TW587343B - Image sensor structure for injection molding and manufacturing method thereof (2) - Google Patents

Abstract

The image sensor structure for injection molding of the present invention consists of: (1) plural metal sheets arranged with respect to each other, and each metal sheet has a first, a second, and a third plate installed. These three sheets are arranged in a U shape rotated for 90 degrees clockwise; (2) an injection molding structure wrapping the metal sheet to form a recess, and the first plate of the metal sheet is exposed from the top of the injecting molding-structure to form a signal input terminal, the second plate is exposed from the bottom of the injection-molding structure to form a signal output terminal, and the third plate is exposed from the side of the injection-molding structure; (3) an image sensor chip installed in the recess of the injection-molding structure; (4) plural conduction lines electrically connecting the image sensor chip with the said first plate of the metal sheet; (5) a transparent layer installed on the top edge of the injection molding structure.

Description

JO "43 V. Description of the invention (1) The technology to which it belongs ^ The invention relates to the construction and manufacture of an image sensor. Fang Si Bie refers to a person who uses an injection molding method to form an image sensor. 丨 IAJl operation > Press, the general sensor can be used to sense a signal, the signal may be a light signal, or a sound signal. The sensor in this case is used to receive a light signal or an image signal. After receiving the light signal, The optical signal can be converted into an electrical signal through the image sensor I and transmitted to the circuit board through the substrate. Please refer to FIG. 1. A conventional image sensor package includes: a base I board 1 0, and a substrate 1 〇 The upper and lower surfaces 11 and 13 are respectively formed with a signal input terminal 18 and a signal output terminal 24. A flange layer 12 is provided on the substrate 10, and a groove 1 is formed with the base plate 10. 6; —Image sensing θ sheet 14 is placed in the groove 16 formed by the substrate 10 and the flange layer 12, a plurality of pads 20 are formed thereon, and a plurality of wires 15 are electrically connected The image sensor chip 14 has a pad 20 and a signal input terminal 18 of the substrate 10, and a light-transmitting layer 22 is first A layer of adhesive 23 is coated, and then the adhesive layer is placed on the flange layer 12 to cover the image sensor chip 14 to complete the packaging of the light sensor. The image sensor structure described above has The disadvantages are as follows: 1 · It must be manufactured in a single piece, which can not reduce the cost in mass production.! • In the packaging process, each package must provide a substrate 10, and then a flange layer is adhered. 12. If so, it will cause inconvenience in manufacturing and increase I of material cost, and the glue will easily cause the phenomenon of overflowing glue, which will affect the line operation.

Page 6 587343

In view of this, the present inventor is based on the spirit of accumulating and innovative breakthroughs in Jingxing, and invented the image sensor structure and its manufacturing method for injection molding according to the present invention, which can facilitate mass production. And can effectively reduce production costs. 'SUMMARY OF THE INVENTION The main object of the present invention is to provide an injection-molded image sensor structure and a manufacturing method thereof, which achieve the effect of mass production by injection molding to achieve the purpose of effectively reducing production costs. Another object of the present invention is to provide an injection-molded image sensor structure and a method for manufacturing the same. The flange layer is formed by injection molding, which can avoid the situation that the glue cannot be threaded when the adhesive overflows. 'Another object of the present invention is to provide an injection-molded image sensor structure and a method for manufacturing the same', which replaces the production of a substrate and a circuit on the substrate with a metal sheet, which can effectively reduce material and manufacturing costs. The main feature of the present invention is to include a plurality of metal sheets arranged one above the other, and each of the metal sheets is provided with a first plate, a second plate, and a third plate to form a square shape. ; An injection molding structure, the metal sheets are covered by injection molding to form a: slot, and the first plate of the metal sheets is exposed from the top of the injection molding structure to form a signal input end; A second plate is exposed from the bottom surface of the injection molding structure to form a signal output terminal; a third plate is exposed from the side of the first molding structure; an image sensing chip is disposed in a groove of the injection molding structure, A plurality of solder pads are provided thereon; a plurality of wires are used to electrically connect the solder pads of the image sensing chip to the first plates of the metal sheets; and 587343 5. Invention Description (3) Transparent The light layer is disposed on the upper edge of the injection molding structure, and is used for covering the image sensing chip. The method of the present invention is characterized in that a plurality of metal plates arranged one by one are provided, and each metal plate is provided with a first plate, a second plate and a third plate to form a C-shape; Each metal sheet is covered to form a first molded body, and a first plate of the metal sheet is exposed from the top surface of the first molded body, and a second plate is exposed from the bottom surface of the first molded body, and The third plate is exposed from the side of the first molded body; a connecting plate is provided; four first molded bodies are arranged around the connecting plate to form an LJ shape; four injection molding will be provided with four The middle plate of the first molded body is injection-molded to form a second molded body, and the second molded body is combined with the four first molded bodies so that it has a groove to provide an image sensing wafer. There are a plurality of solder pads, which are arranged in the groove formed by the injection molding body; a plurality of wires are provided to electrically connect the solder pads of the image sensing chip to the first plate of the metal sheet; and a transparent The light layer is located on the upper edges of the four first molded bodies. The image sensor chip coated live. If it is, the effect and purpose of the present invention can be achieved. This case can be understood more deeply by the following drawings and descriptions. For an embodiment, please refer to FIG. 2, which is a cross-sectional view of an injection-molded image sensor structure according to the present invention, which includes a plurality of metal pieces 30, an injection-molded structure 32, an image-sensing chip 3 4, a plurality of wires 36, and A light-transmitting layer 3 8: a plurality of metal sheets 30 arranged on each other, and each metal sheet 30 is provided with a first

587343 V. Description of the invention (4) Board 40, a second board 42, and a third board 44, the third board 44 is used to connect the first board 40 and the second board 42. The injection molding structure 32 is a plurality of metal sheets 30 covered with an injection molding to form a first molded body 50 and a second molded body 52, which are in a shape and have a groove 54, and The first plate 40 of each metal piece 30 is exposed from the top surface of the first molded body 50 to form a signal input terminal, and the second plate 42 is exposed from the bottom surface of the first molded body 50 to form a signal output terminal. The solder $ 3 is electrically connected to the printed circuit board 51 by soldering (SMT), and the third board 44 is exposed from the side of the first molded body 50, so that when the soldering (SMT) process is performed with the printed circuit board 51, the solder 53 can be Climb to the third plate 44 to make the combination more stable. In addition, a middle plate 49 is provided above the second molded body 52. The image sensing wafer 34 is provided with a plurality of solder pads 5 6, which are arranged in the grooves 5 4 of the injection molding structure 3 2 and adhered to the intermediate plate 49. The plurality of wires 36 are used to electrically connect the pads 56 of the image sensing chip 34 to the signal input terminal formed by the first plate 40 of the metal sheet 30. The adhesive layer 55 is applied to the positions where the plurality of wires 36 are connected to the first board 40 to protect the plurality of wires 36. The light-transmitting layer 38 is disposed on the first molded body 50 to cover the image sensing chip 34. Please refer to FIG. 3 and FIG. 2, which are first schematic diagrams of a method for manufacturing an injection-molded image sensor according to the present invention. First, a plurality of metal sheets 30 are provided, and each metal sheet 30 is provided with a first plate 40, a second plate 42 and The third plate 44 is formed into a stack shape; each metal sheet 30 is covered by the first injection molding to form a first molded body 50, and the first edge of the first molded body 50 is provided with a first Card making part 58

587343 V. Description of the invention (5) (for: bumps), and the first plate 40 of each metal piece 30 is formed by the first, and is routed out to form a signal input end, and the second plate 42 is formed by the first The body 50: exits to form a first signal output terminal, and the third plate 44 is electrically connected to the first plate and the f-two plate 42 and is exposed from the side of the first molded body 50. “Monthly distribution. Referring to FIG. 4, a connecting plate 48 is provided, and a second locking portion 60 (which is a recessed hole) is formed at a position relative to the first locking portion 58 of the first molded body 50. A molded body 50 is engaged with each other, and the connecting plate 48 is provided with an intermediate plate 49. Referring to FIG. 5, four first molded bodies 50 are disposed around the connecting plate 48 to form a u shape. Please refer to FIG. 2. In the second injection molding, the connecting plate 48 provided with four first molding bodies 50 is injection-molded to form a second molding body 52, and the second molding body 52 and the four first molding bodies 52 are formed. A molded body 50 is combined, and it has a groove 54, and the middle plate 49 of the connecting plate 48 is exposed by the second molded body 52 and is located above the second molded body 52. 4. A plurality of solder pads 5 6 are provided thereon, and they are arranged in the groove 54 formed by the injection molding structure 32 and adhered and fixed on the intermediate plate 4 9. A plurality of wires 3 6 are electrically connected to the image The pads & 6 of the sensor chip 3 4 are connected to the first plate 40 of each metal sheet 30 for transmitting the signals of the image sensor chip 34 to the metal. On the sheet 30. An adhesive layer 55 is provided and coated on the connecting positions of the plurality of wires 36 and the first board 40 to protect the plurality of wires 36. A light transmitting layer 38 is provided so as to be located on the four first Above the molded body 50,

Page 10 587343 V. Description of the invention (6) The adhesive layer 55 and the first molded body 50 are fixed together to cover the image sensing chip 34. If so, when the image sensor is soldered (SMT) on the printed circuit board 51, the solder 53 will climb the second plate 4 2 of the metal sheet 30 to the third plate 4 4 to make the image The sensor can be more firmly combined with the printed circuit board 51. With the combination of the above structures, the injection-molded image sensor structure and manufacturing method of the present invention have the following advantages.

1. Since the mother-metal sheet 30 is provided with a third plate 44 connecting the first plate 40 and the second plate 42, and the third plate 44 is formed on the side of the first molded body 50, it is connected with the printed circuit board 5 When making a solder connection, the solder 5 3 can climb to the third board 4 4 and can be firmly combined with the printed circuit board. 2. It is made by injection molding, which can effectively reduce production costs during mass production. Free from adhesive overflow. The production can effectively reduce the formation of the flange layer by injection molding, which can be avoided. 4 Replace the substrate and the circuit on the substrate with a metal sheet 30. Low material and manufacturing costs. In the detailed description of the preferred embodiment, the specifics of the sun and moon towels are provided specifically to facilitate the description of the technical content of the present invention. The present invention is not limited to the embodiments. Anyone who follows the spirit of the present invention and the following _ & τ 鸪 Patented

The implementation of various changes made by the situation are all within the scope of the present invention. ® I It

Page 11 587343 Brief description of drawings Figure 1 is a schematic diagram of a conventional image sensor structure. FIG. 2 is a sectional view of the structure of the image sensor for injection molding according to the present invention. FIG. 3 is a first schematic diagram of an image sensor structure formed by injection molding according to the present invention. FIG. 4 is a second schematic diagram of the structure of the image sensor for injection molding according to the present invention. FIG. 5 is a third schematic diagram of the structure of the image sensor for injection molding according to the present invention.

Description of drawing number • Multiple metal pieces 30 Injection molding structure 32 Image sensor wafer 34 Multiple wires 36 Light-transmitting layer 38 First — plate 40 — _ _ plate 42 Third plate 44 Connecting plate 48 Intermediate plate 49 First molded body 50 The second molded body 52 The groove 54 The solder 53 The printed circuit board 51 A plurality of hard pads 56 The adhesive layer 55 The first clamping portion 58 The second clamping portion 60

Page 12

Claims (1)

587343 6. Scope of patent application 1. An injection-molded image sensor structure 1 is used to electrically connect a printed circuit board 5 It includes a plurality of metal plates arranged one above the other. Each metal plate is provided with a first plate% -The second plate and a first _ 丨 1 slab 9 and become a 匸 shape, an injection molding structure 9 is to cover the metal sheets J by injection molding to form a first molded body and a first The two shaped bodies are U-shaped and have a groove 5 and the first plates of the metal pieces are exposed from the top of the first shaped body to form a signal input end. The second plate is formed by the bottom surface of the first shaped body. Exposed to form, 丨 — the signal output terminal 5 is used to be soldered to the printed circuit board 5 and the third board is exposed from the side of the ^ — molded body • 9-丨 _ image sensing chip 5 which is arranged at the A plurality of solder pads J and a plurality of wires 5 are provided in the grooves of the molding structure, which are used to electrically connect the solder pads of the image sensing chip to the signal formed by the first-board of the metal sheets. On the input end, and a light-transmitting layer is disposed on the upper edge of the first molded body, so as to cover the image-sensing chip 02. The image-forming effect of the injection molding as described in item 1 of the patent scope The structure of the sensor is further provided with an intermediate plate above the second molded body. The image sensor chip is set on the intermediate plate. 03. An injection-molded image sensor as described in item 1 of the patent scope Structure 5 Wherein the plurality of wires are electrically connected to the first plate of the metal sheet, an adhesive layer is coated to cover the wires 0 4. A method for manufacturing an injection-molded image sensor structure 9 Its package The column step Page 13 587343 6. The scope of the patent application provides a plurality of metal sheets arranged one by one. Each metal sheet is provided with a first plate, a second plate, and a third plate to form a zigzag shape; The metal sheet is covered to form a first molded body, and the first plate of the metal sheet is exposed from the top surface of the first molded body to form a signal input terminal and the second plate is exposed from the first molded body. To form a signal output end, and the third plate is exposed from the side of the first molded body; a connecting plate is provided by the road; four first molded bodies are arranged around the connecting plate in an LJ shape; In the second injection molding, a connection plate provided with four first molded bodies is injection molded to form a second molded body, and the second molded body is combined with the four first molded bodies to have a groove. ; Provide an image sensing chip, which is provided with a plurality of solder pads, and is not placed in the groove formed by the first injection molded body and the second injection molded body, 9 provides a plurality of wires to electrically connect the image sensor Test pad to the metal A signal input end of a first plate of the chip; and providing a light-transmitting layer on the upper edges of the four first molded bodies for covering the image sensing chip. ~ 5 · The manufacturing method of the injection-molded image sensor structure as described in item 4 of the patent scope, wherein the connecting plate is provided with an intermediate plate, and the intermediate plate is exposed by the second molded body and is located at Above the second molded body, the image sensing chip is disposed on the middle plate. Page 14 587343 6. The scope of the patent application j m ϊ = the image sensor of the injection molding as described in the second item / ί :: formed body = the first-the card-making department :; the first unit is engaged and fixed. Manufacturing department for connecting with the first molded body; ϋ 利 ϊ ί: The first card manufacturing part of the second and second molded body of the connecting plate of the image sensor structure of the injection molding described in item 6 It is a bump, and the formed part is a concave hole.口 点, [::: The method of the injection molding image described in item 4 of the scope of interest, wherein the plurality of wires are electrically connected to the W-th structure of the metal sheet to form an adhesive layer for A plurality of wires are covered. Shuttle Page 15