TW587344B - Injection molded image sensor structure and its manufacturing method - Google Patents

Abstract

The injection molded image sensor structure of the invention includes the followings: plural metal plates arranged mutually, in which each metal plate is provided with the first plate; an injection molded structure, in which the metal plate is wrapped through an injection molding manner to form the first molded body and the second molded body having a U shape and a recessed groove such that the first plate of these metal plates is exposed by the first molded body to form a signal input terminal and a signal output terminal; an image sensing chip, which is disposed inside the recessed groove of the injection molded structure; plural conduction wires for electrically connecting the image sensing chip to the first plate of these metal plates; and a transparent layer, which is disposed at the upper edge of the first molded body for wrapping the image sensing chip. The manufacturing method includes the followings: providing plural mutually arranged metal plates where each metal plate has the first plate; using the primary injection molding manner to wrap each metal plate to form an injection molded structure having a recessed groove such that the first plate of the metal plate is exposed by the molded body to form a signal input terminal and a signal output terminal; providing an image sensing chip that is disposed inside the recessed groove of the injection molded structure; providing plural conduction wires for electrically connecting the image sensing chip to the first plate of the metal plate; and providing a transparent layer that is disposed on the first molded body for wrapping the image sensing chip.

Description

587344 V. Description of the invention (1) The technical field of the invention μ ^ _ The present invention relates to the construction of an image sensor and its manufacturing method, and particularly to a person who forms an image sensor by injection molding. According to the prior art, a general sensor can be used to sense a signal. The signal may be an optical signal or an audio signal. The sensor in this case is used to receive an optical signal or an image signal. After receiving the optical signal, the optical signal can be converted into an electrical signal through the image sensor and transmitted to the circuit board through the substrate.

Please refer to FIG. 1. The package of the conventional image sensor includes: providing a substrate 10, and the substrate 10 is provided with a signal input terminal 18 and a signal output terminal 24 above and below the substrate 1 and a flange. The layer 12 is disposed on the substrate 10, and forms a groove 16 with the substrate 10; the image sensing wafer 14 is placed in the groove 16 formed by the substrate 10 and the flange layer 12, A plurality of solder pads 20 are formed thereon, and a plurality of wires 15 are electrically connected to the signal pads 20 of the image sensing chip 14 and the signal input terminal 18 of the substrate 10, and a light-transmitting layer 2 2 is coated in advance. A layer of adhesive 23 is laid, and then placed on the flange layer 12 to cover the image sensing chip 14 to complete the packaging of the light sensor.

The above-mentioned image sensor structure 'has the following disadvantages: 1. It must be manufactured in a single piece, and in mass production, it cannot achieve the purpose of reducing costs. 2. In the packaging process, each package must provide a substrate 10, and then a flange layer 12 is adhered. If so, it will cause inconvenience in manufacturing and increase the material cost, and the adhesive will easily cause the overflow of glue. It's like it's affecting line operations.

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In view of this, the present inventor is based on the pursuit of excellence, innovation and breakthrough, and invented the image sensor structure and manufacturing method of the injection molding of the present invention, which can facilitate mass production and effectively reduce production costs. Summary of the Invention The effect of the structure of the hair tester, the structure of the hair tester can avoid sticking to the structure of the hair tester. However, in order to achieve a mutual purpose, the method can effectively reduce the purpose of the method. When the glue overflows, the purpose of the method effectively reduces the above-mentioned array of plates; an injection molding structure is covered, shaped, and the molded body is exposed to electricity. The injection is connected to form a first into a groove, and the printed structure wire is formed by the first plate of the sheet, which is that it is produced at a low level, that is, it is caused by nothing, that is, it is formed by For low material purposes, the metal sheet provides an injection molding form for the purpose of injection molding and the gold to provide an injection molding cost. Provided is an injection molding substrate and an injection molding method. The metal sheet replaces and manufactures the cost of the present invention. The first mold forming method of the second molding body of each metal forming method forms a signal input terminal, and a brush Circuit board; inside the groove is electrically connected, the image number input image sensing chip is provided with a plurality of sensing chip ends; and a transparently formed image sensing type achieves mass production of the image sensing flange layer The image-sensing substrate is on-line. It is characterized in that it includes a metal plate with a first package of these metal plates, and a U-shaped plate from the first output signal output terminal. The plate is provided on a pad; A plurality of bonding pads to the metallic light layers, which are arranged

Page 7 587344 V. Description of the invention (3) In the first molding of the present invention sheet, the “each gold and each groove, the signal is input with a plurality of numbers for the plurality of first plates. The signal of the terminal and a wire of the pad is used to cover the image sensing chip by the upper edge of the case. The method is characterized in that: a plurality of mutually arranged metal sheets are provided with a first plate; the coating is formed by a single injection molding method to form an injection molding structure, and the first plate having one piece is exposed by the injection molding structure To form a signal output terminal; provide an image sensing chip provided thereon, which is arranged in the groove of the injection molding body; lift the electrical connection pad of the image sensing chip to the input end of the metal sheet And providing a light-transmitting layer covering the first plastic image sensing chip. The effect and purpose of the present invention can be achieved. A deeper understanding can be obtained from the following drawings and descriptions. 2. Refer to FIG. 2, which is a perspective view of the structure of the image sensor for injection molding according to the present invention. It includes: a plurality of metal pieces 30, an injection molding structure 32, an image sensing chip 34, a plurality of wires 36, and A light-transmitting layer 38. A plurality of mutually arranged metal sheets 30 are provided. Each of the metal sheets 30 is provided with a first plate 40 and a second plate 42 connected perpendicularly to the first plate 40 to form the metal plate 30 into an L shape. The injection molding structure 32 is formed by covering a plurality of metal sheets 30 in an injection molding manner to form a first molded body 44 and a second molded body 46, and has a U-shape. A second sheet 40 of a metal sheet 30 is exposed by the injection molding structure 32 and is located in the groove 48 to form a signal output.

587344 V. Description of the invention (4) The input end, and the first plate 40 is exposed from the bottom surface of the injection molding structure 3 2 to form a signal output end, and the solder 50 and the printed circuit board 52 are soldered (S Μ T) Electrical connection, and the second board 42 is exposed from the side of the first molded body 44, so that when the solder (SMT) process is performed with the printed circuit board 52, the solder 50 can go to the second board 4 2 Climbing to make the combination more stable, an intermediate plate 5 4 ° is provided above the second molded body 4 6, and a plurality of solder pads 5 6 are provided in the concave of the injection molding structure 32. Inside the slot 48 and above the intermediate plate 54. The plurality of wires 36 are used to electrically connect the solder pads 56 of the image sensing chip 34 to the signal input terminal of the first plate 40 of the metal sheet 30. The light-transmitting layer 38 is disposed on the upper edge of the first molded body 44 to cover the image-sensing wafer 34. " Please refer to FIG. 3, which is a first schematic diagram of a method for manufacturing an injection-molded image sensor according to the present invention. First, a plurality of mutually arranged metal sheets 30 are provided. Each metal sheet 30 is provided with a first plate 40 and a second plate. The plate 42 has an L-shape and is arranged around the periphery of an intermediate plate 54 to form a U-shape. Please refer to FIG. 4, which is a second schematic diagram of a method for manufacturing an injection-molded image sensor according to the present invention. A plurality of metal pieces ° 30 and an intermediate plate 54 are injection-molded by injection molding to form an injection-molded structure 32 The injection molding structure 32 has a first molded body 44 and a second molded body 46, and has a groove 4 8; and the intermediate plate 54 is located above the second molded body 46, and the metal sheet 30 An upper surface of a plate 40 is located in the groove 48 to form a signal input terminal, and a lower surface of the first plate 40 is located on the bottom surface of the first molded body 44 to form a signal output terminal, and a second plate of a plurality of metal sheets 30 42-No. 44 side of the molded body

Page 9 587344 V. Description of the invention Please match 4 6 pieces of the upper edge 3 4 of the solder 3 8 set in the house to complete the case, the solder makes the film borrow as it is made and made 1. As each (5) please refer to the middle plate pad 5 6 to the first Into an image, when 50 will be extended on the image sensing method of construction-a metal second plate 5 2 as the brush circuit 2. It is at cost. 3. Shot 4. Made of low-gold material in order to be easy to make in the real situation 4 2 formed on the solder connection plate 5 2 stable injection molding out of the molding sheet 30 taken and manufactured into a better implementation in the description of this embodiment, where Various changes. As shown in FIG. 2, the image sensing chip 34 is set on the second molded body 5 4, and a plurality of wires 36 are electrically connected to the input end of the first plate 40 of the image sensing crystal. Finally, the light-transmitting layer is formed. The upper edge of the body 44 covers the sensor package with the image sensing chip 34. The image sensor is soldered (SMT) on the printed circuit board 5 2 to climb the first board 40 of the metal sheet 30 to the second board 4 2, and the device can be more firmly combined with the printed circuit board 5 2 . According to the invention, the injection-molded image sensor structure of the present invention has the following advantages: the sheet 30 is provided with a second plate 42 connected to the first plate 40, and the side of the first molded body 44 is such that When printed circuit, solder 50 can climb to the second board 42, and can be combined with printed land. The production method can effectively reduce the production method to form a flange layer during mass production, and avoid the occurrence of adhesive overflow. Substitute substrates and the production of circuits on substrates can effectively reduce costs. The specific embodiments proposed in the detailed description of the examples are only the technical content of the invention, and are not intended to limit the invention to the spirit of the invention and the implementation of the patents and patents within the scope of the invention. 587344 Brief Description of Drawings Figure 1 is a schematic diagram of the structure of a conventional image sensor. FIG. 2 is a sectional view of the structure of the image sensor for injection molding according to the present invention. FIG. 3 is a first schematic diagram of an image sensor structure formed by injection molding according to the present invention. FIG. 4 is a second schematic diagram of the structure of the image sensor for injection molding according to the present invention.

The drawing number illustrates a plurality of metal pieces 30 injection molding structure 32 image sensor wafer 34 a plurality of wires 36 light transmitting layer 38 first plate 40 first plate 42 second _ sleeping molded body 44 second molded body 46 groove 48 solder 50 printed circuit board 52 Intermediate plate 54 Multiple welding pads 56

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Claims (1)

587344 6. Scope of patent application1. An injection-molded image sensor structure is used to be electrically connected to a printed circuit board. It includes: a plurality of metal plates arranged one on the other, and each metal plate is provided with a first A plate; an injection molding structure, which covers the metal sheets by injection molding to form a first molded body and a second molded body, which are uS-shaped, have a groove, and The first plate of the metal sheet is exposed by the injection molding structure to form a signal input terminal and a signal output terminal; an image sensing chip is disposed in a groove of the injection molding structure, and a plurality of the chip is provided thereon. Solder pads; a plurality of wires, which are used to electrically connect the solder pads of the image sensing chip to the signal input end formed by the first plates of the metal sheets; and a light-transmitting layer, which is disposed on the first The upper edge of the molded body is used for covering the image sensing chip. 2. The injection-molded image sensor structure according to item 1 of the scope of the patent application, wherein each metal piece is additionally provided with a second plate, and the second plate is vertically connected to the first plate, and the first plate is connected by the first plate. The side of the molded body is exposed. 3. The injection-molded image sensor structure described in item 1 of the scope of patent application, wherein an intermediate plate is provided above the second molded body and is exposed through the groove, and the image-sensing chip is disposed on the Middle plate. 4. The injection-molded image sensor structure described in item 1 of the scope of patent application, wherein the signal output end of the first plate of the metal sheet is electrically connected to the printed circuit board by soldering. 5. The injection-molded image sensor structure as described in item 4 of the scope of patent application Page 12 587344 6. Scope of patent application, in which the solder can climb to the second plate of the metal sheet. 6. —A method for manufacturing an image sensor structure by injection molding, which includes the following steps: providing a plurality of metal sheets arranged one on another, each of which is provided with a first plate; The metal sheet is covered to form an injection molding structure and has a groove. The first plate of the metal sheet is exposed by the first injection molding structure to form a signal input terminal and a signal output terminal. An image sensing chip is provided. There are a plurality of solder pads arranged on the groove of the injection molding body; a plurality of wires are provided to electrically connect the solder pads of the image sensing chip to the signal input end of the first plate of the metal sheet ; And providing a light-transmitting layer on the upper edge of the injection molding structure for covering the image sensing chip. 7. The method for manufacturing an injection-molded image sensor structure according to item 6 of the scope of the patent application, wherein each metal sheet is further provided with a second plate, and the second plate is vertically connected to the first plate, and The side of the injection molding structure is exposed. 8. The manufacturing method of the injection-molded image sensor structure described in item 6 of the patent, wherein an intermediate plate is provided above the second molded body, and the image sensor is disposed on the intermediate plate. Page 13