TW388201B - Method for producing thermal structure of printed circuit board - Google Patents

Method for producing thermal structure of printed circuit board Download PDF

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Publication number
TW388201B
TW388201B TW087106140A TW87106140A TW388201B TW 388201 B TW388201 B TW 388201B TW 087106140 A TW087106140 A TW 087106140A TW 87106140 A TW87106140 A TW 87106140A TW 388201 B TW388201 B TW 388201B
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Taiwan
Prior art keywords
layer
patent application
item
scope
metal layer
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Application number
TW087106140A
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English (en)
Inventor
Tz-Jang Tzeng
Jen-Hua Jen
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World Wiser Electronics Inc
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Application filed by World Wiser Electronics Inc filed Critical World Wiser Electronics Inc
Priority to TW087106140A priority Critical patent/TW388201B/zh
Priority to US09/130,360 priority patent/US6032355A/en
Application granted granted Critical
Publication of TW388201B publication Critical patent/TW388201B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/00015—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
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    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

錄潢部中央#隼扃貝工消费合作社印掣 2740twf-D.doc/005 ^ __ B7 五、發明説明（i ) 本發明是有關於一種形成印刷電路板(Printed Circuit Board, PCB)之超闻效率熱導結構（Ultra Thermal Enhanced Structure, UTES)的製造方法，且特別是有關於一種應用此 超高效率熱導結構之封裝結構的製造方法。 在一個包括至少一個積體電路（Integrated Circuit, 1C) 的模組(Module)中，由於大量的導線由1C晶片中釋出，因 此需要數以百計的連接來形成完整的線路。