TWI226699B - Structure of encapsulation for image sensor and method of encapsulation thereof - Google Patents

Abstract

The present invention provides an encapsulation structure for an image sensor and a method of encapsulation thereof. The encapsulation structure for an image sensor includes: a bottom layer metal sheet set including a plurality of interleaved bottom layer metal sheets and a plurality of intermediate sheets with an equal height and correspondingly arranged between said plurality of interleaved bottom layer metal sheets; a top layer metal sheet set including a plurality of interleaved top layer metal sheets, in which each top layer metal sheet is stacked correspondingly on the upper surface of a bottom layer metal sheet; an encapsulation material for encapsulating said plurality of bottom layer metal sheets, the intermediate sheets, and said plurality of top layer metal sheets, while exposing the top surface of each top layer metal sheet, the bottom surface of each bottom layer metal sheet, and the top and bottom surfaces of each intermediate sheet from the encapsulation material, while forming a protruded edge layer on the periphery of the top surface of the top layer metal sheet, in order to form a housing chamber with the top layer metal sheet; an image sensing chip mounted on the top surface of the intermediate sheets and located in the housing chamber; a plurality of lead wires electrically connecting the image sensing chip to the top surface of the top layer metal sheets; and a transparent layer covering on the protruded edge layer of the encapsulation material for wrapping the image sensing chip.

Description

TECHNICAL FIELD The present invention relates to a packaging structure for an image sensor and its packaging, and in particular, it refers to a device that can effectively improve product reliability, and is more convenient. …, The prior art device, the applicant filed a patent application of “Image Sensing Image” on March 27, 2011 (Application No. 912038773), and its patent features are as shown in “It includes a The substrate 10 is composed of a plurality of metal sheets 12 spaced apart from each other. The metal sheets 12 form a first plate 14 and a second plate 16 of different heights; a flange layer 18 is formed on The peripheral edge and the bottom surface of the substrate 10 form an accommodating area 20 with the substrate 10, and the upper surface of the first plate 14 and the lower surface of the second plate 16 of the plurality of metal sheets 12 are respectively formed by a flange layer 1 8 Exposed; an image-sensing wafer 22, which is disposed in the accommodation area 20 formed by the flange layer 丨 8 and the substrate 丨 〇; the plurality of wires 2 4 are electrically connected to the metal pieces 丨 2 first The upper surface of the plate 14 and the image sensing chip 22 are placed on top of each other; and a light transmitting layer 26 is disposed on the flange layer 18 to cover the image sensing chip 22. Although the above-mentioned patent can indeed achieve its creative purpose and effect, it still has the following shortcomings, namely: 1. In manufacturing, because the metal sheet 12 is bent into the first plate 14 and the first plate of different heights 16:00 o'clock will cause the first plate 4 to be not flat enough, so that during the wire bonding process, the wire 24 cannot be smoothly adhered to the metal sheet 12, which affects its yield. 2. The thickness of the second plate 16 of the metal sheet 12 is thin (thickness cannot be stamped out in manufacturing)

1226699

'The solder fixes the Angstrom f ^ 4 \\\ body to the larger metal sheet in India 12), so the method of climbing on the side of the metal sheet 1 2 during the soldering (SMT) process has affected the package brush circuit. The stability of the board. ^ 3. The bottom surface of the image sensing chip 22 is sealed by the flange layer 8 and has a good heat dissipation effect. Only because of this, the present inventor has invented the image sensor package structure and its excellent use of the invention based on excellence and innovation, which can improve the lack of the above patent and make it more For utility. The main purpose of the present invention is to manufacture and its packaging method, which has the purpose of increasing the reliability of its packaging. Another object of the present invention is to manufacture and its packaging method, which can be at a higher level than tin, which can improve Image scaling. The purpose is to provide an image sensor package with the effect of increasing the thickness of the metal sheet to achieve and achieve good heat dissipation. In the process of providing an image sensor package construction welding (SMT) process, the solderable sensor can be fixed to a printed circuit board. Another object of the present invention is to provide an image sensor package structure and a packaging method thereof. , Which has the effect of facilitating the wiring, in order to achieve the purpose of improving product yield. Therefore, in order to achieve the above-mentioned object, the structure of the present invention includes: a lower-layer metal sheet group, which includes a plurality of lower-layer metal sheets arranged at a distance from each other and a height correspondingly arranged between the plurality of lower-layer metal sheets. Lower layer intermediate plate 'Each lower layer metal plate is provided with an upper surface and a lower surface, and the lower layer intermediate plate is provided with an upper surface and a lower surface; an upper layer metal plate group including 1226699 V. Description of the invention (3) includes a plurality of The upper metal sheets and a middle layer are arranged at intervals between the upper metal sheets, and each upper metal sheet is provided with an upper surface and a lower surface. The lower surface of the upper metal sheet is phase-phased. Correspondingly stacked on the upper surface of the lower metal sheet, the upper intermediate plate is provided with an upper surface and a lower surface, and the lower surface of the upper intermediate plate is correspondingly stacked on the upper surface of the lower intermediate plate; a colloid , Which is used to cover and adhere the plurality of lower metal sheets, the lower intermediate plate, the plurality of upper metal sheets, and the upper intermediate plate, and make each upper metal The upper surface is exposed by the sealant, and the lower surface of each lower metal sheet is exposed by the sealant for electrical connection to the printed circuit board. The lower surface of the lower intermediate board and the upper surface of the upper intermediate board are The sealant is exposed, and a flange layer is formed on the peripheral edge of the upper surface of the upper metal sheets to form an accommodation chamber with the upper metal sheets; an image sensing wafer is arranged on the upper intermediate plate On the upper surface and located in the accommodating chamber; a plurality of wires electrically connecting the image sensing chip to the upper surface of the upper metal sheet; and a light-transmitting layer covering the protrusion of the sealing compound The edge layer is used to cover the image sensing chip. If so, the above-mentioned effects and purposes can be achieved. This case can be understood more deeply by the following drawings and descriptions. For an embodiment, please refer to FIG. 2, which is a cross-sectional view of a package structure of an image sensor according to the present invention, which includes a plurality of lower metal sheet groups 3, an upper metal sheet group 4, a colloid 34, and an image sensor. Wafer 3 6, multiple

Page 8 1226699 V. Description of the invention (4) The wire 38 and a light-transmitting layer 40, wherein: the lower metal sheet group 3 includes a plurality of lower metal sheets 30 arranged at a distance from each other and a height corresponding to the lower metal The lower intermediate board 50 ′ between the sheets is provided with an upper surface 42 and a lower surface 44 ′. The lower surface 44 is soldered (SMT) on a printed circuit board 58 by solder 60; The middle plate 50 is provided with an upper surface 51 and a lower surface 52.

The upper metal sheet group 4 includes a plurality of spaced-apart upper metal sheets 32 and an upper intermediate plate 62 disposed between the plurality of upper metal sheets, and each upper metal sheet 32 is provided with an upper surface 46 and The lower surface 48 and the lower surface 48 are correspondingly stacked on the upper surface 42 of the lower metal sheet 30. The upper intermediate plate 62 is provided with an upper surface 63 and a lower surface 64, and the upper intermediate plate 6 2 and the lower surface 6 4 are phase pairs. Correspondingly stacked on the upper surface 5 1 of the lower intermediate plate 50. The sealing compound 34 is used for covering and adhering a plurality of lower metal sheets 30, a lower intermediate sheet 50, a plurality of upper metal sheets 32, and an upper intermediate sheet 62, and the upper surface 46 of each upper metal sheet 32 is covered by The sealing compound 34 is exposed, the lower surface 44 of each lower metal sheet 30 is exposed by the sealing compound 34, the lower surface 52 of the lower intermediate plate 50 and the upper surface 63 of the upper intermediate plate 62 are exposed by the sealing compound 34; A flange layer 54 is formed on the periphery of the upper surface 46 of the sheet 32 to form an accommodating chamber 56 with the upper metal sheets 32. The image sensing chip 3 6 is disposed on the upper surface 6 3 of the upper intermediate plate 62 and is located in the accommodation chamber 56. The plurality of wires 3 and 8 are electrically connected to the image sensing chip 36 to the upper surface 46 of the upper metal sheet 32, so that the signals of the image sensing chip 36 can be transmitted to the upper layer.

Page 9 1226699 V. Description of the invention (5) On the metal sheet 32. The light-transmitting layer 40 is a light-transmitting glass, which is covered on the flange layer 54 of the sealing compound 34, and is used to cover the image-sensing wafer 36, so that the image-sensing wafer 36 can pass through the light-transmitting layer 40. Receive light signals. Please refer to FIG. 3 for a first schematic diagram of an image sensor packaging method according to the present invention, which includes the following steps: Provide a lower layer metal sheet group 3, which includes a plurality of lower layer metal sheets 30 spaced apart from each other and a first class The height corresponds to the intermediate plate 50 disposed between the plurality of lower metal sheets 30. Each lower metal sheet 30 is provided with an upper surface 42 and a lower surface 44. The intermediate plate 50 is provided with an upper surface 51 and a lower surface. 52. An upper-layer metal sheet group 4 is provided, which includes a plurality of upper-layer metal sheets 3 2 arranged at a distance from each other and an upper-layer intermediate plate 62 ′ corresponding to each of the upper-layer intermediate plates 62 ′ disposed between the plurality of upper-layer metal sheets 3 2. 2 is provided with an upper surface 4 6 and a lower surface 48, and the lower surface 48 is superimposed on the upper surface 42 of the lower metal sheet 30, and the upper intermediate plate 62 is provided with an upper surface 63 and a lower surface 6 4 'upper layer The lower surface 64 of the middle plate 62 is stacked on the lower layer correspondingly, and the upper surface 51 of the plate 50 is. 'Provide a colloid 34, which uses industrial plastics as a material.

In the molding method, a plurality of lower metal sheets 30, a lower intermediate sheet, an upper metal sheet 32, and an upper intermediate sheet 6 2 are covered and adhered, and the upper surfaces 4 6 of the upper metal sheets 3 2 are composed of The sealant 34 is exposed, and the lower surface 44 of each of the two pieces 30 is exposed by the sealant 34, the genus 52 of the lower intermediate plate 50 and the upper surface 63 of the upper intermediate plate 62 are exposed by the sealant 34; and Table f The upper metal sheet 3 A flange layer 54 is formed on the upper surface of the upper surface 4 and the peripheral edge of the surface.

1226699 V. Description of the invention (6) The upper metal sheet 32 and the like form an accommodating chamber 56. Please refer to FIG. 4 to provide an image sensor chip 36 for the image sensor 32 of the present invention. The image sensor chip 36 is located on the upper surface 63 of the plate 62 and is located in the accommodation chamber 56. A plurality of wires 38 are provided, which are electrically connected to the upper surface 46 of the image-sensing metal sheet 32, so that the image-sensing wafer is on the upper-layer metal sheet 32. A light-transmitting layer 40 is provided. The light-transmitting layer 40 is a transparent glass, and the flange layer 54 of the cover is used to cover the image-sensing wafer 36. The detection wafer 36 can receive light signals through the light-transmitting layer 40. If yes, the present invention has the following advantages: 1. Since the upper and lower metal sheets 32 and 30 are formed by two flat plates and have a good flatness, it can facilitate the packaging yield of the products for wire bonding operations. 2. Because the upper and lower metal sheets 32 and 30 have a relatively high thickness, when soldering to the printed circuit board 58, the solder 60 can be climbed on the lower and upper metal sheets 32 to make the package more firmly fixed to the board. 5 8 on. 3. Since the image sensing chip 36 is disposed on the upper intermediate plate 62, the lower surface 64 of the upper intermediate plate 62 is superimposed on the lower intermediate surface 51, and the lower surface 52 of the lower intermediate plate 50 is image-sealed by the sealant. The heat emitted by the test chip 36 can be dissipated by the lower surface 5 2, and a good heat dissipation effect can be achieved. In the detailed description of the preferred embodiment, the signal transmission with the t-mounting method placed on the upper middle test wafer 36 to 36 is transmitted to the sealing gel 3 4 to make the image feel more convenient and convenient. It can improve the productivity. Therefore, the layer of metal sheet 30 is positioned on the upper surface 63 of the printed circuit, and the table 3 4 above the intermediate board 50 is exposed. Therefore, the example of the lower body of the intermediate board 50 is only 1226699. Explanation of the invention (7) It is easy to explain the technical content of the present invention, and does not limit the present invention to the embodiments in a narrow sense. Any changes made according to the spirit of the present invention and the scope of the following patent applications are within the scope of the present invention. Participate

Page 12 1226699 Brief description of drawings Figure 1 is a schematic diagram of a conventional image sensor package structure. FIG. 2 is a sectional view of a package structure of an image sensor of the present invention. FIG. 3 is a first schematic diagram of an image sensor packaging method of the present invention. FIG. 4 is a second schematic diagram of an image sensor packaging method of the present invention. Drawing number of the present invention Lower metal sheet group 3 Lower metal sheet 30 Image sensing wafer 3 6 Upper surface 42 Upper surface 46 Upper surface 51 Receiving chamber 56 Upper surface 63 Upper metal sheet group 4 Upper metal sheet 32 Multiple wires 3 8 Lower surface 44 Lower surface 48 Lower surface 52 Solder 60 Lower surface 64 Sealant 34 Light transmitting layer 40 Printed circuit board 5 8 Lower intermediate plate 5 0 Flange layer 54 Upper intermediate plate 6 2

Claims (1)

1226699 6. Scope of patent application1. An image sensor package structure for electrically connecting to a printed circuit board. The package includes: a lower metal sheet group including a plurality of lower metal sheets arranged at intervals from each other. And an equal height corresponding to the lower intermediate plate disposed between the plurality of lower metal plates, each lower metal plate is provided with an upper surface and a lower surface, and the lower intermediate plate is provided with an upper surface and a lower surface; An upper metal sheet group comprising a plurality of mutually spaced upper metal sheets and an upper intermediate plate correspondingly arranged between the plurality of upper metal sheets. Each upper metal sheet is provided with an upper surface and a lower surface. The surface, the lower surface of the upper metal sheet is correspondingly stacked on the upper surface of the lower metal sheet, the upper intermediate plate is provided with an upper surface and a lower surface, and the lower surface of the upper intermediate plate is correspondingly stacked on An upper surface of the lower intermediate plate; a colloid, which is used for covering and adhering the plurality of lower metal plates, the lower intermediate plate, the plurality of upper metal plates and an upper intermediate plate, and making each upper layer The upper surface of the metal sheet is exposed by the sealant, and the lower surface of each lower metal sheet is exposed by the sealant for electrical connection to the printed circuit board. The lower surface of the lower intermediate board and the upper intermediate board The surface is exposed by the sealant, and a flange layer is formed on the peripheral edge of the upper surface of the upper metal sheets, so as to form a containing chamber with the upper metal sheets; an image sensing chip, It is disposed on the upper surface of the upper layer intermediate plate and is located in the accommodating chamber; a plurality of wires electrically connecting the image sensing chip to the upper surface of the upper layer metal piece; and Page u 1226699 6. Scope of patent application-A light-transmitting layer is covered on the flange layer of the sealing gel to cover the image sensing chip. '2 · The image sensor package structure described in item 1 of the scope of the patent application, wherein the sealing compound is an industrial plastic material, and the flange layer is formed by the body'. 3. The image sensor enclosure structure described in item 1 of the scope of patent application, wherein the light transmitting layer is a light transmitting glass. '4 · An image sensor packaging method, including the following steps: Provide a lower layer metal sheet group, which includes a plurality of spaced-apart lower metal sheets and a first height corresponding to the plurality of lower layers. Lower layer intermediate plate, each lower layer metal sheet is provided with an upper surface, the lower layer is provided with an upper surface and a lower surface; an upper layer metal plate group is provided, which comprises a plurality of mutually spaced upper metal plates and a corresponding height arrangement An upper intermediate plate is provided between the plurality of upper metal sheets, and each upper metal sheet is provided with an upper surface and a lower surface. 'The lower surface of the upper metal sheet is correspondingly stacked on the upper surface of the lower metal sheet.' The upper intermediate plate is provided with an upper surface and a lower surface, and the lower surface of the upper intermediate plate is correspondingly stacked on the upper surface of the lower intermediate plate; a colloid is provided for the plurality of lower metal plates. , The lower intermediate plate, a plurality of upper metal plates and an upper intermediate plate are covered and adhered, and the upper surface of each upper metal plate is exposed by the sealing gel The lower surface of each lower metal sheet is exposed by the sealant, the lower surface of the lower intermediate plate and the upper surface of the upper intermediate plate are exposed by the sealant, and are formed on the peripheral edges of the upper surfaces of the upper metal sheets. Has a flange layer 1226699 VI. Patent application scope The upper metal sheet forms an accommodating chamber; an image sensing chip is provided on the upper surface of the upper intermediate plate and is located in the accommodating chamber; and a light-transmitting layer is provided. The cover is arranged on the flange layer of the sealing gel to cover the image sensing chip. 5. The method for packaging an image sensor as described in item 4 of the scope of the patent application, wherein the sealing gel and the flange layer are integrally molded using industrial plastic materials. Page 16