with a first terminal 60 and a second terminal 62. The first terminal 60 is a hard pad electrically connected to the image sensing chip 42.
第6頁 200423414 五、發明說明（4) 上，第二端 4 8上，使影 4 0上。 提供一 置於複數個 42覆蓋住， 提供一 接形成於複 片4 0及影像 第二板50之 接至印刷電 請參閱 之另一實施 提供複 不同向度之 間藉由第三 電路板5 4上 屬片40底面 沖壓方式直 室5 6 ，其製 請配合 複數個金屬 一板48底面 位置形成有 點6 2則電連接至金屬片4 0相對應錯位之第一板 像感測晶片42之訊號藉由導線46傳遞至金屬片 透光層47，該透光層47為一透光玻璃，其係設 金屬片40之第一板48上，用以將影像感測晶片 使影像感測晶片42透過透光層47接收光訊號。 封膠層4 4 ’其係以熱塑性塑膠經由射出模具直 數個金屬片40之周緣及底面，而將複數個金屬 感測晶片4 2包覆，且使複數個金屬片4 〇之第一 下面由封膠層44露出，用以使第二板5〇可電連 路板5 4上。 圖6，為本發明錯位式之影像感測器封裝方法 例，其包括下列步驟： 數個相互排列之金屬片40，每一金屬片40形成 第一板48及第二板50，且第一板48與第二板50 板52相互連接，第二板5〇底面係電連接至印刷 ’用以將訊號傳遞至印刷電路板54，且該等金 形成一容置室56。本發明之該等金屬片40係以 接形成第一板48、第二板50、第三板52及容置 造上相當便利。 參閱圖5，提供一影像感測晶片4 2，係設置於 片40之容置室56内，並藉由黏著層59黏著於第 ’其上相對於基板金屬片40之每一個第一板48 複數個焊墊58，且每一烊墊58與每一個第一板Page 6 200423414 V. Description of the invention (4), the second end 4 8 and the shadow 4 0. Provide one to cover a plurality of 42, provide one to be formed on the complex 40 and the second board 50 to the printed electronics. Please refer to another implementation to provide multiple different orientations through the third circuit board 5 4 The upper plate 40 is punched in the bottom surface of the straight chamber 5 6. For the system, please cooperate with a plurality of metal plates 48 to form a point 6 on the bottom surface. 2 The electrical connection to the metal plate 4 0 corresponds to the misaligned first plate image sensing chip 42. The signal is transmitted to the metal sheet light-transmitting layer 47 through the wire 46. The light-transmitting layer 47 is a light-transmitting glass, which is provided on the first plate 48 of the metal sheet 40, and is used to convert the image-sensing chip to the image-sensing chip. 42 receives a light signal through the light transmitting layer 47. The sealing layer 4 4 ′ is formed by covering the peripheral edges and the bottom surfaces of the plurality of metal sheets 40 with a thermoplastic plastic through the injection mold, and covering the plurality of metal sensing wafers 4 2, and making the plurality of metal sheets 40 first and lower. The sealant layer 44 is exposed to allow the second board 50 to be electrically connected to the circuit board 54. FIG. 6 is an example of a method for packaging a dislocated image sensor according to the present invention, which includes the following steps: a plurality of metal sheets 40 arranged on each other, each metal sheet 40 forming a first plate 48 and a second plate 50, and the first The plate 48 and the second plate 50 and the plate 52 are connected to each other. The bottom surface of the second plate 50 is electrically connected to the printed circuit board for transmitting signals to the printed circuit board 54, and the gold forms an accommodation chamber 56. The metal sheets 40 of the present invention are quite convenient for forming the first plate 48, the second plate 50, the third plate 52, and the container. Referring to FIG. 5, an image sensing chip 42 is provided, which is disposed in the accommodating chamber 56 of the sheet 40 and is adhered to each of the first plates 48 on the substrate 40 with respect to the substrate metal sheet 40 by an adhesive layer 59. A plurality of bonding pads 58 and each pad 58 and each first plate
第7頁 200423414 五、發明說明（5) 4 8形成錯位排列，使每一焊墊5 8位於二個第一板4 8之間。 提供複數條導線46，其設有一第一端點60及一第二端 點62 ’第一端點60係電連接至影像感測晶片42之焊墊58 上’第二端點6 2則電連接至金屬片4 〇相對應錯位之第一板 48上，使影像感測晶片42之訊號藉由導線46傳遞至金屬片 40上。 提供一封膠層4 4，其係以熱塑性塑膠經由射出模具直 接形成於複數個金屬片4 0之周緣及底面，而將複數個金屬 片4 0及影像感測晶片4 2包覆，且使複數個金屬片4 〇之第一 第二板50之下面由封膠層44露出，用以使第二板5〇可電連 接至印刷電路板5 4上，並於複數個金屬片4 〇周緣形成有_ 凸緣層6 4。 _ 提供一透光層47，其為一透光玻璃，係藉由黏著層 著於該凸緣層64上，用以將影像感測晶片42覆蓋住，^ ^ 像感測晶片4 2透過透光層4 7接收光訊號。 藉由如上之封裝方法，由於打線係位於兩個焊墊$ 間，故距離甚短，是以，本發明可有效地縮短影像 片4 2至金屬片4 0之訊號傳遞距離，不但可節省導 、曰曰 料，且可提南訊號傳遞之速度，使其更為實用者。之材 在較佳實施例之詳細說明中所提出之具 了易於說明本發明之技術内容，並非將本發明狹 於實施例，凡依本發明之精神及以下申請專利範=制 所作種種變化實施均屬本發明之範圍。 固 < 知况Page 7 200423414 V. Description of the invention (5) 4 8 forms an offset arrangement so that each pad 5 8 is located between the two first plates 4 8. A plurality of wires 46 are provided, which are provided with a first terminal 60 and a second terminal 62 'the first terminal 60 is electrically connected to the pad 58 of the image sensing chip 42' the second terminal 62 is electrically It is connected to the first plate 48 corresponding to the misalignment of the metal sheet 40, so that the signal of the image sensing chip 42 is transmitted to the metal sheet 40 through the wire 46. An adhesive layer 4 4 is provided, which is directly formed on the periphery and the bottom surface of a plurality of metal sheets 40 by a thermoplastic plastic through an injection mold, and the plurality of metal sheets 40 and the image sensing chip 4 2 are covered, and the The underside of the first and second plates 50 of the plurality of metal pieces 40 is exposed by the sealant layer 44 so that the second plate 50 can be electrically connected to the printed circuit board 54, and is located on the periphery of the plurality of metal pieces 40. _ Flange layer 6 4 is formed. _ A light-transmitting layer 47 is provided, which is a light-transmissive glass, which is adhered to the flange layer 64 by an adhesive layer, so as to cover the image-sensing chip 42, and the image-sensing chip 4 2 is transparent. The optical layer 4 7 receives an optical signal. With the above packaging method, since the wire is located between the two solder pads, the distance is very short. Therefore, the present invention can effectively shorten the signal transmission distance from the image 42 to the metal 40, which can not only save guidance , Said materials, and can mention the speed of the South signal transmission, making it more practical. The material proposed in the detailed description of the preferred embodiment has the technical content of the invention that is easy to explain. It does not narrow the invention to the embodiment. Any changes made in accordance with the spirit of the invention and the following patent application systems are implemented. All belong to the scope of the present invention. Solid < Information
200423414200423414
圖1為習知影像感測器封裝構造之剖視圖。 圖2為第09 1 203873號專利之圖式。 '° 圖3為本發明錯位打線式之影像感測器封裝方涑之第一示 意圖。 、 圖4為本發明錯位打線式之影像感測器封裝方法之第二示 意圖。 圖5為本發明錯位打線式之影像感測器封裝構造之上視圖 (拿下透光層47)。FIG. 1 is a cross-sectional view of a conventional image sensor package structure. Figure 2 is a drawing of the patent No. 09 1 203873. '° FIG. 3 is a first schematic view of an offset-type image sensor package according to the present invention. Fig. 4 is a second schematic view of a packaging method for an image sensor of a staggered type according to the present invention. FIG. 5 is a top view of the package structure of the staggered image sensor of the present invention (removing the light-transmitting layer 47).
圖6為本發明錯位打線式之影像感測器封装方法之另一實 施例之示意圖。FIG. 6 is a schematic diagram of another embodiment of a method for packaging an image sensor of a staggered wire type according to the present invention.
本發明之圖號 金屬片40 影像感測晶片4 2 封膠層 44 導線 6 0 透光層 47 第一板 48 第二板5 0 第三板 52 在卩刷電 路板5 4 容置室56 焊墊 58 黏著層 59 第一端點6 0 第二端點 62 第9頁The drawing sheet metal sheet 40 of the present invention, the image sensing wafer 4 2 the sealing layer 44 the wire 6 0 the light transmitting layer 47 the first plate 48 the second plate 5 0 the third plate 52 is soldered in the circuit board 5 4 accommodating room 56 Pad 58 Adhesive layer 59 First endpoint 6 0 Second endpoint 62 Page 9