TW411741B - Method to produce a conductive transverse-connection between two wiring-areas on a substrate - Google Patents
Method to produce a conductive transverse-connection between two wiring-areas on a substrate Download PDFInfo
- Publication number
- TW411741B TW411741B TW087113411A TW87113411A TW411741B TW 411741 B TW411741 B TW 411741B TW 087113411 A TW087113411 A TW 087113411A TW 87113411 A TW87113411 A TW 87113411A TW 411741 B TW411741 B TW 411741B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- area
- metal layer
- item
- layer
- Prior art date
Links
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Classifications
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
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- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/732—Location after the connecting process
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19736654 | 1997-08-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW411741B true TW411741B (en) | 2000-11-11 |
Family
ID=7839900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087113411A TW411741B (en) | 1997-08-22 | 1998-08-14 | Method to produce a conductive transverse-connection between two wiring-areas on a substrate |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1005703A1 (ja) |
JP (1) | JP3314165B2 (ja) |
KR (1) | KR100334373B1 (ja) |
CN (1) | CN1277736A (ja) |
TW (1) | TW411741B (ja) |
WO (1) | WO1999010926A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10145348C1 (de) * | 2001-09-14 | 2003-03-27 | Siemens Dematic Ag | Zwischenträger für elektronische Bauelemente und Verfahren zur Lötkontaktierung eines derartigen Zwischenträgers |
DE10250621B4 (de) * | 2002-10-30 | 2004-09-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips |
CN101815409B (zh) * | 2010-04-23 | 2012-05-02 | 陈国富 | 用注塑成型制作线路板的方法 |
JP5720278B2 (ja) * | 2011-02-07 | 2015-05-20 | ソニー株式会社 | 導電性素子およびその製造方法、情報入力装置、表示装置、ならびに電子機器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3483308A (en) * | 1968-10-24 | 1969-12-09 | Texas Instruments Inc | Modular packages for semiconductor devices |
JP2881270B2 (ja) * | 1990-08-28 | 1999-04-12 | 日本特殊陶業株式会社 | 多層配線基板の製造方法 |
WO1996009646A1 (de) * | 1994-09-23 | 1996-03-28 | Siemens N.V. | Polymer stud grid array |
-
1998
- 1998-08-14 TW TW087113411A patent/TW411741B/zh not_active IP Right Cessation
- 1998-08-18 KR KR1020007001668A patent/KR100334373B1/ko not_active IP Right Cessation
- 1998-08-18 CN CN98810524A patent/CN1277736A/zh active Pending
- 1998-08-18 EP EP98951303A patent/EP1005703A1/de not_active Withdrawn
- 1998-08-18 WO PCT/EP1998/005251 patent/WO1999010926A1/de not_active Application Discontinuation
- 1998-08-18 JP JP2000508140A patent/JP3314165B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1999010926A1 (de) | 1999-03-04 |
JP2001514450A (ja) | 2001-09-11 |
CN1277736A (zh) | 2000-12-20 |
KR20010023051A (ko) | 2001-03-26 |
EP1005703A1 (de) | 2000-06-07 |
KR100334373B1 (ko) | 2002-04-25 |
JP3314165B2 (ja) | 2002-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |