TW380075B - Polishing apparatus - Google Patents

Polishing apparatus Download PDF

Info

Publication number
TW380075B
TW380075B TW087119223A TW87119223A TW380075B TW 380075 B TW380075 B TW 380075B TW 087119223 A TW087119223 A TW 087119223A TW 87119223 A TW87119223 A TW 87119223A TW 380075 B TW380075 B TW 380075B
Authority
TW
Taiwan
Prior art keywords
grinding
work piece
driving
panel
patent application
Prior art date
Application number
TW087119223A
Other languages
English (en)
Chinese (zh)
Inventor
Noburu Shimizu
Norio Kimura
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of TW380075B publication Critical patent/TW380075B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00Cleaning by methods involving the use of tools
    • B08B1/30Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/12Lapping plates for working plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW087119223A 1997-11-21 1998-11-20 Polishing apparatus TW380075B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33803297A JPH11156704A (ja) 1997-11-21 1997-11-21 基板の研磨装置

Publications (1)

Publication Number Publication Date
TW380075B true TW380075B (en) 2000-01-21

Family

ID=18314300

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087119223A TW380075B (en) 1997-11-21 1998-11-20 Polishing apparatus

Country Status (5)

Country Link
EP (1) EP0954408A1 (ko)
JP (1) JPH11156704A (ko)
KR (1) KR100522888B1 (ko)
TW (1) TW380075B (ko)
WO (1) WO1999026761A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766697B (zh) * 2021-05-24 2022-06-01 聯毅科技股份有限公司 監控裝置及方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6413156B1 (en) 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
US6595831B1 (en) 1996-05-16 2003-07-22 Ebara Corporation Method for polishing workpieces using fixed abrasives
KR20010039590A (ko) * 1999-04-29 2001-05-15 마에다 시게루 작업대상물을 폴리싱하는 방법 및 장치
JP2004505435A (ja) * 2000-06-08 2004-02-19 スピードファム−アイピーイーシー コーポレイション オービタル研磨装置
JP2012153562A (ja) * 2011-01-26 2012-08-16 Shin-Etsu Chemical Co Ltd 光ファイバ及び光ファイバ用プリフォームの製造方法
JP2019123053A (ja) 2018-01-18 2019-07-25 三菱重工コンプレッサ株式会社 狭隘部の研磨用治具、研磨用治具の製造方法、研磨方法、およびインペラの製造方法
KR102540042B1 (ko) 2021-06-30 2023-06-05 (주)피엔피 Oled 디스플레이 패널용 인캡 글라스의 전면카메라 전방 영역 폴리싱장치
KR102580741B1 (ko) 2023-02-22 2023-09-20 주식회사 터보링크 유체윤활베어링의 베어링 패드 및 볼 피봇 연마장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE197634C (ko) *
US3906678A (en) * 1972-09-14 1975-09-23 Buehler Ltd Automatic specimen polishing machine and method
JP3326642B2 (ja) * 1993-11-09 2002-09-24 ソニー株式会社 基板の研磨後処理方法およびこれに用いる研磨装置
JP3560051B2 (ja) * 1996-11-15 2004-09-02 株式会社荏原製作所 基板の研磨方法及び装置
US5989107A (en) * 1996-05-16 1999-11-23 Ebara Corporation Method for polishing workpieces and apparatus therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI766697B (zh) * 2021-05-24 2022-06-01 聯毅科技股份有限公司 監控裝置及方法

Also Published As

Publication number Publication date
JPH11156704A (ja) 1999-06-15
KR20000070201A (ko) 2000-11-25
WO1999026761A1 (en) 1999-06-03
KR100522888B1 (ko) 2005-10-19
EP0954408A1 (en) 1999-11-10

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees