JP2004228307A - Injection molding image sensor and its producing process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an injection molding image sensor and its producing process. <P>SOLUTION: The injection molding image sensor comprises a plurality of metal pieces each having a first plate, a second plate and a third plate presenting U-shape and being arranged mutually, an injection molding structure for forming a groove by covering these metal pieces, forming a signal input end by exposing the first plate of these metal pieces from the upper end, forming a signal output end by exposing the second plate from the bottom face, and exposing the third plate from the side, an image sensing chip arranged in the recess of the injection molding structure and provided with a plurality of bonding pads thereon, a plurality of wires for connecting the image sensing chip electrically with the first plate of these metal pieces, and a translucent layer provided at the upper edge of the injection molding structure to cover the image sensing chip. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an image sensor and a method of manufacturing the same, and more particularly, to an image sensor formed using injection molding and a method of manufacturing the same.
[0002]
[Prior art]
Generally, a sensor is used to detect a signal, and this signal can be an optical signal or an audio signal. The sensor of the present invention is used to receive a light signal or an image signal. After receiving the optical signal, the image sensor converts the optical signal into an electric signal and transmits the electric signal to the circuit board by the substrate.
[0003]
As shown in FIG. 1, according to a well-known image sensor packaging method, a substrate 10 is provided, and a signal input end 18 and a signal output end 24 are formed on an upper surface 11 and a lower surface 13 of the substrate 10, respectively. The layer 12 is provided on the substrate 10, and the groove 16 is formed together with the substrate 10. The image sensing chip 14 is placed in the groove 16 formed by the substrate 10 and the flange layer 12, and a plurality of bonding pads 20 are formed thereon. The signal input terminal 18 of the substrate 10 is electrically connected, an adhesive 23 is applied to the light transmitting layer 22 first, and is further adhered on the flange layer 12 to cover the image sensing chip 14, and thus the image sensor is mounted. Complete the package.
[0004]
The structure of the above-described image sensor has the following disadvantages.
1. It is necessary to manufacture them one by one, and the purpose of reducing the manufacturing cost during mass production cannot be achieved.
2. During the packaging process, it is necessary to provide the substrate 10 for each one of the package bodies, and to further bond the flange layer 12, thereby creating manufacturing inconvenience and increased material cost, and a winning adhesive is required. An overflow phenomenon is easily formed, which affects the wire bonding operation.
[0005]
[Problems to be solved by the invention]
A main object of the present invention is to provide a kind of injection-molded image sensor and a method of manufacturing the same, to achieve mass production effects by an injection molding method, and to effectively reduce production costs.
[0006]
Another object of the present invention is to provide a kind of injection-molded image sensor and a method of manufacturing the same, which can form a flange layer by an injection-molding method and prevent a situation where wire bonding cannot be performed when an adhesive overflows. Is to do so.
[0007]
Still another object of the present invention is to provide a kind of injection-molded image sensor and a method of manufacturing the same, which effectively reduces material and manufacturing cost by using a metal piece instead of the conventional manufacturing of a substrate and a circuit on the substrate. It is in.
[0008]
[Means for Solving the Problems]
The invention according to claim 1 is an injection-molded image sensor electrically connected to a printed board,
A plurality of metal pieces, each metal piece having a first plate, a second plate, and a third plate, having a U-shape, and being arranged with each other;
An injection molding structure is used to cover these metal pieces by an injection molding method to form a first molded body and a second molded body. The first molded body has a concave shape and a concave groove. The first board is exposed from the upper end to form a signal input end, the second board is exposed from the bottom of the first body to form a signal output end, and is soldered to the printed circuit board. The injection molding structure exposed from the side surface of the first molded body,
An image sensing chip installed in the concave groove of the injection molding structure and provided with a plurality of bonding pads on the upper surface,
A plurality of conductors for electrically connecting bonding pads of the image sensing chip to signal input terminals formed by the first plate of the metal pieces;
A light-transmitting layer disposed on an upper edge of the first molded body and covering the image sensing chip;
An injection-molded image sensor characterized by having the following.
According to a second aspect of the present invention, in the image sensor for injection molding according to the first aspect, an intermediate plate is separately provided above the second molded body, and the image sensing chip is provided on the intermediate plate. The image sensor is an injection-molded image sensor.
The invention according to claim 3 is a method for manufacturing an image sensor for injection molding,
Providing a metal piece having a first plate, a second plate, and a third plate, each of which has a U-shape and has a plurality of mutually arranged;
A first injection molding for covering each metal piece to form a first molded body, and exposing a first plate of the metal piece from an upper surface of the first molded body to form a signal input end; Exposing from the bottom surface of the first molded body to form a signal output end, and exposing the third plate from the side surface of the first molded body;
Providing a connecting plate;
Installing the four first molded bodies on four sides of the connecting plate to form a concave shape;
In a second injection molding, an intermediate plate having four first molded bodies is injection molded to form a second molded body, and the second molded body is combined with the four first molded bodies to form the second molded body. (2) a step of providing the molded body with a concave groove;
Placing an image sensing chip having a plurality of bonding pads on an upper surface in a groove formed by the first molded body and the second molded body;
Electrically connecting the bonding pad of the image sensing chip to the signal input end of the first plate of the metal piece with a plurality of conductors;
Providing a light-transmitting layer, disposing the light-transmitting layer on the upper edge of the four first molded bodies to cover an image sensing chip;
And a method for manufacturing an injection-molded image sensor.
According to a fourth aspect of the present invention, in the method for manufacturing an injection-molded image sensor according to the third aspect, an intermediate plate is provided on the connecting plate, the intermediate plate is exposed from the second molded body, and the second molded body is exposed. And mounting an image sensing chip on the intermediate plate.
According to a fifth aspect of the present invention, in the method for manufacturing an injection-molded image sensor according to the third aspect, a first locking portion is provided on the first molded body, and a second locking portion is provided on the connecting plate. A method for manufacturing an injection-molded image sensor, characterized by engaging and fixing with a first locking portion of a body.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
An injection-molded image sensor according to the present invention has a first plate, a second plate, and a third plate, each of which has a U-shape and is arranged with a plurality of metal pieces. A groove is formed, a first plate of these metal pieces is exposed from the upper end to form a signal input end, a second end is exposed from the bottom surface to form a signal output end, and a third end is formed from a side. An exposed injection-molded structure, an image sensing chip provided in the groove of the injection-molded structure and having a plurality of bonding pads provided thereon, and the image sensing chip mounted on the first plate of these metal pieces. It comprises a plurality of conducting wires electrically connected to each other and a light transmitting layer disposed on an upper edge of the injection molding structure and covering the image sensing chip.
[0010]
According to the manufacturing method of the present invention, the first plate, the second plate, and the third plate are provided, each of which has a U-shape and is provided with a plurality of metal pieces that are arranged in a row. Covering each metal piece by molding to form a first molded body, and exposing a first plate of the metal piece from an upper surface of the first molded body, and exposing a second plate from a bottom surface of the first molded body; The third plate is exposed from the side surface of the first molded body, one connecting plate is provided, and the four first molded bodies are installed on four sides of the connecting plate to form a concave shape, and the second injection molding is performed. Injection molding the intermediate plate provided with the four first molded bodies to form a second molded body having a concave groove, whereby the second molded body is combined with the four first molded bodies, It is provided with a concave groove, an image sensing chip is installed in the concave groove, and the image sensing chip is electrically connected with a plurality of conductive wires. Is connected to the first plate of the genus pieces, to coat the image sensing chips the transparent layer is positioned the upper edge of the first molded body said four.
[0011]
【Example】
FIG. 2 is a sectional view of the structure of the injection-molded image sensor of the present invention. It comprises a plurality of metal pieces 30, an injection molded structure 32, an image sensing chip 34, a plurality of conducting wires 36 and a light transmitting layer 38.
[0012]
The plurality of mutually arranged metal pieces 30 each include a first plate 40, a second plate 42, and a third plate 44, and the third plate 44 connects the first plate 40 and the second plate 42. Connect.
[0013]
The injection molding structure 32 is formed to cover the plurality of metal pieces 30 by injection molding, and comprises a first molding 50 and a second molding 52, which have a concave shape, have a groove 54, and The first plate 40 of the metal piece 30 is exposed from the upper surface of the first molded body 50 to form a signal input end, and the second plate 42 is exposed from the bottom surface of the first molded body 50 to form a signal output end, The third plate 44 is exposed from the side surface of the first molded body 50 by surface mounting (SMT) on the printed circuit board 51 with the solder 53, and is electrically connected to the printed circuit board 51 during the surface mounting (SMT) process with the printed circuit board 51. 53 rises toward the third plate 44 to further strengthen the connection, and an intermediate plate 49 is provided above the second molded body 52.
[0014]
The image sensing chip 34 is provided with a plurality of bonding pads 56, which are installed in the grooves 54 of the injection molding structure 32 and adhered on the intermediate plate 49.
[0015]
A plurality of conductive wires 36 are used to electrically connect the bonding pads 56 of the image sensing chip 34 to the signal input terminals formed by the first plate 40 of the metal piece 30. An adhesive layer 55 is applied to a connection position between the plurality of conductors 36 and the first plate 40 to protect the plurality of conductors 36.
[0016]
The light transmitting layer 38 is provided on the first molded body 50 and covers the image sensing chip 34.
[0017]
As shown in FIGS. 3 and 2, according to the method for manufacturing an injection-molded image sensor of the present invention, first, a plurality of metal pieces 30 are provided. Each metal piece 30 has a first plate 40, a second plate 42, and a third plate 44, and has a U-shape. Subsequently, each metal piece 30 is covered by primary injection molding to form a first molded body 50, and a first locking portion 58 (protruding point) is formed on an edge of the first molded body 50. The first plate 40 of each metal piece 30 is exposed from the first molded body 50 to form a signal input end, and the second plate 42 is exposed from the first molded body 50 to form a first signal output end. Then, the third plate 44 electrically connected to the first plate 40 and the second plate 42 is exposed from the side surface of the first molded body 50.
[0018]
Subsequently, as shown in FIG. 4, a connecting plate 48 is provided. The connecting plate 48 has a second locking portion 60 (made as a concave hole) formed at a position corresponding to the first locking portion 58 of the first molded body 50, and is engaged with the first molded body 50. And an intermediate plate 49 is provided on the connecting plate 48.
[0019]
As shown in FIG. 5, four first molded bodies 50 are installed on the four circumferences of the connecting plate 48 to form a concave shape.
[0020]
As shown in FIG. 2, the connecting plate 48 provided with the four first molded bodies 50 is injection-molded by secondary injection molding to form a second molded body 52, and the second molded body 52 and the four molded bodies 52 are formed. The two first molded bodies 50 are connected to each other to form the concave groove 54, and the intermediate plate 49 of the connecting plate 48 is exposed from the second molded body 52, and is positioned above the second molded body 52.
[0021]
An image sensing chip is provided. A plurality of bonding pads 56 are provided on the image sensing chip 34, and the image sensing chip 34 is installed in the groove 54 formed by the injection molding structure 32 and adheres on the intermediate plate 49.
[0022]
A plurality of wires 36 are provided, and the bonding wires 56 of the image sensing chip 34 are electrically connected to the first plate 40 of each metal piece 30 by the wires 36 so that signals of the image sensing chip 34 can be transmitted to the metal piece 30. To
[0023]
An adhesive layer 55 is applied and formed at the connection position between the plurality of conductors 36 and the first plate 40 to protect the plurality of conductors 36.
[0024]
The light-transmitting layer 38 is provided above the four first molded bodies 50, and is bonded and fixed to the first molded bodies 50 by the adhesive layer 55 to cover the image sensing chip 34.
[0025]
Thus, when the image sensor is surface-mounted on the printed circuit board 51, the solder 53 protrudes along the second plate 42 of the metal piece 30 toward the third plate 44, thereby firmly mounting the image sensor on the printed circuit board 51. 51.
[0026]
【The invention's effect】
With the above structure, the injection-molded image sensor and the method of manufacturing the same according to the present invention have the following advantages.
1. Each metal piece 30 is provided with a third plate 44 connecting the first plate 40 and the second plate 42, and the third plate 44 is formed on a side surface of the first molded body 50. The solder 53 protrudes toward the third plate 44 and can be firmly connected to the printed board.
2. Manufactured by the injection molding method, the production cost can be effectively reduced during mass production.
3. The flange layer is formed by the injection molding method, and the adhesive does not overflow.
4. The metal pieces 30 are employed instead of the conventional substrate and circuit manufacturing on the substrate, which can effectively reduce material and manufacturing cost.
[0027]
The above is a description of a preferred embodiment, which does not limit the scope of the present invention, and any modification or alteration of details that can be made based on the present invention shall fall within the scope of the present invention.
[Brief description of the drawings]
FIG. 1 is a display diagram of a known image sensor structure.
FIG. 2 is a sectional view of an injection-molded image sensor of the present invention.
FIG. 3 is a first display diagram of the structure of the injection-molded image sensor of the present invention.
FIG. 4 is a first display diagram of the structure of the injection-molded image sensor of the present invention.
FIG. 5 is a first display diagram of the structure of the injection-molded image sensor of the present invention.
[Explanation of symbols]
REFERENCE SIGNS LIST 30 metal piece 32 injection molding structure 34 image sensing chip 36 conducting wire 38 light transmitting layer 40 first plate 42 second plate 44 third plate 48 connecting plate 49 intermediate plate 50 first molded body 52 second molded body 54 groove 56 bonding Pad 55 Adhesive layer 58 First locking part 60 Second locking part

Claims (5)

In an injection-molded image sensor electrically connected to a printed circuit board,
A plurality of metal pieces, each metal piece having a first plate, a second plate, and a third plate, having a U-shape, and being arranged with each other;
An injection molding structure is used to cover these metal pieces by an injection molding method to form a first molded body and a second molded body. The first molded body has a concave shape and a concave groove. The first board is exposed from the upper end to form a signal input end, the second board is exposed from the bottom of the first body to form a signal output end, and is soldered to the printed circuit board. The injection molding structure exposed from the side surface of the first molded body,
An image sensing chip installed in the concave groove of the injection molding structure and provided with a plurality of bonding pads on the upper surface,
A plurality of conductors for electrically connecting bonding pads of the image sensing chip to signal input terminals formed by the first plate of the metal pieces;
A light-transmitting layer disposed on an upper edge of the first molded body and covering the image sensing chip;
An injection-molded image sensor, comprising: 2. The image sensor according to claim 1, wherein an intermediate plate is separately provided above the second molded body, and an image sensing chip is provided on the intermediate plate. Sensor. In a method of manufacturing an injection-molded image sensor,
Providing a metal piece having a first plate, a second plate, and a third plate, each of which has a U-shape and has a plurality of mutually arranged;
A first injection molding for covering each metal piece to form a first molded body, and exposing a first plate of the metal piece from an upper surface of the first molded body to form a signal input end; Exposing from the bottom surface of the first molded body to form a signal output end, and exposing the third plate from the side surface of the first molded body;
Providing a connecting plate;
Installing the four first molded bodies on four sides of the connecting plate to form a concave shape;
In a second injection molding, an intermediate plate having four first molded bodies is injection molded to form a second molded body, and the second molded body is combined with the four first molded bodies to form the second molded body. (2) a step of providing the molded body with a concave groove;
Placing an image sensing chip having a plurality of bonding pads on an upper surface in a groove formed by the first molded body and the second molded body;
Electrically connecting the bonding pad of the image sensing chip to the signal input end of the first plate of the metal piece with a plurality of conductors;
Providing a light-transmitting layer, disposing the light-transmitting layer on the upper edge of the four first molded bodies to cover an image sensing chip;
A method for manufacturing an injection-molded image sensor, comprising: 4. The method according to claim 3, further comprising: providing an intermediate plate on the connecting plate, exposing the intermediate plate from the second molded body, and positioning the intermediate plate above the second molded body. A method for manufacturing an injection-molded image sensor, comprising: mounting a sensing chip on the intermediate plate. 4. The method according to claim 3, wherein the first molded body is provided with a first locking portion, and the connecting plate is provided with a second locking portion. And a method of manufacturing an injection-molded image sensor.

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