TWI226699B - Structure of encapsulation for image sensor and method of encapsulation thereof - Google Patents
Structure of encapsulation for image sensor and method of encapsulation thereof Download PDFInfo
- Publication number
- TWI226699B TWI226699B TW92114460A TW92114460A TWI226699B TW I226699 B TWI226699 B TW I226699B TW 92114460 A TW92114460 A TW 92114460A TW 92114460 A TW92114460 A TW 92114460A TW I226699 B TWI226699 B TW I226699B
- Authority
- TW
- Taiwan
- Prior art keywords
- intermediate plate
- metal sheet
- layer
- metal
- sheets
- Prior art date
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
月所屬之技術領域 方法 製造 本發明係有關於為一種影像感測器封裝構造及其封裝 ’特別係指一種可有效提高產品可靠度、散埶&果^ 更為便利者。 …、 先前技術 器播t,申請人前於九十一年三月二十七提出『影像感測 圖稱'』專利申請(申請案號912〇3873 ),其專利特徵如 斤示’其包括有一基板1 〇,其係由複數個相互間隔排 列之金屬片1 2組成,該等金屬片1 2形成不同高度之第一板 1 4及第二板1 6 ; 一凸緣層1 8係形成於基板1 〇周緣及底面, 其與基板10形成一容置區2〇,且使該等複數金屬片12之第 一板1 4之上面與第二板1 6之下面分別由凸緣層1 8露出;一 影像感測晶片2 2,其係設置於凸緣層丨8與基板丨〇所形成之 容置區2 0内;複數條導線2 4係電連接該等金屬片丨2之第一 板1 4之上面與影像感測晶片2 2上;及一透光層2 6係設置於 凸緣層1 8上’將影像感測晶片2 2覆蓋住。 上述之該專利雖確可達到其創作目的及功效,惟,其 仍存有以下之缺失,即: 1·在製造上由於將金屬片12彎折成不同高度之第一板14及 第一板1 6時’將造成第一板丨4不夠平整,使得在進行打線 製程時,導線24無法顺利地接著於金屬片1 2上,以致於影 響其良率。 2·因金屬片1 2之第二板1 6厚度薄(在製造上無法沖壓出厚TECHNICAL FIELD The present invention relates to a packaging structure for an image sensor and its packaging, and in particular, it refers to a device that can effectively improve product reliability, and is more convenient. …, The prior art device, the applicant filed a patent application of “Image Sensing Image” on March 27, 2011 (Application No. 912038773), and its patent features are as shown in “It includes a The substrate 10 is composed of a plurality of metal sheets 12 spaced apart from each other. The metal sheets 12 form a first plate 14 and a second plate 16 of different heights; a flange layer 18 is formed on The peripheral edge and the bottom surface of the substrate 10 form an accommodating area 20 with the substrate 10, and the upper surface of the first plate 14 and the lower surface of the second plate 16 of the plurality of metal sheets 12 are respectively formed by a flange layer 1 8 Exposed; an image-sensing wafer 22, which is disposed in the accommodation area 20 formed by the flange layer 丨 8 and the substrate 丨 〇; the plurality of wires 2 4 are electrically connected to the metal pieces 丨 2 first The upper surface of the plate 14 and the image sensing chip 22 are placed on top of each other; and a light transmitting layer 26 is disposed on the flange layer 18 to cover the image sensing chip 22. Although the above-mentioned patent can indeed achieve its creative purpose and effect, it still has the following shortcomings, namely: 1. In manufacturing, because the metal sheet 12 is bent into the first plate 14 and the first plate of different heights 16:00 o'clock will cause the first plate 4 to be not flat enough, so that during the wire bonding process, the wire 24 cannot be smoothly adhered to the metal sheet 12, which affects its yield. 2. The thickness of the second plate 16 of the metal sheet 12 is thin (thickness cannot be stamped out in manufacturing)
12266991226699
’焊錫將盎 f ^ 4\\\ 體固定於印 度較大之金屬片12),所以在錫焊(SMT)過程中 法在金屬片1 2之侧邊攀爬,以致於影響到封裝 刷電路板之穩定度。 ^ 3·影像感測晶片22之底面皆為凸緣層丨8所封 有良好之散熱效果。 才’故未能 有鑑於此,本發明人乃本於精益求精、創新 神,而發明出本發明影像感測器封裝構造及其封之精 用’其可改進上述該專利之缺失,使其更為實用者。 本發明之主要目的,在 造及其封裝方法,其具有增 提高其封裝可靠度之目的, 本發明之另一目的,在 造及其封裝方法,其可在錫 攸較高之高度,可提高影像 定度。 於提供一種影像感測器封裝構 加金屬片厚度之功效,以達到 且可達到良好之散熱效果。 於提供一種影像感測器封裝構 焊(SMT)過程中,使焊錫可攀 感測器固定於印刷電路板之穩 本發明之另一目的,在於提供一種影像感測器封裝構 造及其封裝方法,其具有便於打線之功效,以達到提高產 品良率之目的。 