TW459299B - Sample processing system - Google Patents

Sample processing system Download PDF

Info

Publication number
TW459299B
TW459299B TW088119172A TW88119172A TW459299B TW 459299 B TW459299 B TW 459299B TW 088119172 A TW088119172 A TW 088119172A TW 88119172 A TW88119172 A TW 88119172A TW 459299 B TW459299 B TW 459299B
Authority
TW
Taiwan
Prior art keywords
sample
substrate
processing system
plate
item
Prior art date
Application number
TW088119172A
Other languages
English (en)
Chinese (zh)
Inventor
Kazutaka Yanagita
Kazuaki Ohmi
Kiyofumi Sakaguchi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of TW459299B publication Critical patent/TW459299B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
TW088119172A 1998-11-06 1999-11-03 Sample processing system TW459299B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31657598A JP4343295B2 (ja) 1998-11-06 1998-11-06 試料の処理システム

Publications (1)

Publication Number Publication Date
TW459299B true TW459299B (en) 2001-10-11

Family

ID=18078631

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088119172A TW459299B (en) 1998-11-06 1999-11-03 Sample processing system

Country Status (5)

Country Link
EP (1) EP0999578A3 (https=)
JP (1) JP4343295B2 (https=)
KR (1) KR100444262B1 (https=)
CN (1) CN1160761C (https=)
TW (1) TW459299B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584362B (zh) * 2010-08-23 2017-05-21 東京威力科創股份有限公司 Stripping system and stripping method

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0989593A3 (en) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Substrate separating apparatus and method, and substrate manufacturing method
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2000150836A (ja) 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
TW484184B (en) 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
DE10108369A1 (de) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger
JP2002353423A (ja) 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び処理方法
JP2002353081A (ja) 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び分離方法
JP4740414B2 (ja) 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
US8443863B2 (en) * 2008-10-23 2013-05-21 Corning Incorporated High temperature sheet handling system and methods
JP2011047515A (ja) * 2009-07-28 2011-03-10 Canon Anelva Corp 駆動装置及び真空処理装置
JP2012069906A (ja) * 2010-08-23 2012-04-05 Tokyo Electron Ltd 接合装置、接合方法、プログラム及びコンピュータ記憶媒体
JP6404828B2 (ja) * 2013-11-25 2018-10-17 リソテック ジャパン株式会社 小型回転アームを有する処理室および小型製造装置
JP6612648B2 (ja) * 2016-02-17 2019-11-27 東京応化工業株式会社 支持体分離装置及び支持体分離方法
WO2018030255A1 (ja) * 2016-08-09 2018-02-15 近藤工業株式会社 半導体製造装置
DE102023122888B4 (de) * 2023-08-25 2025-04-24 Leica Biosystems Nussloch Gmbh Anordnung mit Eindeckautomat und Vorratsbehälter für Eindeckmedium oder Reinigungsbehälter

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
JPH06268051A (ja) * 1993-03-10 1994-09-22 Mitsubishi Electric Corp ウエハ剥し装置
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
JP3250722B2 (ja) * 1995-12-12 2002-01-28 キヤノン株式会社 Ｓｏｉ基板の製造方法および製造装置
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
SG55413A1 (en) * 1996-11-15 1998-12-21 Method Of Manufacturing Semico Method of manufacturing semiconductor article
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US6382292B1 (en) * 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
US6153524A (en) * 1997-07-29 2000-11-28 Silicon Genesis Corporation Cluster tool method using plasma immersion ion implantation
KR19990049122A (ko) * 1997-12-11 1999-07-05 오상수 쇽업소버의 충격완화장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI584362B (zh) * 2010-08-23 2017-05-21 東京威力科創股份有限公司 Stripping system and stripping method

Also Published As

Publication number Publication date
EP0999578A3 (en) 2005-04-13
CN1258091A (zh) 2000-06-28
KR20000035284A (ko) 2000-06-26
JP2000150610A (ja) 2000-05-30
JP4343295B2 (ja) 2009-10-14
KR100444262B1 (ko) 2004-08-11
CN1160761C (zh) 2004-08-04
EP0999578A2 (en) 2000-05-10

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees