TW200411947A - Image sensor structure of injection molding and manufacturing method thereof (4) - Google Patents

Abstract

The image sensor structure of injection molding comprises plural mutually-arranged metal sheets, each metal sheet has a first plate; an injection molding structure wrapping the metal sheets by injection molding to form a first forming body and a second forming, which forms an U-shape having a groove, so as to expose the first plate of the metal sheet from the first forming body, so as to form a signal input end and a signal output end; an image sensor chip disposed inside the recess groove of the injection molding structure; plural conductive wires to electrically connect the image sensing chip to the first plate of the metal sheet; a translucent layer disposed on the upper edge of the first forming body to wrap the image sensor chip. The manufacturing method is: providing plural metal sheets arranged mutually, each metal sheet has a first plate; wrapping each metal sheet in the way of injection molding to form an injection molding structure with a recess groove, the first plate of the metal sheet is exposed from the injection molding, so as to form a signal input end and a signal output end; providing an image sensor chip disposed inside the recess groove of the injection forming body; providing plural conductive wires electrically connecting the image sensor chip to the first plate of the metal sheet; providing a translucent layer located on the first forming body, so as to wrap the image sensor chip.

Description

200411947 V. Description of the invention (1) The technical field to which the invention belongs _ The present invention relates to the construction of an image sensor and its manufacturing method, and particularly to a person who forms an image sensor by means of injection cracking. According to the prior art, a general sensor can be used to sense a signal. The signal may be an optical signal or an audio signal. The sensor in this case is used to receive an optical signal or an image signal. After receiving the optical signal, 4 converts the optical signal into an electrical signal through the image sensor, and transmits it to the circuit board through the substrate. Please refer to FIG. 1. The package of the conventional image sensor includes: providing a substrate 10, and the substrate 10 is provided with a signal input terminal 18 and a signal output terminal 24 respectively. The edge layer 12 is disposed on the substrate 10 and forms a groove 16 with the substrate 10; the image sensing wafer 14 is placed in the groove 16 formed by the substrate 10 and the flange layer 12 A plurality of pads 20 are formed on the pad, and a plurality of wires 15 are electrically connected to the pads 20 of the image sensing chip 14 and the signal input terminal 18 of the substrate 10, and a light-transmitting layer 22 is first. Apply a layer of adhesive 2 3, and then place it on the flange layer 12 to cover the image sensor chip 1 4 to complete the packaging of the light sensor. ° The image sensor structure as above has Disadvantages are as follows: 1. It must be manufactured in a single piece, and it cannot achieve the purpose of reducing costs in mass production. 0 2. In a packaged package, each package must provide a substrate 10 and a flange layer. 12. If so, it will cause inconvenience in manufacturing and increase in material cost, and the glue will easily cause the phenomenon of overflowing glue, which will affect the wire bonding operation.

f page 6 200411947 V. Description of the invention, innovation and breakthrough in precision structure and its production cost. In view of this, the present inventor is based on the pursuit of excellence, and has invented the image sensing method of the injection molding of the present invention, which can facilitate mass production and can effectively reduce

Inventive invention I The main object of the present invention is to provide an injection molding camera structure and a manufacturing method thereof, which can achieve a large number of effects by injection molding to achieve the purpose of effectively reducing production costs.

Another invention of the present invention "μ 'you π from the goods! Ke®forming of the image # The structure of the measuring device and its manufacturing method. The flange layer is formed by injection molding, which can avoid the situation where the glue cannot overflow when the glue overflows. ν θ Another object of the present invention is to provide an injection-molded image consumer structure and a manufacturing method thereof, in which a metal sheet is used to replace a substrate and a substrate on the substrate, which can effectively reduce material and manufacturing costs.

Therefore, in order to achieve the above-mentioned object, the main features of the present invention include: a plurality of mutually arranged metal sheets, each of which is provided with a first plate; an injection molding structure, which is formed by injection molding The metal sheet is covered to form a first molded body and a second molded body, and is U-shaped with a groove, and the first plates of the metal sheets are exposed from the first injection molded body, A signal input terminal and a signal output terminal are formed to be electrically connected to the printed circuit board; an image sensing chip is arranged in a groove of the injection molding structure, and a plurality of solder pads are arranged thereon ; A plurality of wires, which are used to electrically connect the pads of the image sensing chip to the signal input end formed by the first plates of the metal sheets; and a light-transmitting layer, which is provided

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V. Description of the invention (3) The upper edge of the first molded body is used for the image sensing wafer. The method of the present invention is characterized in that: a plurality of gold sheets are provided in parallel with each other. Plate; covering each of the metal pieces in a single injection molding method to form an injection molding structure with a groove; a first plate of the metal piece is exposed by the injection molding structure to form a signal input end And a signal output terminal; an image sensing chip is provided, which is provided with a plurality of sensors and is arranged in the groove of the injection molding body;

Providing a plurality of wires for electrically connecting the pads of the image sensing chip to the signal input end of the first plate of the metal sheet; and providing a light-transmitting layer on the first molded body for packaging the image sensing chip Cover it. The effect and purpose of the present invention can be achieved. μ knows the following diagrams and descriptions for a deeper understanding. Embodiment _ Please refer to FIG. 2. The image sensor structure of the injection molding of the present invention ^ view 'includes: ~ ^ Α βΛ Λ ^ output into a structure 32 a plurality of metal pieces 3 0 image sensor chip 34, A plurality of wires 36 and a light-transmitting layer 38 ι, and a plurality of mutually arranged metal sheets 30. Each of the metal sheets 30 is provided with an f: plate 40 and a second plate 42 vertically connected to the first sheet 40 to make the metal sheet. Into an L shape.

The metal sheet 30 is a plate 40 and a signal is output from the injection molding structure 32. A plurality of daggers are formed by injection molding to form a first molded body 44 and a second pear body 46 it. The groove 48, and the first and the shaped yttrium structure 32 of each metal piece 30 are exposed and located in the groove 48 to form

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The first board 40 is exposed from the bottom surface of the injection molding structure 32 to form a signal output end, and the second board 42 is electrically connected to the printed circuit board 52 by soldering (SMT). The side of a molded body 44 is exposed, so that when soldering (SMT) process with the printed circuit board 52, the solder 50 can climb to the second board 42 to make the bonding more stable. There is an intermediate plate 54. The image sensing chip 34 is provided with a plurality of solder pads 56, which are disposed in the groove 48 of the injection molding structure 32 and are located above the intermediate plate 54. The plurality of wires 36 are used to electrically connect the pads 56 of the image sensing chip 34 to the signal input terminal of the first plate 40 of the metal sheet 30. The light-transmitting layer 38 is disposed on the upper edge of the first molded body 44 to cover the image-sensing chip 34. Please refer to FIG. 3, which is a first schematic diagram of a method for manufacturing an injection-molded image sensor according to the present invention. First, a plurality of mutually arranged metal sheets 30 are provided. Each metal sheet 30 is provided with a first plate 40 and a second plate. The plate 42 is L-shaped, and is arranged around the periphery of an intermediate plate 54 to form a U-shape. Please refer to FIG. 4, which is a second schematic diagram of a method for manufacturing an injection-molded image sensor according to the present invention. A plurality of metal sheets 30 and intermediate plates 5 4 are injection-molded by injection molding to form an injection-molded structure 32. The injection molding structure 32 has a first molded body 44 and a second molded body 46, and has a groove 4 8; and the intermediate plate 54 is located above the second molded body 46, and the metal sheet 30 is the first The upper surface of the plate 40 is located in the groove 48 to form a signal input end, and the lower surface of the first plate 40 is located on the bottom surface of the first molded body 4 4 to form a signal output end, and a plurality of metal pieces 30 The second plate 4 2 is formed by the first molded body 4 4

200411947 V. Description of Invention (5) The side is exposed. Please refer to FIG. 2 'Set the image sensing chip 3 4 on the middle plate 5 4 on the upper edge of the second molded body 4 6 and electrically connect the pads 5 6 to the image sensing chip 3 4 with a plurality of wires 3 6. The signal input terminal of the first board 40; finally, the light-transmitting layer 38 is disposed on the upper edge of the first molded body 44 and the image sensing chip 34 is covered to complete the packaging of the image sensor. If so, when the image sensor is soldered (SMT) on the printed circuit board 52, the solder 50 will climb along the first plate 40 of the metal sheet 30 and climb to the second plate 42, so that the image sensor can be used. Bonds more firmly to the printed circuit board 52. With the above combination of structures, the injection-molded image sensor structure and manufacturing method of the present invention have the following advantages: 1. Since each metal piece 30 is provided with a second plate 42 connected to the first plate 40, and The first board 4 2 is formed on the side of the first molded body 4 4 so that when it is soldered to the printed circuit board 52, the solder 50 can climb up to the second board 42 and can be connected to the printed circuit board 5 2 Firmly combined. 2. It is made by injection molding, which can effectively reduce production costs during mass production. 3. The flange layer is formed by injection molding, which can avoid the overflow of adhesive. 4. Substituting the metal sheet 30 for the substrate and the wiring on the substrate can effectively reduce material and manufacturing costs. Conditions The specific embodiments proposed in the detailed description of the preferred embodiments are only for easy explanation of the technical content of the present invention, and are not limited to the embodiments in a narrow sense. In the spirit of the present invention and the scope of the following patent applications, The various changes made are within the scope of the present invention.

Page 10 200411947 Brief description of the drawings Figure 1 is a schematic diagram of the structure of a conventional image sensor. FIG. 2 is a sectional view of the structure of the image sensor for injection molding according to the present invention. FIG. 3 is a first schematic diagram of the structure of the image sensor of the injection molding of the present invention. FIG. 4 is a second schematic diagram of the structure of the image sensor of the injection molding of the present invention. 30 Injection molding structure 32 34 Multiple wires 36 38 First board 40 42 First molded body 44 46 Groove 48 50 Printed circuit board 52 54 Multiple pads 56

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Claims (1)

1. An injection-molded image-sensing circuit board, comprising: a plurality of gold plates arranged one upon the other; 200411947 The structure of the measuring device is used for electrically connecting to a printing metal sheet, and each metal sheet is provided with a first covering T: opening a ί-shaped structure. The metal pieces are packaged by injection molding. The first-molded body and the second-molded body, and the -U-shaped sowing two-groove groove, " 0 " enables the first-plate of these metal sheets to be formed by the injection molding, and to form a signal input Terminal and a signal output terminal; an image sensing chip, which is arranged in the groove of the injection molding structure, and is provided with a plurality of solder pads; and a plurality of wires, which are used to electrically connect the image sensing The signal input end formed by the solder pads of the wafer to the first plates of the metal sheets; and the light-transmitting layer 'is disposed on the upper edge of the first molded body to cover the image sensing wafer. • The injection-molded image sensor structure described in item 1 of the scope of the patent application, wherein each metal sheet is provided with a second plate, and the second plate is vertically connected to the first plate and is formed by the first Body side is exposed. 3. The injection-molded image sensor structure according to item 1 of the scope of the patent application, wherein an intermediate plate is provided above the second molded body and exposed through the groove, and the image-sensing chip is disposed on the Middle plate. 4. The injection-molded image sensor structure described in item 1 of the scope of the patent application, wherein the signal output end of the first board of the metal sheet is electrically connected to the printed circuit board by soldering. 5 · Injection-molded image sensor structure as described in item 4 of the scope of patent application 200411947 VI. Application scope of patent ~~ ---- Fabrication, where the solder can climb to the second plate of the metal sheet. · 6 · —A kind of manufacturing method of injection-molded image sensor structure, the steps are listed as follows: 1. Provide a plurality of metal plates arranged one on the other, each & the first plate; / Shu Yuehan once or twice The injection molding method covers each metal sheet to form an injection molding structure with a groove. The first plate of the metal sheet is exposed by the first injection molding structure to form a signal input terminal and a signal output terminal. ; Provide an image sensing chip, which is provided with a plurality of solder pads, which are arranged in the groove of the injection molding body; provide a plurality of wires to electrically connect the solder pads of the image sensing chip to the metal sheet A signal input end of the first board; and a light-transmitting layer provided on an upper edge of the injection molding structure for covering the image sensing chip. 7. The manufacturing method of the injection-molded image sensor structure according to item 6 of the scope of the patent application, wherein each metal piece is further provided with a second plate, and the second plate is vertically connected to the first plate, and The side of the injection molding structure is exposed. 8. The method for manufacturing an image sensor structure for injection molding as described in item 6 of the patent scope, wherein an intermediate plate is provided above the second molded body, and the image sensor is disposed on the intermediate plate. Page 13