過去，有許多 種不同的線路晶片封裝方式》最常見的封裝方式爲平面包 裝，密封及塑膠晶片承載器（Hermetic and Plastic Chip Carrier)，格式陣列封裝(Grid Array Package) β 在傳統而普遍使用的IC晶片封裝中，使用導線架(Lead Frame)以電性連接半導體晶片及封裝的外接導線。然而， 由於積體電路越加精密及複雜的發展，雖然封裝的體積保 持原狀或減小，其所需的導線卻大量增加。傳統的導線架 製程技藝已不敷使用，因此，需要發展新的包裝方式，以 容納及連接更多的導線，完成更複雜的線路。 一種可容納及連接高導線數量的封裝方式爲球格陣列 (BGA)。BGA封裝通常爲一方形的封裝，其中導線端點以 銲接球(Solder Ball)的型式形成。這些端點的設計，是裝置 在欲連接之印刷線路板(Printed Wire Board，印刷線路板 or Printed Circuit Board,印刷線路板)或其他適當兀件表面 的焊塾（Bonding Pad)上。 實際上，傳統的BGA爲一小型的多重疊層的印刷線路 板，其中包含了積體電路晶片，經由不同的導電途徑電性 3 本紙張尺度適用中國國家標準（CNS 規格（2丨OX297公釐了 (請先閾讀背面之注$項再壤寫本頁) 〇裝. 訂 2740twf-D.doc/005 A7 B7 五、發明説明（>") 及實體相連接。而在導電體之間的連接，則透過金屬孔或 插塞來實施。 在一傳統之晶穴朝下的BGA封裝中’基材(Substrate) 需要兩層或兩層以上金屬層壓合在基底的兩個表面上(第1 圖的導電層108及112,放大圖如第1a圖所兩），這是導致 於銲接球所形成的高度限制。由於一般晶片的厚度與銲接 球之髙度相當或較高，在BGA封裝時會阻礙銲接球與印刷 線路板的接觸，而且，較厚的晶片封裝爲一較不理想的結 果。因此，此一高度限制使得晶片必需裝置在基材的一面’ 而銲接球必需裝置於基材的另一面上，兩晶片與靜接球之 間的電性連接，必需透過在基材的兩面外加之金屬層’經 由穿越基材的金屬孔或插塞達到。此一製程雖然可達到容 納大量導線的目的，然而其複雜的製程’例如，金屬層與 基材的接合，穿越基材之金靥孔/插塞的形成’甚至基材本 身的形成，都因其複雜的製程而提高了製造成本。目前普 遍的散熱方法，爲在晶片上面，裝置一散熱片(Heat Sink)， 或在晶片下方，穿越基材及金屬層，形成一散熱孔以進行 散熱。然而，這些方法增加了製程步驟，亦增加了製造成 本，爲較不合經濟效益的方法。 爲解決上述之問題，在由LSI Logic Corporation所提出 的美國專利案號5,357,672中，利用多層印刷線路板(Printed Wire Board，印刷線路板)及黏膠(Prepreg)壓合之結構，如 第1圖所示，將晶片101裝置於晶穴(Cavity)中央，在晶穴 週圍是由印刷線路板切成階梯結構，此階梯邊緣有焊墊 4 本紙張尺度適用中國Η家標牟（CNS ) A4規格（2丨〇χ 297公着） —τ------pi------IT (請先閲讀背面之注^•項再填寫本頁) 麵濟部中央搞率局負工消费合作社印« 2740twf-D.doc/005 A7 B7 Λ潢部中*摞率局貝工消费合作社印11 五、發明説明（4) (Bonding Pad)105設計，晶片之內部信號由打線（B〇nd Wire)103接至印刷線路板階梯邊緣上的焊墊105,再由印 刷線路板之線路透過貫穿孔洞(Through Hole)107傳至凸塊 (Bump)109，最後，傳至主基板(Main Board)。此專利利用 印刷線路板及黏膠壓合作爲基材，且將晶片裝置於基材中 的晶穴內，因此，使得晶片與凸塊裝置在基材的同一面上， 省略了兩片導電層的使用。 另外，如第2圖所示，由美國Washington Electric Corporation提出的專利案件5,027,191中，1C晶片201裝 設在晶片承載器中，透過打線203接到銲接架（Bonding Ledge)205上面，再接通到晶片承載器表面整齊排列的接觸 墊(Contact Pad)207上，把晶片內部信號接出來傳至主基 板，此結構是晶片朝下的組成，散熱片可裝置在印刷線路 板的底面，或是晶片承載器的上面，以加強散熱的結構。 Motorola在美國專利案件亦提出一種1C封裝，採用塑 膠BGA(Plastic BGA，PBGA)構裝方式，如第3圖所繪示， 一晶片301直接貼在印刷線路板基材300的中心位置，晶 片內部信號由打線303接出至印刷線路板的焊墊305上， 最後在焊墊上銲接銲接球（Solder Ball)307，把信號傳至主 基板面，再以模塑成型(Mold Compound)封膠，予以保護晶 片及接線。此外，在晶片下方，形成一通風口（Vent Hole) 以達到散熱的功效。 上述之習知技藝中，可達到容納大量導線於封裝中， 且可將晶片及銲接球裝置於基材的同一面上。然而，仍需 5 (請先閲讀背面之注f項再填寫本頁) ίΊ. -裝. 訂 本纸張尺度適用中國國家樣準（CNS ) A4^ ( 210Χ297公釐） 輕濟部中决鏢率Λ負工消费合作社4-架 2740twf-D.doc/005 A7 _ _B7_ 五、發明説明（夸） 使用外接的散熱裝置，不但在導熱性能上有待改進，還增 加了整個封裝結構的體積，使得使用材料及機器成本高， 而無法達到大量製造的需求。此外，其中欲達到成結構的 金屬內連線，印刷電路板必需切成階梯狀(Multi-tier)，更造 成製造的困難。 基於上述之特徵，本發明之主要目的，在提供一種印 刷電路板之熱導結構的製造方法，其中，將晶粒放置墊 (Chip Mount Pad)直接與金屬或熱導性質陶瓷或高分子 (Polymer)熱導片(Heat Spreader)相連，或近乎直接相連，而 形成一與所欲承載之晶粒最直接且最接近的導熱途徑。再 利用外加的散熱片(Heat Sink)，使得晶粒部分的熱源可經由 此散熱片驅散，進一步提高散熱效果。此外，這種熱導結 構的形成方法簡單，成本低，可大量製造，除了 PCB之外， 更可應用於BGA，晶粒尺寸封裝（Chip Scale Package, CSP)，及多晶粒模組(Multi-Chip Module, MCM)。 基於上述之特徵，本發明之另一主要目的，在提供一 種晶片的構裝裝置的製造方法，其中，晶粒放置在一直接 與金屬或熱導性質陶瓷或高分子熱導片相連，或近乎直接 相連的晶粒放置墊上，使得晶粒具最短，亦即最有效率的 散熱途徑’再利用外加的散熱片，使得晶粒部分的熱源除 經由散熱孔（Thermal Via)散熱之外，也可經由此散熱片驅 散’進一步提高散熱效果。 根據上述及其他的目的，應用本發明，提出一種印刷 電路板之熱導結構製造方法，首先，形成具一凹凸圖案結 6 本紙张纽適用中國Η家標準（CNS ) A4胁（2Η)χ297公兼)' 一' (請先《讀背面之注$項再填寫本頁) '.裝 訂 2740twf-D.doc/005 A7 ΒΊ__ .五、發明説明（f) 構的表面的一熱導層，然後，在熱導層上形成一黏膠層， 再於熱導層及黏膠層上形成一表面金屬層，其中，使部分 的表面金屬層直接或近乎直接與熱導層相連。此外，還可 在外部形成一外接的散熱片，以進一步增加散熱的效率。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉一實施例，並配合所附圖式，作詳細說 明如下。 圖式之簡單說明： 第1圖繪示出第一種習知的構裝結構； 第la圖繪示出第一圖中之構裝結構中，導電層之放大 圖式； 第2圖繪示出第二種習知的構裝結構； 第3圖繪示出第三種習知的構裝結構； 第4圖繪示出基於本發明之一實施例的結構； 第5圖繪示出基於本發明之一實施例可外加散熱片 (Heat Sink)的構裝結構； 第6·圖繪示出第4圖及第5圖中，熱導板的結構； 第7圖係一上視圖，繪示出基於本發明之一實施例中， 具表面凹陷結構之一 PCB ;以及 第8圖係一上視圖，繪示出基於本發明之另一實施例 中，具表面凸起結構之一 PCB。 實施例 應用本發明，提出一種具直接或近乎直接之導熱途徑 的印刷電路板的熱導結構，在日趨精密的電子產品中，電 7 ---'------Ο裝------訂 (請先閱讀背面之注f項再填寫本頁) «濟部中*標率局貝工消费合作社印策 本紙張尺度適用中國國家揉準（CNS > A4规格（210X297公 2740twf-D.doc/〇〇5 2740twf-D.doc/〇〇5 鍾濟部中央橾年局貝工消费合作社印架 A7 -------B7__ 五、發明説明（“） ' 一 子產品要求更加的輕薄短小的體積，且需要良好的散熱途 徑。因此’本發明與習知技藝不同之處，在於本發明利用 形成I具不規則袠面，亦即凹凸不平表面之導熱片使得 _晶粒之放置墊直接或近乎直接直接地與熱導片相連， 因而縮短了散熱雜，提高了_效果。此—結構的形成 $需使用額外的材料’且形成方法簡單，因此，可降低製 造成本，並達到大釐製造的需求。 參考第4圖’基於本發明之一實施例，一印刷電路板 的導熱途徑如圖所繪。先形成熱導層(Heat Spreader)的圖案 結構’再利用真空壓合的方式將各層金屬層(400，404，410) 夾著膠片（Prepreg)、樹脂(Ep〇xy)分次壓合，經微影蝕刻法 製造出第4圖及第5圖的結構。其中，熱導層4〇2的材料 可採用金羼層、陶瓷層、或高分子層。如果使用金屬層爲 熱導電層’則可利下列方法，使熱導層402的表面可依實 際情形所需，形成如圖所示之凹凸圖形結構的形狀： 1) 先利用機械鈷孔(Mechanic Drill Through Hole)，再利 用壓模(Press)模沖(Punched)，形成凹凸粗糙面。 2) 先將金屬層利用機械鈷導通孔(Through Hole)，再使 用微影触刻法（Photolithography and Chemical Etching)，形 成凹凸不平的表面結構。 3) 先利用微影蝕刻法，將金屬層蝕刻成導通孔，然後 再利用類似方法1)的模沖法形成所需的結構。 4) 利用兩次用微影蝕刻法製作導通孔及凹凸不平的表 面結構。 8 本紙張尺度適用中國國家標準（CNS > A4规格（2丨〇 X 297公着) ' ；—„------Γ’裝------訂 (讀先閲讀背面之注項再填寫本頁> «漪部中率局負工携费合作社印架 2740twf-D.doc/005 _B7 五、發明説明（7) 如果使用陶瓷或高分子作爲熱導板之材料，則用灌模 (Molding)方式形成所需之凹凸不平的表面結構 如第6圖所示，在此一結構中，金屬層402的厚度約 爲5mil至12mil，凹槽深度(a)則控制在約〇.5mil至2.5mil 的範圍，凹槽深度(b)控制在約2.0mil至4.0mil的範圍。選 用厚約2mil至4.5mil的粘膠片或樹脂塗佈銅片壓合。黏膠 餍的材料可選用，例如，Fr-4，Fr-5，雙馬來醢亞胺三氮雜 苯化合物黏膠（Bismalemide Triazine，BT-Prepreg)，或聚亞 苯基魅(PolyPhenylene Ether，PPE)，將表面金屬層406與熱 導板402,金屬層400,金屬層410分別以前述的粘膠層404 疊合（Lay-up)用真空壓合。也可用樹脂塗佈銅片（Resin-Coated Copper)取代金屬層406及粘膠層404 »在實際的應 用上，部分的金屬層402(如A區)直接或近乎直接連接的熱 導板402上，形成一有晶粒放置墊(Die Pad)(如圖中D區）， 用以裝置晶粒408,此時A區，D區形成良好的熱導途徑。 並利用習知的導熱孔(Thermal Via)(如第4圖及第5圖中之 E)，更加有效地將晶粒及本載體的熱導到其銲接的母板 (Mother Board)。 由以上結構可知，由於晶粒直接裝置表面金屬層406 上，而裝置有晶粒的表面金屬層406直接或近乎直接與熱 導板402相連，散熱途徑短且直接，因此，晶粒中所產生 的熱量，能在不增加材料，不提高製造成本的條件下，透 過此法減少熱阻抗(Thermal Resistance)，高效率地驅散晶粒 所散發的熱量。 9 本纸張尺度適用中國國家揉準（CNS > A4規格（210Χ297公着） ； i ^(.裝 訂 (請先»讀背面之注$項再填寫本頁) 2740twf-D.doc/005 A7 B7 鯉濟部中央搞率Ϊ工消费合作社印« ^、發明説明（牙） 此外，如第5圖所示，利用相同的方法形成一印刷電 路板，包括一底部的外接機構410，例如，BGA，一導線層 或多層板核心層400,壓合在導線層400上方之一表面凹凸 圖形結構的熱導板402,此熱導板的邊緣可做成凸形圖案(B 區），一黏膠層404，金屬層406壓合在熱導板402或黏膠 層上，在部分與熱導板402直接或近乎直接相連於表面金 屬層404上，裝置一晶粒408打金線(Wire Bond)，上膠成 型之後，將一散熱片514利用一導熱膠（Thermal Glue/Thermal Epoxy)或機械式鎖螺牙，裝置在表面金屬層 406，與B區相連或近乎相連的金屬墊(C區)上，此C區的 銅墊(Copper Pad)稱爲散熱片墊(Thermal Pad)，形成良好的 導熱途徑。 第5圖所繪示之結構中，除了具第4圖中所繪示之直 接或近乎直接的散熱途徑之外，更在晶粒的四週的B區，C 區相連的散熱片墊上，加裝了一個散熱片，使得晶粒的散 熱效果進一步提高，且在整個印刷電路板的上方加裝一散 熱板的方法簡單，也就是說，晶粒的散熱效果在不增加製 造困難的情況下，更有效率地提高。 第7圖繪示出基於本發明之一實施例中，所形成之一 表面凹凸不平的熱導層的上視圖。其中，熱導層之凹陷部 分或凸出部分可爲陣列式(Array Type)，堆疊式（Staggered Type) ’或不規則型式。其中，凹陷結構之直徑f約爲6mil 至50mU，而凹陷結構彼此之間的距離g約爲6mil至 200mH ’以及凹陷結構的凹陷深度約爲0.5mil至2.5mil。需 本紙張尺度適用中國國家榡準（CNS > A4规格（210X297公釐） ^ ^ 〇裝 訂 (婧先閱讀背面之注項再填寫本頁) 2740twf-D.doc/005 A7 B7________ 五、發明説明（？） 注意的是，實際的型式，大小尺寸應依據實際所需而決定。 第8圖繪示出基於本發明之一實施例中，所形成之一 表面凹凸不平的熱導層的上視圖。其中，熱導層之凹陷部 分或凸出部分可爲陣列式(Array Type)，堆疊式（Staggered Type)，或不規則型式。其中，凸起結構之直徑(k)約爲3mil 至lOOmU，而凸起結構彼此之間的距離(m)約爲5mil至 200mil，以及凹陷結構的凸起高度約爲〇.5mil至2.5mU。需 注意的是，實際的型式，大小尺寸應依據實際所需而決定， 惟若凸起之直徑過小，則容易引起擠斷，斷裂的現象。 雖然本發明之實施例如上所揭露，然其並非用以限定 本發明，任何熟習此技藝者，在不脫離本發明之精神和範 圍內，當可作各種之更動與潤飾。 -— ---1 n ϋ ^ — I (請先閩讀背面之注^^項再填寫本頁) 訂 輕漪部中戎鏢隼^貝工消费合作社印簟 本紙張尺度適用中國國家棣準（CNS ) A4规格（21 〇 X 2的公釐）

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  1. 2740twf-D.doc/005 A8 B8 C8 D8 六、申請專利範圍 ι·一種印刷電路板之熱導結構的製造方法，包括： 形成具一凹凸圖形結構的表面的一熱導層； 在該熱導層上形成一黏膠層；以及 (請先閲讀背面之注$項再填寫本頁) 在該熱導層及該黏膠層上形成一表面金屬層，其中， 部分的該表面金屬層直接或近乎直接與該熱導層相連。 2. 如申請專利範圍第1項所述之方法，其中該熱導層包 括一金屬層。 3. 如由請專利範圍第2所述之方法，其中該金屬層經機 械鈷孔，再用壓模模沖形成該凹凸圖形結構的表面。 4. 如申請專利範圍第2項所述之方法，其中該金屬層經 機械鈷導通孔，再用微影蝕刻以形成該凹凸圖形結構的表 面。 5. 如申請專利範圍第2項所述之方法，其中該金屬層經 微影蝕刻先形成複數個導通孔，再利用模沖法形成凹凸圖 形結構的表面。 6. 如申請專利範圍第2項所述之方法’其中該金屬層經 兩次微影蝕刻製作複數個導通孔’再形成該凹凸圖形結構 的表面。 鍾濟部中夫樣率局真工消费合作社印笨 如申請專利範圍第1項所述之方法，其中該熱導層包 括一陶瓷層。 8. 如申請專利範圍第7項所述之方法’其中該陶瓷層利 用灌模方式形成該凹凸圖形結構的表面。 9. 如申請專利範圍第1項所述之方法，其中該熱導層包 括一高分子層。 本紙張尺度適用中國國家標牟（CNS ) Α4规格（210X297公釐） A8 2740twf-D.doc/005 B8 C8 ___D8 _ 六、申請專利範圍 10.如申請專利範圍第9項所述之方法，其中該高分子 層利用灌模方式形成該凹凸不平的表面。 11·如申請專利範圍第1項所述之方法，其中該熱導結 構壓合在一導線層或一多層板夾心層的一面。 12. 如申請專利範圍第11項所述之方法，其中該導線層 或該多層板夾心層之另一面上，具一外接機構。 13. 如申請專利範圍第1項所述之方法，其中該表面金 屬層是利用真空壓合在該熱導層上。 14. 如申請專利範圍第1項所述之方法，其中該表面金 屬層是利用熱黏膠，壓合在該熱導層上。 15. 如申請專利範圍第1項所述之方法，其中，晶粒可 裝置在一晶粒墊，該晶粒墊與該熱導層直接或近乎直接相 連的該表面金屬層。 16. 如申請專利範圍第1項所述之方法，其中在一散熱 片墊上可以外接一散熱片。 Π.—種印刷電路板之熱導結構的製造方法，包括： 形成具一凹凸圖形結構的表面之一熱導層； 在該熱導層表面形成一黏膠層； 錢濟部中夬標率局貝工消费含作社印装 (請先閲讀背面之注意事項再填寫本頁) 在該熱導層及該黏膠層上形成一表面金屬層，其中， 部分的該表面金屬層直接或近乎直接與該熱導層相連，以 及 在該表面金屬層上可裝置一外接散熱片。 18.如申請專利範圍第Π項所述之方法，其中該熱導層 包括一金屬層。 13 本紙張尺度逍用中國國家揉牟（CNS ) A姑H格（210X297公釐） 2740twf-D.doc/005 A8 B8 C8 D8 、申請專利範圍 19·如由請專利範圍第17所述之方法，其中該金屬層經 機械鈷孔，再用壓模模沖形成該圖形結構不平的表面。 20.如申請專利範圍第17項所述之方法，其中該金屬層 經機械鈷導通孔，再用微影蝕刻以形成該凹凸圖形結構的 表面。 20. 如申請專利範圍第17項所述之方法，其中該金屬層 經微影蝕刻先形成複數個導通孔，再利用模沖法形成凹凸 圖形結構的表面。 21. 如申請專利範圍第17項所述之方法，其中該金屬層 經兩次微影蝕刻製作複數個導通孔，再形成該凹凸圖形結 構的表面。 22. 如申請專利範圍第17項所述之方法，其中該熱導層 包括一陶瓷層。 ’ 23. 如申請專利範圍第22項所述之方法，其中該陶瓷層 利用灌模方式形成該凹凸圖形結構的表面。 24. 如申請專利範圍第17項所述之方法，其中該熱導層 包括一高分子層。 25. 如申請專利範圍第24項所述之方法，其中該高分子 層利用灌模方式形成該凹凸圖形結構的表面。 26. 如申請專利範圍第16項所述之方法，其中該熱導結 構壓合在一導線層或一多層板夾心層的一面。 27. 如申請專利範圍第16項所述之方法，其中該導線層 或該多層板夾心層之另一面上，具一外接機構。 28. 如申請專利範圍第Π項所述之方法，其中該表面金 本紙張尺度適用中國國家橾準（CNS > A4规格（210X297公釐） .11J— I---—^r j 裝— ^ I — —訂 (請先閱讀背面之注f項再填寫本頁) M濟部中央橾率扃舅工洧费合作社印簟 A8 2740twf-D.doc/005 B8 C8 D8 六、申請專利範圍 屬層是利用真空壓合在該熱導層上。 29. 如申請專利範圍第17項所述之方法，其中該表面金 屬層是利用熱黏膠，壓合在該熱導層上。 30. 如申請專利範圍第17項所述之方法，其中，晶粒可 裝置在一晶粒墊上，該晶粒墊與該熱導層直接或近乎直接 相連的該表面金屬層。 31. 如申請專利範圍第17所述之方法，在該散熱墊上可 以外接一散熱片。 --^------'Γ—裝------訂 /V (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標率局負工消费合作社印策 本紙張尺度逋用中國國家標準（CNS ) A4規格（210X297公釐）
TW087106140A 1998-04-22 1998-04-22 Method for producing thermal structure of printed circuit board TW388201B (en)

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