1225310 五、發明說明（l) 發明所屬之技術41^ 本發明係有關於為一種影像感测器構造及其製造方 法’特別係指一種利用射出成型方式形成影像感測器者。 先前技術^ 按，一般感測器可用來感測一訊號，該訊號可能為一光 訊號，或一聲音訊號，本案之感測器係用來接收一光訊號 或一影像訊號。當接收該光訊號後，可透過該影像感測器 將光訊號轉變成一電訊號，藉由基板傳遞至電路板上。 請參閱圖1，習用之影像感測器之封裝包括有：提供基 板10，基板10之上、下表面11、13分別形成有訊號輸入端 18及訊號輸出端24，一凸緣層12係設於基板1〇上，而與基 板1 0形成一凹槽1 6 ; —影像感測晶片14放置於基板1 〇與凸緣 層12所形成之凹槽16内，其上形成有複數個焊墊2〇，複數 條導線1 5係電連接影像感測晶片1 4之焊墊2 〇與基板1 〇之％ 號輸入端18，一透光層22係先行塗佈一層黏膠23，再黏著 置放於凸緣層1 2上，將影像感測晶片1 4包覆住，即完成光 感測器的封裝。 ^ 如上之影像感測器構造，其具有如下之缺點： 1 ·其必需單顆製造，在大量生產時，無法達到降低成本之 目的。 一 2·在封裝過程中，每一顆封裝體皆須提供一基板1〇， 著一凸緣層12，如是’將造成製造上之不便及材料成$ 提高，且黏膠易造成溢膠之現像，而影響到打線作業1225310 V. Description of the invention (l) The technology to which the invention belongs 41 ^ The present invention relates to the construction of an image sensor and its manufacturing method ', particularly to a person who uses an injection molding method to form an image sensor. Prior art ^ Press, a general sensor can be used to sense a signal, which may be a light signal or a sound signal. The sensor in this case is used to receive a light signal or an image signal. After receiving the optical signal, the optical signal can be converted into an electrical signal through the image sensor and transmitted to the circuit board through the substrate. Please refer to FIG. 1. A conventional image sensor package includes a substrate 10, and a signal input terminal 18 and a signal output terminal 24 are formed on the upper and lower surfaces 11, 13 of the substrate 10, respectively. A flange layer 12 is provided. A groove 16 is formed on the substrate 10 and the substrate 10; the image sensing wafer 14 is placed in the groove 16 formed by the substrate 10 and the flange layer 12, and a plurality of solder pads are formed thereon 20, a plurality of wires 15 are electrically connected to the pad 2 of the image sensing chip 14 and the% input terminal 18 of the substrate 10, and a light-transmitting layer 22 is firstly coated with a layer of adhesive 23, and then adhered. Put on the flange layer 12 and cover the image sensing chip 14 to complete the packaging of the light sensor. ^ The image sensor structure described above has the following disadvantages: 1) It must be manufactured in a single piece, and in mass production, it cannot achieve the purpose of reducing costs. 1 · During the packaging process, each package must provide a substrate 10 and a flange layer 12, if it 'will cause manufacturing inconvenience and increase material costs, and the adhesive is liable to cause overflow. Appearance, which affects line operations
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有鑑於此，个赞明人乃本於精益不精、 神 方 、:而t明出本發明射出成型之影像感測器 法，其可便於大量4姦Η^Γ女攸，再乂及其製造 法’其可便於大量生產且可有效地降低生 内容 本發明之主要目的，在於提供一 =構造及其製造方法’其以射出成型 之效果，以達到有效降低生產成本之目的。丨大里生產 本發明之另一目的，在於提供一種射出 =器構造及其製造方法’其以射出成型方 =感 可避免黏膠產生溢膠時造成無法打線之情形。成凸緣層， 本發明之又一目的，在於提供一 測器構造及其製造方法，其以金屬你 i之影像感 路之製作，可有效地降低材料及製造成本：反及基板上線 是以，為達上述之目的，本發明 相互排列之金屬片，該每一包: 構一Ϊ及：ΐ二板’而成為一〔字形狀；-射出成型結 係以射出成型方式將該等金屬片包覆住，以形成一凹 覆住且$該Γ金屬片之第一板一部份被該射出成型結構包 ίϊ:::，份由該射出成型結構露出，以形成-訊號輸 屮迪反由該射出成型結構底面露出以形成—訊號輸 二二板由該第一成型結構侧邊露出；一影像感測晶 ^ ’其係設置於該射*成型結構之凹槽内，而其上設有複 數個焊墊；複數條導線，其係用以電連接該影像感測晶片 1225310 五、發明說明（3) 之焊墊至該等金屬片之第一板之訊號輸入端上；及一透光 層’其係設置於該射出成型結構上端，用以將該影像感測 晶片包覆住。 本發明之方法特徵，在於提供有複數個相互排列之金 屬片’該每一金屬片設有一第一板、第二板及第三板，以 形成一 C字形狀；以第一次射出成型將該每一金屬片包覆 而形成一第一成型體，並使該金屬片之第一板之一部 份被，第一成型體包覆住，另一部份由該第一成型體露 出’提供一連接板；將四個該第一成型體設置於該連接板 之四周’以第二次射出成型將設有四個第一成型體之該連 接板射出成型，以形成一第二成型體，使該第二成型體與 個第一成型體結合，使其具有一凹槽；提供一影像感 1曰曰片’其上設有複數個焊墊，而其係設置於該凹槽内； 提供複數條導線電連接該影像感測晶片之焊墊至該金屬片 j第γ板之訊號輸出端上；及提供一透光層位於該四個第 一成型，上緣，用以將該影像感測晶片包覆住。 如疋’即可達到本發明之功效及目的。 本案得藉由以下圖式及說明，得以更深入之瞭解。 實施方< 清參閱第圖2 ’為本發明射出成型之影像感測器構造的 剖視圖，装4 t + 32、一步、匕栝有一複數個金屬片30、一射出成型結構 、衫像感測晶片34、複數條導線36及一透光層38。 複數個相互排列之金屬片30，該每一金屬片30設有第In view of this, a praising person is based on lean and ingenious, and the formula of the image sensor of the present invention, which can facilitate a large number of women, and then the manufacturing The method can facilitate mass production and can effectively reduce raw materials. The main purpose of the present invention is to provide a structure and a manufacturing method of the method, which has the effect of injection molding to achieve the purpose of effectively reducing production costs.丨 Dali Production Another object of the present invention is to provide an injection device structure and a method for manufacturing the same. The injection molding method can be used to avoid the situation that the glue cannot be threaded when the glue overflows. To form a flange layer, another object of the present invention is to provide a detector structure and a manufacturing method thereof, which are made of a metal image sensing circuit, which can effectively reduce material and manufacturing costs: In order to achieve the above-mentioned object, the present invention arranges the metal sheets mutually. Each of the packs: constructs a sheet and: a sheet of two sheets to form a shape of "["; injection molding tie the metal sheets by injection molding. It is covered to form a concave covering and a part of the first plate of the Γ metal sheet is covered by the injection molding structure. The part is exposed by the injection molding structure to form a -signal input signal. The bottom surface of the injection molding structure is exposed to form—the signal input two and two plates are exposed from the side of the first molding structure; an image sensing crystal is provided in the groove of the injection molding structure, and the upper surface is provided with There are a plurality of solder pads; a plurality of wires, which are used to electrically connect the image sensing chip 1225310 V. The solder pads of the invention description (3) to the signal input end of the first board of these metal sheets; and a transparent Light layer 'is set on the upper end of the injection molding structure The image sensor chip for covering live. The method of the present invention is characterized by providing a plurality of metal sheets arranged in a row with each other. Each metal sheet is provided with a first plate, a second plate, and a third plate to form a C-shape; Each metal sheet is covered to form a first molded body, and a part of the first plate of the metal sheet is covered by the first molded body, and the other part is exposed by the first molded body ' Provide a connecting plate; place four of the first molded bodies around the connecting plate 'and injection-mold the connecting plate provided with the four first molded bodies to form a second molded body in a second injection molding To combine the second molded body with the first molded body so that it has a groove; to provide an image-like film; a plurality of pads are provided thereon, and they are arranged in the groove; Providing a plurality of wires to electrically connect the pads of the image sensing chip to the signal output end of the metal plate j and the γ plate; and providing a light-transmitting layer on the four first shapes and upper edges for the image The sensing chip is covered. For example, the effect and purpose of the present invention can be achieved. This case can be understood more deeply by the following drawings and descriptions. Embodiment < Refer to FIG. 2 ′ for a cross-sectional view of the structure of the image sensor of the injection molding of the present invention. It is equipped with 4 t + 32, one step, a plurality of metal pieces 30, an injection molding structure, and shirt image sensing. The chip 34, a plurality of wires 36 and a light-transmitting layer 38. A plurality of mutually arranged metal sheets 30, each of which is provided with a first
1225310 __m 91134555 年 ~7 --—^ __修正 五、發明說明（5) (為一凸點）^而每一金屬 成型體50包覆住，另一部份 訊號輸入端，及第二板4 2由 成一訊號輸出端。而第三板 4 2，並由第一成型體5 0侧面 片3 0之第—板4 〇一部份被第一 由第一成型體5 〇露出，以形成 第了成型體5 0底面露出，以形 44係電連接第一板40及第二板 露出。 請配合參閱圖4，提供一連接板48，其相對於第一成 型體50之第一卡制部58位置形成有第二卡制部6〇(為一凹 孔）’用以與第一成型體5 0相互卡合，而連接板4 8設有一 中間板4 9。 請參閱圖5，將四個第一成型體5 〇設置於連接板4 8之 四周。 請配合參閱圖2，以第二次射出成螌於四個第一成型 結體5 0之一射出成型一第二成型體52，使第二成型體5 2與 該四個第一成型體5 0結合後整體形成一凹槽5 4且截面呈u 形狀，而連接板4 8之中間板4 9則由第二成型體5 2露出，並 位於第二成型體5 2上方。 提供一影像感測晶片3 4，其上設有複數個焊墊5 6，而 其係設置於射出成型結構3 2所形成之凹槽5 4内，並黏著固 定於中間板4 9上。 — 提供複數條導線36電連接影像感測晶片34之焊墊56至 每一金屬片3 0之第一板4 0之訊號輸入端上，用以使影像感 測晶片34之訊號傳遞至金屬片3〇上。 提供一透光層38，使其位於四個第一成型體50上方， 藉由黏膠層5 5與第一成型體5 〇結合固定，用以將影像感測1225310 __m 91134555 ~ 7 --- ^ __ Amendment V. Description of the invention (5) (for a bump) ^ And each metal forming body 50 is covered, another part of the signal input terminal, and the second board 4 2 by a signal output. The third plate 42 is partially exposed from the first molded body 50 by the first molded body 50 side sheet 30 and the first plate 4 0, so that the bottom of the first molded body 50 is exposed. The first plate 40 and the second plate are electrically connected in a shape of 44 series and exposed. Referring to FIG. 4, a connection plate 48 is provided, and a second locking portion 60 (which is a recessed hole) is formed at a position relative to the first locking portion 58 of the first molded body 50 to be formed with the first The bodies 50 are engaged with each other, and the connecting plate 48 is provided with a middle plate 49. Referring to FIG. 5, four first molded bodies 50 are disposed around the connecting plate 48. Please refer to FIG. 2. The second injection molding is performed on one of the four first molding structures 50, and the second molding 52 is injected to form the second molding 52 and the four first moldings 5. After being combined, a groove 54 is formed as a whole and the cross section is U-shaped, and the intermediate plate 49 of the connecting plate 48 is exposed from the second molded body 52 and is located above the second molded body 52. An image sensing wafer 3 4 is provided, on which a plurality of solder pads 5 6 are provided, which are arranged in the grooves 5 4 formed by the injection molding structure 32 and adhered and fixed on the intermediate plate 49. — Provide a plurality of wires 36 to electrically connect the solder pads 56 of the image sensing chip 34 to the signal input end of the first plate 40 of each metal sheet 30, so as to transmit the signals of the image sensing chip 34 to the metal sheet 3〇 on. A light-transmitting layer 38 is provided so as to be positioned above the four first molded bodies 50. The adhesive layer 55 and the first molded body 50 are combined and fixed for image sensing.
五、發明說明（6) 晶片34包覆住。 如 時，焊 使得該 藉 造及其 1 ·由於 三板44 與印刷 爬，而 2.其以 成本。 是，當將 錫5 3將延 影像感測 如上之構 製造方法 每一金屬 ，且第三 電路板51 可與印刷 射出成型 該影像 著金屬 器可更 造組合 ，其具 片30設 板44形 作錫烊 電路板 方式製 感測器 片30之 穩固地 ’本發 有如下 有一連 成於第 連接時 穩固地 作，在 焊接（SMT)於印刷電路板51 第一板42往第三板44攀攸， 與印刷電路板51結合。 明射出成型之影像感測器構 之優點·· 接第一板40及第二板4 2之第 一成型體5 0側面，使得其在 ’焊錫53可往第三板44攀 結合。 大量生產時可有效降低生產 •以射出成型方式形成凸緣層，可避免黏膠之溢膠產生。 4·以金屬片30取代基板及基板上線路之製作，可有效地降 低材料及製造成本。 、在較佳實施例之詳細說明中所提出之具體實施例僅為 為了易於說明本發明之技術内容，並非將本發明狹義地限 制於實施例’凡依本發明之精神及以下申請專利範圍之情 況所作種種變化實施均屬本發明之範圍。 1225310 圖式簡單說明 圖1為習知影像感測器構造的示意圖。 圖2為本發明射出成型之影像感測器構造之剖視圖。 圖3為本發明射出成型之影像感測器構造之第一示意圖。 圖4為本發明射出成型之影像感測器構造之第二示意圖。 圖5為本發明射出成型之影像感測器構造之第三示意圖。 圖號說明： 複數個金屬片3 0 射出成型結構32 影像感測晶片3 4 複數條導線 36 透光層 38 第一板 40 第二板 42 第三板 44 連接板 48 中間板 49 第一成型體 50 第二成型體 52 凹槽 54 焊錫 53 印刷電路板 51 複數個焊墊 56 第'—^制部 58 第二卡制部 605. Description of the invention (6) The wafer 34 is covered. If so, welding makes the borrowing and its 1 · due to the three plates 44 and printing crawl, and 2. it costs. Yes, when tin 5 3 is used to sense the image as described above, each metal is manufactured in the manufacturing method, and the third circuit board 51 can be formed by printing and molding. The image can be combined with a metal device. The sheet 30 has a plate 44 shape. It is used to make the sensor chip 30 made of tin-cable circuit board. The main part of the present invention is as follows. It works stably during the first connection, and it is soldered (SMT) to the printed circuit board 51 from the first board 42 to the third board 44. Panyou, combined with the printed circuit board 51. The advantages of the light-molded image sensor structure are connected to the side of the first molded body 50 of the first plate 40 and the second plate 42, so that it can be bonded to the third plate 44 at the 'solder 53'. It can effectively reduce production during mass production. • The flange layer is formed by injection molding, which can avoid the overflow of adhesive. 4. Substituting the metal sheet 30 for the substrate and the wiring on the substrate can effectively reduce material and manufacturing costs. The specific embodiments proposed in the detailed description of the preferred embodiments are only for easy explanation of the technical content of the present invention, and are not intended to limit the present invention to the embodiments in a narrow sense. Implementation of various changes made by the situation are within the scope of the present invention. 1225310 Brief description of drawings Figure 1 is a schematic diagram of a conventional image sensor structure. FIG. 2 is a sectional view of the structure of the image sensor for injection molding according to the present invention. FIG. 3 is a first schematic diagram of an image sensor structure formed by injection molding according to the present invention. FIG. 4 is a second schematic diagram of the structure of the image sensor for injection molding according to the present invention. FIG. 5 is a third schematic diagram of the structure of the image sensor for injection molding according to the present invention. Description of drawing number: A plurality of metal pieces 3 0 injection molding structure 32 image sensor wafer 3 4 a plurality of wires 36 light transmitting layer 38 first plate 40 second plate 42 third plate 44 connecting plate 48 intermediate plate 49 first molded body 50 The second molded body 52 The groove 54 The solder 53 The printed circuit board 51 The plurality of solder pads 56 The first-part 58 The second clamping part 60
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