是以,為達上述之目的,本發明構造係包括有:一下 層金屬片組,其包括有複數個相互間隔排列之下層金屬片 及一等高對應設於該複數個下層金屬片之間之下層中間 板’該每一下層金屬片設有一上表面及一下表面,該下層 中間板設有一上表面及一下表面;一上層金屬片組,其包 1226699 五、發明說明(3) 括有複數個相互間隔排列之上層金屬片及一等高對應設於 該複數個上層金屬片之間之上層中間板,該每一上層金屬 片設有一上表面及一下表面,該上層金屬片之下表面係相 對應地疊設於該下層金屬片之上表面,該上層中間板設有 一上表面及一下表面,該上層中間板之下表面係相對應地 疊設於該下層中間板之上表面;一封膠體,其係用以將該 複數個下層金屬片、一下層中間板、複數個上層金屬片及 一上層中間板包覆黏著住,並使該每一上層金屬片之上表 面由該封膠體露出,該每一下層金屬片之下表面由該封膠 體露出,用以電連接至該印刷電路板,該下層中間板之下 表面及該上層中間板之上表面由該封膠體露出,且於該等 上層金屬片之上表面周緣形成有凸緣層,使其與該等上層 金屬片形成一容置室;一影像感測晶片,其係設置於該上 層中間板之上表面上,並位於該容置室内;複數條導線, 其係電連接該影像感測晶片至該上層金屬片之上表面;及 一透光層,其係蓋設於該封膠體之凸緣層上,用以將該影 像感測晶片覆蓋住。 如是,即可達到上述之功效及目的。 本案得藉由以下圖式及說明,得以更深入之瞭解。 實施方式 請參閱圖2,為本發明影像感測器封裝構造之剖視 圖,其包括有複數個相互排列之一下層金屬片組3、一上 層金屬片組4、一封膠體34、一影像感測晶片3 6、複數條'The solder fixes the Angstrom f ^ 4 \\\ body to the larger metal sheet in India 12), so the method of climbing on the side of the metal sheet 1 2 during the soldering (SMT) process has affected the package brush circuit. The stability of the board. ^ 3. The bottom surface of the image sensing chip 22 is sealed by the flange layer 8 and has a good heat dissipation effect. Only because of this, the present inventor has invented the image sensor package structure and its excellent use of the invention based on excellence and innovation, which can improve the lack of the above patent and make it more For utility. The main purpose of the present invention is to manufacture and its packaging method, which has the purpose of increasing the reliability of its packaging. Another object of the present invention is to manufacture and its packaging method, which can be at a higher level than tin, which can improve Image scaling. The purpose is to provide an image sensor package with the effect of increasing the thickness of the metal sheet to achieve and achieve good heat dissipation. In the process of providing an image sensor package construction welding (SMT) process, the solderable sensor can be fixed to a printed circuit board. Another object of the present invention is to provide an image sensor package structure and a packaging method thereof. , Which has the effect of facilitating the wiring, in order to achieve the purpose of improving product yield. Therefore, in order to achieve the above-mentioned object, the structure of the present invention includes: a lower-layer metal sheet group, which includes a plurality of lower-layer metal sheets arranged at a distance from each other and a height correspondingly arranged between the plurality of lower-layer metal sheets. Lower layer intermediate plate 'Each lower layer metal plate is provided with an upper surface and a lower surface, and the lower layer intermediate plate is provided with an upper surface and a lower surface; an upper layer metal plate group including 1226699 V. Description of the invention (3) includes a plurality of The upper metal sheets and a middle layer are arranged at intervals between the upper metal sheets, and each upper metal sheet is provided with an upper surface and a lower surface. The lower surface of the upper metal sheet is phase-phased. Correspondingly stacked on the upper surface of the lower metal sheet, the upper intermediate plate is provided with an upper surface and a lower surface, and the lower surface of the upper intermediate plate is correspondingly stacked on the upper surface of the lower intermediate plate; a colloid , Which is used to cover and adhere the plurality of lower metal sheets, the lower intermediate plate, the plurality of upper metal sheets, and the upper intermediate plate, and make each upper metal The upper surface is exposed by the sealant, and the lower surface of each lower metal sheet is exposed by the sealant for electrical connection to the printed circuit board. The lower surface of the lower intermediate board and the upper surface of the upper intermediate board are The sealant is exposed, and a flange layer is formed on the peripheral edge of the upper surface of the upper metal sheets to form an accommodation chamber with the upper metal sheets; an image sensing wafer is arranged on the upper intermediate plate On the upper surface and located in the accommodating chamber; a plurality of wires electrically connecting the image sensing chip to the upper surface of the upper metal sheet; and a light-transmitting layer covering the protrusion of the sealing compound The edge layer is used to cover the image sensing chip. If so, the above-mentioned effects and purposes can be achieved. This case can be understood more deeply by the following drawings and descriptions. For an embodiment, please refer to FIG. 2, which is a cross-sectional view of a package structure of an image sensor according to the present invention, which includes a plurality of lower metal sheet groups 3, an upper metal sheet group 4, a colloid 34, and an image sensor. Wafer 3 6, multiple
第8頁 1226699 五、發明說明(4) 導線38及一透光層40,其中: 下層金屬片組3包括有複數個相互間隔排列之下層金 屬片30及一等高對應設於複數個下層金屬片之間之下層中 間板50 ’母一下層金屬片30設有一上表面42及一下表面 44 ’下表面44係藉由焊錫60以錫焊(SMT)方式焊設於一印 刷電路板58上;中間板50設有一上表面51及一下表面52。Page 8 1226699 V. Description of the invention (4) The wire 38 and a light-transmitting layer 40, wherein: the lower metal sheet group 3 includes a plurality of lower metal sheets 30 arranged at a distance from each other and a height corresponding to the lower metal The lower intermediate board 50 ′ between the sheets is provided with an upper surface 42 and a lower surface 44 ′. The lower surface 44 is soldered (SMT) on a printed circuit board 58 by solder 60; The middle plate 50 is provided with an upper surface 51 and a lower surface 52.
上層金屬片組4包括有複數個相互間隔排列之上層金 屬片32及一等高對應設於該複數個上層金屬片之間之上層 中間板62,每一上層金屬片32設有一上表面46及一下表面 48,下表面48係相對應地疊設於下層金屬片30之上表面42 上’上層中間板62設有一上表面63及一下表面64,上層中 間板6 2之下表面6 4係相對應地疊設於下層中間板5 〇之上表 面5 1 。 封膠體34係用以將複數個下層金屬片30、一下層中間 板50、複數個上層金屬片32及一上層中間板62包覆黏著 住,並使每一上層金屬片32之上表面46由封膠體34露出, 每一下層金屬片30之下表面44由封膠體34露出,下層中間 板50之下表面52及上層中間板62之上表面63由封膠體34露 出;且於該等上層金屬片32之上表面46周緣形成有凸緣層 54,使其與該等上層金屬片32形成一容置室56。 影像感測晶片3 6係設置於上層中間板6 2之上表面6 3 上,並位於容置室56内。 複數條導線3 8係電連接影像感測晶片3 6至上層金屬片 32之上表面46上,使影像感測晶片36之訊號可傳遞至上層The upper metal sheet group 4 includes a plurality of spaced-apart upper metal sheets 32 and an upper intermediate plate 62 disposed between the plurality of upper metal sheets, and each upper metal sheet 32 is provided with an upper surface 46 and The lower surface 48 and the lower surface 48 are correspondingly stacked on the upper surface 42 of the lower metal sheet 30. The upper intermediate plate 62 is provided with an upper surface 63 and a lower surface 64, and the upper intermediate plate 6 2 and the lower surface 6 4 are phase pairs. Correspondingly stacked on the upper surface 5 1 of the lower intermediate plate 50. The sealing compound 34 is used for covering and adhering a plurality of lower metal sheets 30, a lower intermediate sheet 50, a plurality of upper metal sheets 32, and an upper intermediate sheet 62, and the upper surface 46 of each upper metal sheet 32 is covered by The sealing compound 34 is exposed, the lower surface 44 of each lower metal sheet 30 is exposed by the sealing compound 34, the lower surface 52 of the lower intermediate plate 50 and the upper surface 63 of the upper intermediate plate 62 are exposed by the sealing compound 34; A flange layer 54 is formed on the periphery of the upper surface 46 of the sheet 32 to form an accommodating chamber 56 with the upper metal sheets 32. The image sensing chip 3 6 is disposed on the upper surface 6 3 of the upper intermediate plate 62 and is located in the accommodation chamber 56. The plurality of wires 3 and 8 are electrically connected to the image sensing chip 36 to the upper surface 46 of the upper metal sheet 32, so that the signals of the image sensing chip 36 can be transmitted to the upper layer.
第9頁 1226699 五、發明說明(5) 金屬片3 2上。 透光層40為透光玻璃,其係蓋設於封膠體34之凸緣層 5 4上,用以將影像感測晶片3 6覆蓋住,使影像感測晶片36 可透過透光層4 0接收光訊號。 請配合參閱圖3,為本發明影像感測器封裝方法之第 一示意圖,其包括下列步驟: 提供一下層金屬片組3,其包括有複數個相互間隔排 列之下層金屬片3 0及一等高對應設於複數個下層金屬片3 〇 之間之中間板5 0,每一下層金屬片3 0設有一上表面4 2及一 ^ 下表面44,中間板50設有一上表面51及一下表面52。 提供一上層金屬片組4,其包括有複數個相互間隔排 列之上層金屬片3 2及一等高對應設於複數個上層金屬片3 2 之間之上層中間板62’每一上層金屬片3 2設有一上表面4 6 及一下表面48,下表面4 8係相對應地疊設於下層金屬片3〇 之上表面42上,上層中間板62設有一上表面63及一下表面 6 4 ’上層中間板6 2之下表面6 4係相對應地疊設於下層, 板5 0之上表面51。 ' 間 提供一封膠體34,其係以工業塑膠為材料,藉Page 9 1226699 V. Description of the invention (5) On the metal sheet 32. The light-transmitting layer 40 is a light-transmitting glass, which is covered on the flange layer 54 of the sealing compound 34, and is used to cover the image-sensing wafer 36, so that the image-sensing wafer 36 can pass through the light-transmitting layer 40. Receive light signals. Please refer to FIG. 3 for a first schematic diagram of an image sensor packaging method according to the present invention, which includes the following steps: Provide a lower layer metal sheet group 3, which includes a plurality of lower layer metal sheets 30 spaced apart from each other and a first class The height corresponds to the intermediate plate 50 disposed between the plurality of lower metal sheets 30. Each lower metal sheet 30 is provided with an upper surface 42 and a lower surface 44. The intermediate plate 50 is provided with an upper surface 51 and a lower surface. 52. An upper-layer metal sheet group 4 is provided, which includes a plurality of upper-layer metal sheets 3 2 arranged at a distance from each other and an upper-layer intermediate plate 62 ′ corresponding to each of the upper-layer intermediate plates 62 ′ disposed between the plurality of upper-layer metal sheets 3 2. 2 is provided with an upper surface 4 6 and a lower surface 48, and the lower surface 48 is superimposed on the upper surface 42 of the lower metal sheet 30, and the upper intermediate plate 62 is provided with an upper surface 63 and a lower surface 6 4 'upper layer The lower surface 64 of the middle plate 62 is stacked on the lower layer correspondingly, and the upper surface 51 of the plate 50 is. 'Provide a colloid 34, which uses industrial plastics as a material.
成型方式將複數個下層金屬片3 〇、一下層中間板、、' 個上層金屬片3 2及一上層中間板6 2包覆黏著住,並,數 上層金屬片3 2之上表面4 6由封膠體3 4露出,每2 片30之下表面44由封膠體34露出,下層中間板5〇之 屬 52及上層中間板62之上表面63由封膠體34露出;且表f 上層金屬片3 2之上表面4 6周緣形成有凸緣層54, 等 使具與該In the molding method, a plurality of lower metal sheets 30, a lower intermediate sheet, an upper metal sheet 32, and an upper intermediate sheet 6 2 are covered and adhered, and the upper surfaces 4 6 of the upper metal sheets 3 2 are composed of The sealant 34 is exposed, and the lower surface 44 of each of the two pieces 30 is exposed by the sealant 34, the genus 52 of the lower intermediate plate 50 and the upper surface 63 of the upper intermediate plate 62 are exposed by the sealant 34; and Table f The upper metal sheet 3 A flange layer 54 is formed on the upper surface of the upper surface 4 and the peripheral edge of the surface.
1226699 五、發明說明(6) 等上層金屬片32形成一容置室56。 請配合參閱圖4,為本發明影像感測器3 二不意圖’提供一影像感測晶片3 6,其係設 板62之上表面63上,並位於容置室56内。 提供複數條導線3 8,其係電連接影像感 層金屬片32之上表面46上,使影像感測晶片 至上層金屬片32上。 提供一透光層40,其為透光玻璃,係蓋 之凸緣層5 4上,用以將影像感測晶片3 6覆蓋 測晶片3 6可透過透光層4 〇接收光訊號。 如是’本發明具有如下之優點: 1·由於上、下層金屬片32、3〇係由兩平板形 好之平整度,因此,其可便於打線作業之進 品之封裝良率。 2.由於上、下層金屬片32、3〇組成較高之厚 在錫焊於印刷電路板5 8上時,焊錫6 〇可由下 上層金屬片32上攀爬,使封裝體更穩固地固 板5 8上。 3 ·由於影像感測晶片3 6設於上層中間板6 2之 而上層中間板62之下表面64係疊設於下層中 面51,而下層中間板50之下表面52由封膠體 使影像感測晶片3 6所散發出之熱量可由下層 表面5 2散熱,而能達到良好之散熱效果。 在較佳實施例之詳細說明中所提出之具 t裝方法之第 置於上層中間 測晶片3 6至上 3 6之訊號傳遞 設於封膠體3 4 住,使影像感 成,而具有較 行及可提高產 度,因此,其 層金屬片3 0往 定於印刷電路 上表面6 3上, 間板5 0之上表 3 4露出,故可 中間板5 0之下 體實施例僅為 1226699 五、發明說明(7) 了易於說明本發明之技術内容,並非將本發明狹義地限制 於實施例,凡依本發明之精神及以下申請專利範圍之情況 所作種種變化實施均屬本發明之範圍。 參1226699 V. Description of the invention (6) The upper metal sheet 32 and the like form an accommodating chamber 56. Please refer to FIG. 4 to provide an image sensor chip 36 for the image sensor 32 of the present invention. The image sensor chip 36 is located on the upper surface 63 of the plate 62 and is located in the accommodation chamber 56. A plurality of wires 38 are provided, which are electrically connected to the upper surface 46 of the image-sensing metal sheet 32, so that the image-sensing wafer is on the upper-layer metal sheet 32. A light-transmitting layer 40 is provided. The light-transmitting layer 40 is a transparent glass, and the flange layer 54 of the cover is used to cover the image-sensing wafer 36. The detection wafer 36 can receive light signals through the light-transmitting layer 40. If yes, the present invention has the following advantages: 1. Since the upper and lower metal sheets 32 and 30 are formed by two flat plates and have a good flatness, it can facilitate the packaging yield of the products for wire bonding operations. 2. Because the upper and lower metal sheets 32 and 30 have a relatively high thickness, when soldering to the printed circuit board 58, the solder 60 can be climbed on the lower and upper metal sheets 32 to make the package more firmly fixed to the board. 5 8 on. 3. Since the image sensing chip 36 is disposed on the upper intermediate plate 62, the lower surface 64 of the upper intermediate plate 62 is superimposed on the lower intermediate surface 51, and the lower surface 52 of the lower intermediate plate 50 is image-sealed by the sealant. The heat emitted by the test chip 36 can be dissipated by the lower surface 5 2, and a good heat dissipation effect can be achieved. In the detailed description of the preferred embodiment, the signal transmission with the t-mounting method placed on the upper middle test wafer 36 to 36 is transmitted to the sealing gel 3 4 to make the image feel more convenient and convenient. It can improve the productivity. Therefore, the layer of metal sheet 30 is positioned on the upper surface 63 of the printed circuit, and the table 3 4 above the intermediate board 50 is exposed. Therefore, the example of the lower body of the intermediate board 50 is only 1226699. Explanation of the invention (7) It is easy to explain the technical content of the present invention, and does not limit the present invention to the embodiments in a narrow sense. Any changes made according to the spirit of the present invention and the scope of the following patent applications are within the scope of the present invention. Participate
