1267961 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種光電元件構裝結構，更特別地是_種具 有散熱結構之光電元件構裝結構。 【先前技術】 一般來說，光電元件構裝結構的散熱主要有兩個方向，一個 是由構裝上表面傳送到空氣中，另一個是藉由光電元件向下傳送 到基板，然後再由基板傳送到空氣中。然而在構裝結構中，其散 熱模式有多種方式，最常見的且最有效率的散熱方^，則是在積 體電路中安裝散熱片，其目的是為了要增加熱傳量。然而，光電 元件於驅動時，由於散熱片無法直接與晶片結合，必須要藉由中 間材料，例如黏晶材料(die epoxy)，進行連接。這時，因為散熱 片與晶片之間的材質差異性太大，熱變形程度不一，容易使得晶 片變形。而使得整個構裝結構的熱量無法移除，使得整個光電元 件構裝結構無法正常運作。 【發明内容】 黎於上述之發明背景中，傳統具有散熱片之光電元件構裝結構，在 驅動光電元件時職生餘關題，本發日露_種具有散熱結構之光電 元件構裝結構，藉以增改善習知技術中，光電元件與散熱片無法連接的問 ^也了以:¾加散熱效果，以提尚.光電元件構裝結構的散熱能力。 1267961 本發明的目的在於’藉由填入基板的鏤空結構内的膠_，將光電 元件與散㈣連接’贿善習知技射，光t轉絲㈣無法結合的問 題。 本發明的目的’將光電元件、基板以及散熱片用膠枯劑接合，用以 改善光電元件電性接地之構裝技術。 根據以上所狀目的’本發明減具有散齡狀光電元件構裝結 構，其包含:―基板’其表面佈設有金屬電路以及轉，且於基板内具有鎮 空結構’且此鏤空結構係貫穿基板的正面以及“散熱結構，位於基 板的背面，並且位於毅結構的正下方、以及_光電秘，具有一主動面 和相對應之背面，其光電元件以其背面設置於基板的正面上，且與基板電 性連接。其中’在基板的正面與光電元狀背面之間具有膠_，且膠黏 劑更延伸·在基板_鏤讀構，其中，膠黏_連接散熱結構與光電 轉，以改善習知技術中’光電元件與散熱結構無法結合之缺點。而光電 元件與基板以及散熱結構之_電性，可以藉由導線連接，樣熱結構可 以做為電性接地。，藉由基板_結構，可以將光電元件與散熱 、”。構連接可以增加散熱效果，進一步地提高構裝元件的散熱能力。 另卜根據以上所述，本發明還揭露具有散熱結構之光電元 件構裝結構之形成m包含:提供具有魅結構的基板；置放 —散熱結構於基板的背面，錄於鏤空結構的正下方；填入朦黏 1267961 劑於基板上的鏤空結構内；以及置放具有—主動面之—光電元件 於基板的正面；藉此’藉由鏤空結構内__，將光電元件與 散熱結構連接。 【實施方式】 本發明的-些實_料細描述如τ。然而，除了象細描述 夕卜本發明還可以廣泛地在其他的實施例施行，且本發明的範圍 不受限定，其以之後的專利範圍為基準。1267961 IX. Description of the Invention: [Technical Field] The present invention relates to a photovoltaic element mounting structure, and more particularly to a photovoltaic element mounting structure having a heat dissipating structure. [Prior Art] In general, the heat dissipation of the photovoltaic element structure mainly has two directions, one is transmitted from the upper surface of the structure to the air, and the other is transferred downward to the substrate by the photovoltaic element, and then the substrate Transfer to the air. However, in the structure, there are many ways to dissipate the heat mode. The most common and most efficient way to dissipate heat is to install a heat sink in the integrated circuit, in order to increase the heat transfer. However, when the photovoltaic element is driven, since the heat sink cannot be directly bonded to the wafer, it is necessary to connect by an intermediate material such as die epoxy. At this time, since the material difference between the heat sink and the wafer is too large, the degree of thermal deformation is not uniform, and the wafer is easily deformed. Therefore, the heat of the entire structure cannot be removed, so that the entire photovoltaic component structure cannot function normally. SUMMARY OF THE INVENTION In the above-mentioned invention background, the conventional photovoltaic element assembly structure having a heat sink, when driving the photoelectric element, is a post-production problem, and the present invention discloses a photovoltaic element assembly structure having a heat dissipation structure. In order to improve the conventional technology, the problem that the photoelectric element and the heat sink cannot be connected is also: 3⁄4 plus heat dissipation effect, to improve the heat dissipation capability of the photovoltaic component structure. 1267961 The object of the present invention is to solve the problem that the photoelectric element and the dispersion (four) are connected by the glue _ in the hollow structure of the substrate, and the light t-wire (four) cannot be combined. The object of the present invention is to bond a photovoltaic element, a substrate, and a heat sink with a binder to improve the electrical connection of the photovoltaic element. According to the above object, the invention has a structure structure of a photovoltaic element having a dispersion age, comprising: a substrate having a metal circuit and a surface disposed thereon, and having an air-emptive structure in the substrate, and the hollow structure is penetrated through the substrate The front side and the "heat dissipation structure, located on the back side of the substrate, and directly under the structure of the structure, and the optical surface, have an active surface and a corresponding back surface, and the photovoltaic elements are disposed on the front surface of the substrate with the back surface thereof, and The substrate is electrically connected, wherein 'there is a glue _ between the front surface of the substrate and the photoreceptor-shaped back surface, and the adhesive is more extended · in the substrate _ 镂 reading structure, wherein the adhesive _ connection heat dissipation structure and photoelectric conversion to improve In the prior art, the shortcomings of the photovoltaic element and the heat dissipation structure cannot be combined. The electrical properties of the photovoltaic element and the substrate and the heat dissipation structure can be connected by wires, and the sample thermal structure can be used as an electrical ground. , can be optoelectronic components and heat dissipation,". The connection can increase the heat dissipation effect and further improve the heat dissipation capability of the component. According to the above, the present invention also discloses that the formation of the photovoltaic element structure having the heat dissipation structure includes: providing a substrate having a charm structure; and placing the heat dissipation structure on the back surface of the substrate, directly under the hollow structure; Filling in the hollow structure of the viscous 1267971 agent on the substrate; and placing the photovoltaic element with the active surface on the front side of the substrate; thereby connecting the photovoltaic element to the heat dissipation structure by means of __ in the hollow structure. [Embodiment] The present invention is described in detail as τ. However, the present invention can be widely practiced in other embodiments, and the scope of the present invention is not limited, and it is based on the scope of the following patents.
I 由於傳統技術中，光電元件在驅動時，由於光電元件與散熱 裝置之_材質差異太大，熱變形程度不―，無法直接結合，因 此，對於光電元件所產生的散熱問題，無法解決。因此，根據習 知技術的缺點，本發明揭露具有散熱結構之光電元件構裝纟士構， 用以改善散熱問題，以提高散熱能力。 Φ 參照第一圖，係說明本發明形成具有散熱結構之光電元件構 裝結構流程圖。步驟1，提供具有鏤空結構的基板；步 ’置 放一散熱結構位於基板的背面，並且位於鏤空結構的正下方· + 驟3，填入膠黏劑於基板的鏤空結構内；步驟4，將光電元I In the conventional technology, when the photoelectric element is driven, the difference in the material between the photoelectric element and the heat dissipating device is too large, and the degree of thermal deformation is not ", and cannot be directly combined. Therefore, the heat dissipation problem caused by the photoelectric element cannot be solved. Therefore, according to the disadvantages of the prior art, the present invention discloses a photovoltaic element structure with a heat dissipating structure to improve the heat dissipation problem and to improve the heat dissipation capability. Φ Referring to the first drawing, a flow chart of forming a photovoltaic element structure having a heat dissipation structure according to the present invention will be described. Step 1. Providing a substrate having a hollow structure; stepping 'disposing a heat dissipation structure on the back surface of the substrate and located directly under the hollow structure · Step 3, filling the adhesive into the hollow structure of the substrate; Step 4, Photocell
I N'J 背面置放在基板的正面上；以及’步驟5，藉由鏤空結構内的膠 • 粘劑將光電元件與散熱結構連接。 參照第一 A圖及第· 一 B圖’係分別表示具有鎮空纟士構之烏 7 1267961 板的俯視圖。根據本發明所揭露之較佳實施例，基板ι〇在製作 時，即在基板10上製作出若干個鏤空結構12，這些鏤空結構12 係貫穿基板10的正面10A以及背面10B。這些鏤空結構12可以 是孔洞形狀12A(如第二A圖所示）或是矩形形狀12B(如第二B圖 所示），是為了在後續的步驟中，用來連接光電元件（未在圖中表 示）與散熱結構（未在圖中表示）。另外，要說明的是，這些鏤空結 構12的數量，可視使用者須要，在進行製作基板10時一併形成。 另外，基板10的正面10A設有若干基板銲墊22(如第三A圖所 示），於基板10的背面10B具有若干個外接端（pin)，用以與外界 電性溝通。 而第二C圖係表示第二A圖或是第二B圖的截面示意圖。 在第二C圖中，虛線的部份表示基板10内所具有的若干個鏤空 結構12。 參照第三A圖，係表示在基板的背面置放散熱結構之俯視 圖。在第三A圖，係將散熱結構20置放在基板10的背面10B， 並且位於若干個鏤空結構12的正下方。這是為了增加散熱效果， 藉由鏤空結構12，增加熱對流，使得由光電元件（未在圖中表示） 所產生的熱量，可以同時藉由熱對流以及熱傳導，經由鏤空結構 12傳導至散熱結構20，然後再由散熱結構20的四周移除熱量。 在此，散熱結構20與接地部份18電性耦接，使得散熱結構20 1267961 可以做為電性接地。 另外參照第三B圖，係表示散熱結構20位於具有若干個鏤 空結構12的基板10的背面10B之截面結構示意圖。在此，散熱 結構20以嵌入的方式，直接嵌入基板10的背面10B，藉此，可 以節省整個光電元件構裝結構的體積。 接著，參照第四A圖，係表示光電元件置放在基板上之俯 視圖，在第四A圖中，首先將膠黏劑30填入基板10的鏤空結構 12内，並且塗佈在整個基板10的正面10A上，使得整個基板10 的正面10A與光電元件40連接的部份都塗佈膠黏劑30。接著， 將光電元件40的背面貼附在膠黏劑30上，而其主動面則是朝上。 因此，光電元件40可以藉由鏤空結構12内的膠黏劑30與位於 基板10背面10B的散熱結構20電性連接。因此，可以確保光電 元件40與散熱結構20的連接。 接著，參考第四B圖，係揭露本發明所述之光電元件構裝結 構之較佳實施例。在本實施例中，其光電元件構裝結構包含具有 鏤空結構12之基板10,此鏤空結構12貫穿於基板10的正面10A 以及背面10B ;於鏤空結構12内填充膠黏劑30，且膠黏劑30延 伸覆蓋住位於基板10正面10A上之接地部份18; —接地部份 (grounded)18以及鋅墊(pad)22内嵌於基板10的正面10A; —導 1267961 電膠32位於膠黏劑30的上方；一光電元件40位於導電膠32上 方，其中光電元件40與膠黏劑30係藉由導電膠32黏著連接。 在此實施例中，光電元件40可以是感應晶片。另外，還包含複 數條導線34用以連接導電膠32與銲墊22之間的電性，以及連 接導電膠32經由膠黏劑30與接地部份18電性連接。 接著，請參考第四C圖，係表示本發明所揭露之具有散熱 _ 元件之光電元件構裝結構之另一較佳實施例。其光電元件構裝結 構包含具有鏤空結構12、接地部份18以及銲墊22之一基板10、 一膠粘劑30填滿於基板10的鏤空結構12内、並且延伸覆蓋至 接地部份18，一光電元件40設置於膠黏劑30的上方，以及一透 明片60，例如玻璃片，藉由黏著劑或間隔子（spacer)50，固定於 該光電元件40上，且與該光電元件40均勻地隔開。另外，位於 基板10上方，係藉由一玻璃蓋70與支撐件連接，將整個光電元 φ 件構裝結構密封。 根據以上所述，可以得知，由於膠黏劑30經由鏤空結構12 將散熱結構20以及光電元件40連接，即改善習知技術中，散熱 結構20與光電元件40無法結合的缺點。另外，由於光電元件40 藉由膠黏劑30與基板10以及散熱結構20連接，當光電元件40 在高溫下操作時，藉由位於基板10背面10B的散熱結構20，可 以減少熱阻，增加整個光電元件構裝結構的散熱效果。 1267961 以上所述僅為本發明之較佳實施例而已，並非用以限定本發 明之申請專利範圍；凡其它未脫離本發明所揭示之精神下所完成 之等效改變或修飾，均應包含在下述之申請專利範圍内。 【圖式簡單說明】 第一圖係根據本發明所揭露之技術，形成具有散熱結構之光 電元件構裝結構流程圖； 第二A圖及第二B圖係根據本發明所揭露之技術，表示具有 鏤空結構之基板之俯視圖； 第二C圖係根據本發明所揭露之技術，表示第二A圖及第二 B圖之具有鏤空結構之基板之截面示意圖； 第三A圖係根據本發明所揭露之技術，表示在基板的背面置 放散熱結構之俯視圖； 第三B圖係根據本發明所揭露之技術，表示散熱結構位於具 有鏤空結構之基板的背面之截面示意圖； 第三C圖係根據本發明所揭露之技術，表示散熱結構嵌入具 有鏤空結構之基板的背面之截面示意圖； 1267961 第四A圖係根據本發明所揭露之技術，表示在基板的正面置 放光電元件之俯視圖； .第四B圖係根據本發明所揭露之技術，係表示光電構裝結構 之截面示意圖；以及 第四C圖係根據本發明所揭露之技術，表示光電元件構裝結 構之另一較佳實施例之截面示意圖。 【主要元件符號說明】 1〜5 形成具有散熱結構之光電元件構裝結構步驟 10 基板 10A基板的正面 10B 基板的背面 12鏤空結構 12A 孔洞形狀 12B矩形形狀 18 接地部份 20散熱結構 22 銲墊 30膠黏劑 32 導電膠 34導線 40 光電元件 50間隔子 60 透明片 70玻璃蓋 12The backside of I N'J is placed on the front side of the substrate; and in step 5, the photovoltaic element is connected to the heat dissipating structure by a glue in the hollow structure. Referring to the first A map and the first B map, the top view of the Ukrainian 7 1267961 plate with the air force gentleman is shown. In accordance with a preferred embodiment of the present invention, a plurality of hollow structures 12 are formed on the substrate 10 during fabrication, and the hollow structures 12 extend through the front side 10A and the back side 10B of the substrate 10. The hollow structure 12 may be a hole shape 12A (as shown in FIG. 2A) or a rectangular shape 12B (as shown in FIG. 2B) for connecting the photovoltaic elements in a subsequent step (not shown). In the middle) and the heat dissipation structure (not shown in the figure). In addition, it is to be noted that the number of the hollow structures 12 can be formed together when the substrate 10 is formed, as needed by the user. In addition, the front surface 10A of the substrate 10 is provided with a plurality of substrate pads 22 (as shown in FIG. 3A), and the back surface 10B of the substrate 10 has a plurality of external pins for electrically communicating with the outside. The second C diagram shows a schematic cross-sectional view of the second A or the second B. In the second C-picture, the broken line portion indicates a plurality of hollow structures 12 in the substrate 10. Referring to Fig. 3A, a plan view showing a heat dissipating structure placed on the back surface of the substrate is shown. In the third A diagram, the heat dissipation structure 20 is placed on the back surface 10B of the substrate 10 and is located directly below the plurality of hollow structures 12. This is to increase the heat dissipation effect. By the hollow structure 12, the heat convection is increased, so that the heat generated by the photovoltaic element (not shown in the figure) can be simultaneously conducted to the heat dissipation structure via the hollow structure 12 by thermal convection and heat conduction. 20, and then remove heat from the periphery of the heat dissipation structure 20. Here, the heat dissipation structure 20 is electrically coupled to the ground portion 18, so that the heat dissipation structure 20 1267961 can be electrically grounded. Referring additionally to Fig. 3B, a schematic cross-sectional view of the heat dissipating structure 20 on the back surface 10B of the substrate 10 having a plurality of hollow structures 12 is shown. Here, the heat dissipation structure 20 is directly embedded in the back surface 10B of the substrate 10 in an embedded manner, whereby the volume of the entire photovoltaic element mounting structure can be saved. Next, referring to FIG. 4A, a plan view showing that the photovoltaic element is placed on the substrate is shown. In the fourth A diagram, the adhesive 30 is first filled into the hollow structure 12 of the substrate 10, and coated on the entire substrate 10. On the front surface 10A, the adhesive 30 is applied to the portion of the front surface 10A of the entire substrate 10 that is connected to the photovoltaic element 40. Next, the back surface of the photovoltaic element 40 is attached to the adhesive 30 with its active surface facing upward. Therefore, the photovoltaic element 40 can be electrically connected to the heat dissipation structure 20 on the back surface 10B of the substrate 10 by the adhesive 30 in the hollow structure 12. Therefore, the connection of the photovoltaic element 40 to the heat dissipation structure 20 can be ensured. Next, referring to Fig. 4B, a preferred embodiment of the photovoltaic element structure of the present invention is disclosed. In this embodiment, the photovoltaic device assembly structure includes a substrate 10 having a hollow structure 12 penetrating through the front surface 10A and the back surface 10B of the substrate 10; the adhesive structure 30 is filled in the hollow structure 12, and is adhesive. The agent 30 extends over the ground portion 18 on the front surface 10A of the substrate 10; the grounded portion 18 and the zinc pad 22 are embedded in the front surface 10A of the substrate 10; the conductive 1268961 is in the adhesive Above the agent 30; a photovoltaic element 40 is located above the conductive paste 32, wherein the photovoltaic element 40 and the adhesive 30 are adhesively bonded by the conductive paste 32. In this embodiment, the optoelectronic component 40 can be an inductive wafer. In addition, a plurality of wires 34 are included for connecting the electrical properties between the conductive paste 32 and the pads 22, and the connecting conductive paste 32 is electrically connected to the ground portion 18 via the adhesive 30. Next, please refer to the fourth C diagram, which shows another preferred embodiment of the photovoltaic element assembly structure having the heat dissipation element disclosed in the present invention. The photoelectric component mounting structure comprises a substrate 10 having a hollow structure 12, a grounding portion 18 and a bonding pad 22, an adhesive 30 filled in the hollow structure 12 of the substrate 10, and extending to cover the grounding portion 18, a photoelectric The component 40 is disposed above the adhesive 30, and a transparent sheet 60, such as a glass sheet, is fixed to the photovoltaic element 40 by an adhesive or a spacer 50, and is evenly spaced from the photovoltaic element 40. open. In addition, above the substrate 10, a glass cover 70 is connected to the support member to seal the entire photovoltaic element structure. From the above, it can be seen that since the adhesive 30 connects the heat dissipation structure 20 and the photovoltaic element 40 via the hollow structure 12, the disadvantage that the heat dissipation structure 20 and the photovoltaic element 40 cannot be combined is improved in the prior art. In addition, since the photovoltaic element 40 is connected to the substrate 10 and the heat dissipation structure 20 by the adhesive 30, when the photovoltaic element 40 is operated at a high temperature, the heat dissipation structure 20 located on the back surface 10B of the substrate 10 can reduce the thermal resistance and increase the entire The heat dissipation effect of the photovoltaic component structure. 1267961 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the present invention should be included. Within the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a flow chart for forming a photovoltaic element structure having a heat dissipation structure according to the technology disclosed in the present invention; the second A picture and the second B picture are represented according to the technology disclosed in the present invention. A plan view of a substrate having a hollow structure; a second C diagram showing a cross-sectional view of a substrate having a hollow structure according to the second A and second B drawings according to the disclosed technology; The disclosed technology shows a top view of the heat dissipating structure disposed on the back side of the substrate; the third B is a schematic cross-sectional view showing the heat dissipating structure on the back side of the substrate having the hollow structure according to the disclosed technology; The technology disclosed in the present invention is a schematic cross-sectional view showing a heat dissipating structure embedded in a back surface of a substrate having a hollow structure; 1267961 FIG. 4A is a plan view showing a photovoltaic element placed on a front surface of a substrate according to the technology disclosed in the present invention; The fourth B diagram is a schematic cross-sectional view showing the photoelectric structure according to the technology disclosed in the present invention; and the fourth C diagram is according to the present invention. The technique disclosed in the prior art is a schematic cross-sectional view showing another preferred embodiment of the photovoltaic device package structure. [Main component symbol description] 1 to 5 Forming a photovoltaic element mounting structure having a heat dissipation structure Step 10 Substrate 10A Substrate front surface 10B Substrate back surface 12 Hollow structure 12A Hole shape 12B Rectangular shape 18 Ground portion 20 Heat dissipation structure 22 Pad 30 Adhesive 32 Conductive adhesive 34 wire 40 Photoelectric element 50 spacer 60 Transparent sheet 70 Glass cover 12