TW429469B - Improved methods and apparatus for determining an etch endpoint in a plasma processing system - Google Patents

Improved methods and apparatus for determining an etch endpoint in a plasma processing system

Info

Publication number
TW429469B
TW429469B TW088115804A TW88115804A TW429469B TW 429469 B TW429469 B TW 429469B TW 088115804 A TW088115804 A TW 088115804A TW 88115804 A TW88115804 A TW 88115804A TW 429469 B TW429469 B TW 429469B
Authority
TW
Taiwan
Prior art keywords
etch
etch process
processing system
monitoring
plasma processing
Prior art date
Application number
TW088115804A
Other languages
English (en)
Chinese (zh)
Inventor
Jaroslaw W Winniczek
M J Francois Chandrase Dassapa
Eric A Hudson
Mark Wiepking
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of TW429469B publication Critical patent/TW429469B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW088115804A 1998-09-30 1999-09-14 Improved methods and apparatus for determining an etch endpoint in a plasma processing system TW429469B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/164,389 US6228278B1 (en) 1998-09-30 1998-09-30 Methods and apparatus for determining an etch endpoint in a plasma processing system

Publications (1)

Publication Number Publication Date
TW429469B true TW429469B (en) 2001-04-11

Family

ID=22594268

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088115804A TW429469B (en) 1998-09-30 1999-09-14 Improved methods and apparatus for determining an etch endpoint in a plasma processing system

Country Status (8)

Country Link
US (3) US6228278B1 (https=)
EP (1) EP1118113A1 (https=)
JP (1) JP4508423B2 (https=)
KR (1) KR100704345B1 (https=)
CN (1) CN1215546C (https=)
AU (1) AU5925999A (https=)
TW (1) TW429469B (https=)
WO (1) WO2000019520A1 (https=)

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TWI659482B (zh) * 2014-04-29 2019-05-11 Lam Research Corporation 用於直通矽晶穿孔露出應用的端點偵測系統及方法

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US6861362B2 (en) * 2001-06-29 2005-03-01 Lam Research Corporation Self-aligned contact process implementing bias compensation etch endpoint detection and methods for implementing the same
US6837965B2 (en) * 2002-08-14 2005-01-04 Aaron D. Gustafson Method and apparatus for etch processing with end point detection thereof
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US8105367B2 (en) 2003-09-29 2012-01-31 Smith & Nephew, Inc. Bone plate and bone plate assemblies including polyaxial fasteners
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US6952014B1 (en) * 2004-04-06 2005-10-04 Qualcomm Inc End-point detection for FIB circuit modification
US7595972B2 (en) * 2004-04-09 2009-09-29 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
DE102004030723A1 (de) * 2004-06-25 2006-02-02 VenTec Gesellschaft für Venturekapital und Unternehmensberatung mbH Mobiler, elektrostatischer Substrathalter
CN100359660C (zh) * 2005-01-27 2008-01-02 北京北方微电子基地设备工艺研究中心有限责任公司 一种等离子体刻蚀工艺的终点检测方法
CN100365788C (zh) * 2005-01-27 2008-01-30 北京北方微电子基地设备工艺研究中心有限责任公司 一种多晶硅栅刻蚀终点的检测装置
US7578301B2 (en) * 2005-03-28 2009-08-25 Lam Research Corporation Methods and apparatus for determining the endpoint of a cleaning or conditioning process in a plasma processing system
US8382807B2 (en) 2005-07-25 2013-02-26 Smith & Nephew, Inc. Systems and methods for using polyaxial plates
US7662648B2 (en) * 2005-08-31 2010-02-16 Micron Technology, Inc. Integrated circuit inspection system
JP5094002B2 (ja) * 2005-09-06 2012-12-12 ルネサスエレクトロニクス株式会社 プラズマ処理装置およびその異常放電抑止方法
CN100344793C (zh) * 2005-11-02 2007-10-24 北京大学 一种对等离子体刻蚀进行定量监测的方法及结构
US20070122920A1 (en) * 2005-11-29 2007-05-31 Bornstein William B Method for improved control of critical dimensions of etched structures on semiconductor wafers
JP4986459B2 (ja) * 2006-01-24 2012-07-25 ルネサスエレクトロニクス株式会社 半導体集積回路装置
EP1992065B1 (de) * 2006-03-08 2011-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zur nachbildung der symmetrischen und asymmetrischen impedanz einer asynchronmaschine
JP4802018B2 (ja) * 2006-03-09 2011-10-26 筑波精工株式会社 静電保持装置及びそれを用いた真空環境装置並びにアライメント装置又は貼り合わせ装置
JP5160802B2 (ja) * 2007-03-27 2013-03-13 東京エレクトロン株式会社 プラズマ処理装置
US7744691B2 (en) * 2007-04-10 2010-06-29 Calcium Silicate Corporation Energy conserving pozzolan compositions and cements incorporating same
US7864502B2 (en) * 2007-05-15 2011-01-04 International Business Machines Corporation In situ monitoring of wafer charge distribution in plasma processing
US8343305B2 (en) 2007-09-04 2013-01-01 Lam Research Corporation Method and apparatus for diagnosing status of parts in real time in plasma processing equipment
KR100961203B1 (ko) * 2008-04-29 2010-06-09 주식회사 하이닉스반도체 스페이서 패터닝 기술을 이용한 미세 패턴 형성 방법
JP2010199429A (ja) * 2009-02-26 2010-09-09 Fujifilm Corp プラズマエッチング方法及びプラズマエッチング装置並びに液体吐出ヘッドの製造方法
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RU2013158111A (ru) 2011-06-15 2015-07-20 Смит Энд Нефью, Инк. Имплантат с переменным углом фиксации
US9076831B2 (en) * 2011-11-04 2015-07-07 Lam Research Corporation Substrate clamping system and method for operating the same
CN103395741B (zh) * 2013-07-31 2016-06-01 杭州士兰微电子股份有限公司 微机电工艺监控结构和监控方法
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US5013400A (en) 1990-01-30 1991-05-07 General Signal Corporation Dry etch process for forming champagne profiles, and dry etch apparatus
US5198072A (en) * 1990-07-06 1993-03-30 Vlsi Technology, Inc. Method and apparatus for detecting imminent end-point when etching dielectric layers in a plasma etch system
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659482B (zh) * 2014-04-29 2019-05-11 Lam Research Corporation 用於直通矽晶穿孔露出應用的端點偵測系統及方法

Also Published As

Publication number Publication date
US6562187B2 (en) 2003-05-13
AU5925999A (en) 2000-04-17
US20030183335A1 (en) 2003-10-02
KR20010075508A (ko) 2001-08-09
EP1118113A1 (en) 2001-07-25
CN1439173A (zh) 2003-08-27
US6228278B1 (en) 2001-05-08
US20010004921A1 (en) 2001-06-28
WO2000019520A1 (en) 2000-04-06
CN1215546C (zh) 2005-08-17
JP4508423B2 (ja) 2010-07-21
KR100704345B1 (ko) 2007-04-05
JP2002526924A (ja) 2002-08-20

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