第12頁 1226699 圖式簡單說明 圖1為習知影像感測器封裝構造之示意圖。 圖2為本發明影像感測器封裝構造之剖視圖。 圖3為本發明影像感測器封裝方法之第一示意圖。 圖4為本發明影像感測器封裝方法之第二示意圖。 本發明之圖號 下層金屬片組3 下層金屬片30 影像感測晶片3 6 上表面 42 上表面 46 上表面 51 容置室 56 上表面 63 上層金屬片組4 上層金屬片32 複數條導線3 8 下表面 44 下表面 48 下表面 52 焊錫 60 下表面 64 封膠體 34 透光層 40 印刷電路板5 8 下層中間板5 0 凸緣層 54 上層中間板6 2Page 12 1226699 Brief description of drawings Figure 1 is a schematic diagram of a conventional image sensor package structure. FIG. 2 is a sectional view of a package structure of an image sensor of the present invention. FIG. 3 is a first schematic diagram of an image sensor packaging method of the present invention. FIG. 4 is a second schematic diagram of an image sensor packaging method of the present invention. Drawing number of the present invention Lower metal sheet group 3 Lower metal sheet 30 Image sensing wafer 3 6 Upper surface 42 Upper surface 46 Upper surface 51 Receiving chamber 56 Upper surface 63 Upper metal sheet group 4 Upper metal sheet 32 Multiple wires 3 8 Lower surface 44 Lower surface 48 Lower surface 52 Solder 60 Lower surface 64 Sealant 34 Light transmitting layer 40 Printed circuit board 5 8 Lower intermediate plate 5 0 Flange layer 54 Upper intermediate plate 6 2
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92114460A TWI226699B (en) | 2003-05-28 | 2003-05-28 | Structure of encapsulation for image sensor and method of encapsulation thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92114460A TWI226699B (en) | 2003-05-28 | 2003-05-28 | Structure of encapsulation for image sensor and method of encapsulation thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200427061A TW200427061A (en) | 2004-12-01 |
TWI226699B true TWI226699B (en) | 2005-01-11 |
Family
ID=35634296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92114460A TWI226699B (en) | 2003-05-28 | 2003-05-28 | Structure of encapsulation for image sensor and method of encapsulation thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI226699B (en) |
-
2003
- 2003-05-28 TW TW92114460A patent/TWI226699B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200427061A (en) | 2004-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI311356B (en) | Package structure and fabricating method thereof | |
TWI447961B (en) | Light emitting diode packaging structure | |
TWI226699B (en) | Structure of encapsulation for image sensor and method of encapsulation thereof | |
JP2004200631A (en) | Optical sensor package structure | |
TWI521740B (en) | Led packages and manufacturing method thereof | |
TWI224856B (en) | Image sensor package structure and method | |
TW201419496A (en) | Sensor in substrate package and manufacturing method thereof | |
TW200423414A (en) | Image sensor packaging method in crossed wire bonding | |
TWI225293B (en) | Substrate structure for integrated circuit packaging and the manufacturing method thereof | |
TW200423330A (en) | Image sensor package structure and method | |
CN2598146Y (en) | Stacking device for image sensor | |
TW530396B (en) | Stack package structure of image sensor | |
TW521440B (en) | Image sensor structure and the package method thereof | |
TW587344B (en) | Injection molded image sensor structure and its manufacturing method | |
CN212182316U (en) | Carrier-free semiconductor laminated packaging structure | |
TW591772B (en) | Image sensor module structure and its manufacturing method | |
TW473958B (en) | Stacked package structure of image sensor | |
TW587004B (en) | Injection molding image sensor packaging method | |
TWI221329B (en) | Packaging structure of image sensor and its packaging method | |
US20030030065A1 (en) | Package for semiconductor photoelectric device | |
TW503574B (en) | Packaging structure of image sensor and its packaging method of the same | |
TW577177B (en) | Injection molding image sensor structure and its manufacturing method | |
TW521414B (en) | Semiconductor planar wire-bonding package | |
TWM252137U (en) | Package structure of image sensor | |
US20070145506A1 (en) | Assembly of image-sensing chip and circuit board with inward wire bonding |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |