TWI221329B - Packaging structure of image sensor and its packaging method - Google Patents

Packaging structure of image sensor and its packaging method Download PDF

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Publication number
TWI221329B
TWI221329B TW092115472A TW92115472A TWI221329B TW I221329 B TWI221329 B TW I221329B TW 092115472 A TW092115472 A TW 092115472A TW 92115472 A TW92115472 A TW 92115472A TW I221329 B TWI221329 B TW I221329B
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Taiwan
Prior art keywords
light
substrate
layer
image sensor
sensing chip
Prior art date
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TW092115472A
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Chinese (zh)
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TW200428617A (en
Inventor
Tzung-Shian Shin
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Kingpak Tech Inc
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Priority to TW092115472A priority Critical patent/TWI221329B/en
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Publication of TWI221329B publication Critical patent/TWI221329B/en
Publication of TW200428617A publication Critical patent/TW200428617A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Solid State Image Pick-Up Elements (AREA)

Abstract

The invented packaging structure of image sensor includes the followings: a substrate; an image sensing chip disposed on the substrate; plural conducting wires for electrically connecting the image sensing chip to the substrate; and one flange layer disposed on the substrate to surround the image sensing chip; The inner edge of the flange layer is used to cover and fix the periphery of the light-transparent layer such that the image-sensing chip can receive the light signal through the light-transparent layer. Thus, the light-transparent layer is held and fixed by the flange layer and is assembled on the substrate to obtain the effect and purpose of the invention.

Description

12213291221329

由於距離小造成製造上之不 __ 案號 9211%Ig 五、發明說明（2) 感測晶片2 6與凸緣層1 8間時 便0 2·透光層34在製造或運送過程中’其周緣常有雜質易 至影像感測器内，而影響到影像感測器之品質，是以，、' 光層34在製造日夺’必須先行倒角處理，使其周緣不 ^ 質或降低碎裂，如是，造成生產成本之提高及製造上^ 便。 心不 有鑑於此’本發明人乃本於精益求精、創新突破之 神，而發明出本發明影像感測器封襄構造及其封裝方法1 使其更為實用者。 丨_Due to the short distance __ Case No. 9211% Ig V. Description of the invention (2) When the sensor wafer 2 6 and the flange layer 18 are between 0 2 and the light transmitting layer 34 during the manufacturing or transportation process' There are often impurities on its periphery that easily reach the image sensor, which affects the quality of the image sensor. Therefore, the 'light layer 34 must be chamfered before manufacturing to make the periphery inferior or lower. Fragmentation, if so, results in increased production costs and ease of manufacture. In view of this, the inventor is based on the spirit of excellence and innovation, and has invented the image sensor sealing structure of the present invention and its packaging method 1 to make it more practical.丨 _

發明内I 本發明之主要目的，在於提供一種影像感測器封裝構 造及其封裝方法，其具有便於打線之功效，以達到提高其 製程能力之目的。 本發明之另一目的，在於提供一種影像感測器封裝構 造及其封裝方法，其具有防止透光層污染及損毁之功效， 以達到便於生產之目的。 是以，為達上述之目的，本發明之主要特徵在於包括 有；一基板，其設有一上表面及一下表面’該上表面形成 _ 有複數個第一接點，該下表面設有複數個第二接點，用以 電連接至該印刷電路板上；一影像感測晶片’其係設置於 該基板之上表面上；複數條導線，係用以電連接該影像感 測晶片至該基板之上表面之第一接點上，凸緣層，其為 一框形狀，係設置於該基板之上表面’將該影像感測晶片The main purpose of the present invention is to provide an image sensor packaging structure and a packaging method thereof, which have the effect of facilitating the wiring, so as to achieve the purpose of improving its processing capability. Another object of the present invention is to provide an image sensor packaging structure and a packaging method thereof, which have the effect of preventing the light transmission layer from being contaminated and damaged, so as to achieve the purpose of facilitating production. Therefore, in order to achieve the above-mentioned object, the main feature of the present invention includes: a substrate provided with an upper surface and a lower surface; the upper surface is formed with a plurality of first contacts, and the lower surface is provided with a plurality of first contacts; A second contact is used to electrically connect to the printed circuit board; an image sensing chip is disposed on the upper surface of the substrate; a plurality of wires are used to electrically connect the image sensing chip to the substrate On the first contact on the upper surface, the flange layer has a frame shape and is arranged on the upper surface of the substrate.

1221329 五、發明說明（3) 該凸緣層内緣包覆固定住該透光層，使該影像感 二：勺：f過該透光層接收光訊號。如是’該凸緣層將透 功4: 持固定住，再組裝於基板上，可達到本發明之 功效及目的。 〜 本案得藉由以下圖式及說明，得以更深入之瞭解。 立請參閱第圖2，為本發明影像感測器封裝構造的組合 2視圖，其包括有一基板40、一影像感測晶片42、複數條 導線44、一凸緣層46及一透光層48 ·· /、 睛配合參閱圖3，為本發明影像感測器封裝構造的分 解剖視圖基板40設有一上表面52及一下表面54，上表面“ 成有複數個苐一接點5 6，下表面5 4形成有複數個第二接 點 5 8。 一 影像感測晶片42係藉由黏膠62黏著設置於基板4〇之上 表面52上。 複數條導線4 4係用以電連接影像感測晶片4 2至基板4 〇 之上表面5 2之第一接點5 6上，用以將影像感測晶片4 2之訊 號傳遞至基板4〇上。 凸緣層46為一框型狀，係設置於基板4〇之上表面52 上’將影像感測晶片4 2環繞住，凸緣層4 6内緣用以將透光 光層48周緣包覆固定住，使影像感測晶片42可透過透光層 4 8接收光訊號。 在本實施例中，凸緣層4 6係以工業塑膠材料射出成 型’並同時將透光層48固定住，而透光層48為透光玻璃。1221329 V. Description of the invention (3) The inner edge of the flange layer covers and fixes the light-transmitting layer to make the image feel 2: scoop: f receives the light signal through the light-transmitting layer. If it is, the flange layer holds the transmission 4: fixed and then assembled on the substrate, the effect and purpose of the present invention can be achieved. ~ This case can be understood more deeply with the following drawings and descriptions. Please refer to FIG. 2, which is a combined view 2 of an image sensor package structure according to the present invention, which includes a substrate 40, an image sensing chip 42, a plurality of wires 44, a flange layer 46, and a light transmitting layer 48. ··, Refer to FIG. 3, which is an anatomical view of the image sensor package structure of the present invention. The substrate 40 is provided with an upper surface 52 and a lower surface 54. The upper surface is formed with a plurality of first contacts 5 6 and the lower surface. 5 4 is formed with a plurality of second contacts 5 8. An image sensing chip 42 is adhered to the upper surface 52 of the substrate 40 by an adhesive 62. A plurality of wires 4 4 are used for electrically connecting the image sensing The first contact 56 of the wafer 42 to the upper surface 52 of the substrate 40 is used to transmit the signal of the image sensing wafer 42 to the substrate 40. The flange layer 46 has a frame shape and is It is arranged on the upper surface 52 of the substrate 40. The image sensing chip 42 is surrounded, and the inner edge of the flange layer 46 is used for covering and fixing the peripheral edge of the transparent light layer 48 so that the image sensing chip 42 can pass through. The light-transmitting layer 48 receives the light signal. In this embodiment, the flange layer 46 is injection-molded from an industrial plastic material. At the same time, the light transmitting layer 48 is fixed, and the light transmitting layer 48 is light transmitting glass.

第6頁 1221329Page 6 1221329

五、發明說明（4)V. Description of the invention (4)

凊配合參閱圖2及圖3 ’為本發明影像感測器封裝方 法，其包括下列步驟： X 提供一基板40，其設有一上表面52及一下表面54，上 表面5 2设有複數個第一接點5 6 ’下表面設有複數個第二 點 58。 一 提供一影像感測晶片42，其係設置於基板4〇之上 52上。 提供複數條導線44，係用以電連接影像感測晶片42至 基板40之上表面52之第一接點56上。 提供一凸緣層46，其為一框形狀，係設置於基板4〇之j 上表面5 2上’將影像感測晶片4 2環繞住，凸緣層4 6之内緣 用以將透光層4 8之周緣包覆固定住，使影像感測晶片4 2可 透過透光層48接收光訊號。在本實施例中，凸緣層46係以 工業塑膠材料射出成型，並同時將透光層48之周緣包覆固 定住。 如是’本發明具有如下之優點； 1 ·透光層48周緣係夾設於凸緣層46上，因此，其周緣不必 經過倒角製程，可減簡化製程，以降低生產成本。 2. 透光層48之周緣不致破損或污染，可有效提高產品之品 質。 3. 2、、、彖層4 6係於影像感測晶片4 2打線於基板4 〇上後，再行 固定於基板40上，如是，可便於打線作業之進行。 在較佳實施例之詳細說明中所提出之具體實施例僅為 :、、、了易於次明本發明之技術内容，並非將本發明狹義地限凊 Refer to FIG. 2 and FIG. 3 ′ for a method for packaging an image sensor according to the present invention, which includes the following steps: X Provide a substrate 40 having an upper surface 52 and a lower surface 54, and the upper surface 52 is provided with a plurality of first A plurality of second points 58 are provided on the lower surface of one contact 5 6 ′. -An image sensing chip 42 is provided, which is disposed on the substrate 40 52. A plurality of wires 44 are provided for electrically connecting the image sensing chip 42 to the first contact 56 on the upper surface 52 of the substrate 40. A flange layer 46 is provided, which has a frame shape and is arranged on the upper surface 5 2 of the substrate 40 to surround the image sensing chip 4 2. The inner edge of the flange layer 46 is used to transmit light. The periphery of the layer 48 is covered and fixed, so that the image sensing chip 42 can receive the light signal through the light transmitting layer 48. In this embodiment, the flange layer 46 is injection-molded from an industrial plastic material, and at the same time, the periphery of the light-transmitting layer 48 is covered and fixed. If yes, the present invention has the following advantages: 1. The peripheral edge of the light-transmitting layer 48 is sandwiched on the flange layer 46. Therefore, the peripheral edge does not need to be chamfered, and the manufacturing process can be simplified and the production cost can be reduced. 2. The periphery of the light-transmitting layer 48 will not be damaged or polluted, which can effectively improve the quality of the product. 3. The 2, 3, and 4 layers are connected to the image sensing chip 4 2 after being wired on the substrate 40, and then fixed on the substrate 40. If so, the wiring operation can be facilitated. The specific embodiments proposed in the detailed description of the preferred embodiments are only: ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, and------The technical contents of the present invention are not easy to clarify, and are not intended to limit the present invention in a narrow sense.

第7頁 1221329Page 7 1221329

第8頁 1221329 圖式簡單說明 圖1為習知影像感測器封裝構造之剖視圖。 圖2為本發明影像感測器封裝構造之組合剖視圖 圖3為本發明影像感測器封裝構造之分解剖視圖 本發明之圖號 影像感測晶片42 基板 4 0 凸緣層 46 上表面 52 第二接點5 8 透光層 下表面 48 54 複數條導線44 黏膠層 62 第一接點 56Page 8 1221329 Brief description of drawings Figure 1 is a cross-sectional view of a conventional image sensor package structure. FIG. 2 is a combined sectional view of the package structure of the image sensor of the present invention. FIG. 3 is an anatomical view of the package structure of the image sensor of the present invention. Figure No. of the image sensor chip of the present invention 42 substrate 4 0 flange layer 46 upper surface 52 second Contacts 5 8 Lower surface of the light-transmitting layer 48 54 Plural wires 44 Adhesive layer 62 First contact 56

第9頁Page 9

Claims (1)

1221329 六、申請專利範圍 1 · 一影像感測器封裝構造，係用以設置於一印刷電路板 上’其包括有 一基板’其 有複數個第/接 以電連接至該印 一影像感測 複數條導線 之上表面之第一 上 將 住一透 收光訊 2.如申 中該凸 該透光 3 ·如申 中該透 4·—種 提 形成有 用以電 提 上； 提 凸緣層， 該影像感 光層之周 號。 請專利範 緣層係以 層。 請專利範 光層為透 影像感測 供一基板 複數個第 連接至該 供一影像 。又有一上表面及一下表面，該上表面形成 …、占’该下表面形成有複數個第二接點，用 刷電路板上； 曰曰片’其係設置於該基板之上表面上； ’係用以電連接該影像感測晶片至該基板 接點上·，及 其為一框形狀，係設置於該基板之上表面 測晶片環繞住，該凸緣層内緣係包覆固定 緣’使該影像感測晶片可透過該透光層接 圍第1項所述之影像感測器封裝構造，其 工業塑膠材料射出成型，同時包覆固定住 圍第1項所述之影像感測器封裝構造，其 光玻璃。 h ^之封裝方法，其包括下列步驟： 一又有上表面及一下表面，該上表面 ”、、 σ亥下表面設有複數個第二接點， 印刷電路板上； 感測晶片，复在$ 士甘 /、係设置於该基板之上表面 供複數條 導線’係用以電連接該影像感測晶片至該1221329 VI. Scope of patent application1. An image sensor package structure is used to be disposed on a printed circuit board 'which includes a substrate' which has a plurality of first / connected electrical connections to the printed image sensor plural The first upper surface of the wire will receive a light-receiving light. 2. If the application is convex, the light-transmitting light will be transmitted. 3. If the application is transparent, the light-transmitting will be used. Week number of the image sensitive layer. Please refer to the patent normative layer. The patented optical layer is used to provide a substrate for transparent image sensing. A plurality of first layers are connected to the substrate for an image. There is also an upper surface and a lower surface, the upper surface forming ..., the lower surface is formed with a plurality of second contacts, and the circuit board is brushed; said piece 'it is arranged on the upper surface of the substrate;' It is used to electrically connect the image sensing chip to the substrate contacts, and it has a frame shape. It is arranged on the top surface of the substrate to surround the chip, and the inner edge of the flange layer covers the fixed edge. The image sensing chip can pass through the light-transmitting layer to enclose the image sensor packaging structure described in item 1. Its industrial plastic material is injection molded, and at the same time, the image sensor described in item 1 is covered and fixed. Package structure, its light glass. The packaging method of h ^ includes the following steps: a top surface and a bottom surface, the top surface ", and the bottom surface of the σ" are provided with a plurality of second contacts on a printed circuit board; $ 士 甘 /, is provided on the upper surface of the substrate for a plurality of wires' for electrically connecting the image sensing chip to the 第10頁 1221329 六、申請專利範圍 基板之上表面之第一接點上；及 提供一凸緣層，其為一框形狀，係設置於該基板之上 表面，將該影像感測晶片環繞住，該凸緣層内緣用以包覆 固定住一透光層之周緣，使該影像感測晶片可透過該透光 層接收光訊號。 5.如申請專利範圍第4項所述之影像感測器之封裝方法， 其中該凸緣層係以工業塑膠材料射出成型，同時包覆固定 住該透光層。 6 ·如申請專利範圍第4項所述之影像感測器之封裝方法， 其中該透光層為透光玻璃。Page 10 1221329 Sixth, the first contact on the upper surface of the substrate for which the patent is applied; and a flange layer is provided in a frame shape, which is arranged on the upper surface of the substrate and surrounds the image sensing chip The inner edge of the flange layer is used to cover and fix the peripheral edge of a light-transmitting layer, so that the image sensing chip can receive light signals through the light-transmitting layer. 5. The method for packaging an image sensor according to item 4 of the scope of the patent application, wherein the flange layer is injection molded from an industrial plastic material, and the light-transmitting layer is covered and fixed at the same time. 6. The method for packaging an image sensor according to item 4 of the scope of patent application, wherein the transparent layer is transparent glass. 第11頁Page 11
TW092115472A 2003-06-06 2003-06-06 Packaging structure of image sensor and its packaging method TWI221329B (en)

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TW200428617A TW200428617A (en) 2004-12-16

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