TW377498B - Apparatus for treating base plates - Google Patents

Apparatus for treating base plates

Info

Publication number
TW377498B
TW377498B TW086117260A TW86117260A TW377498B TW 377498 B TW377498 B TW 377498B TW 086117260 A TW086117260 A TW 086117260A TW 86117260 A TW86117260 A TW 86117260A TW 377498 B TW377498 B TW 377498B
Authority
TW
Taiwan
Prior art keywords
base plates
holder
base plate
component
cover layer
Prior art date
Application number
TW086117260A
Other languages
English (en)
Inventor
John Dr Oshinowo
Original Assignee
Steag Micro Tech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Micro Tech Gmbh filed Critical Steag Micro Tech Gmbh
Application granted granted Critical
Publication of TW377498B publication Critical patent/TW377498B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning In General (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW086117260A 1996-11-22 1997-11-19 Apparatus for treating base plates TW377498B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19648498A DE19648498C1 (de) 1996-11-22 1996-11-22 Vorrichtung zum Behandeln von Substraten, insbesondere von Halbleiter-Wafern

Publications (1)

Publication Number Publication Date
TW377498B true TW377498B (en) 1999-12-21

Family

ID=7812530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117260A TW377498B (en) 1996-11-22 1997-11-19 Apparatus for treating base plates

Country Status (7)

Country Link
US (1) US6189552B1 (zh)
EP (1) EP0948804A1 (zh)
JP (1) JP3365638B2 (zh)
KR (1) KR100323901B1 (zh)
DE (1) DE19648498C1 (zh)
TW (1) TW377498B (zh)
WO (1) WO1998024114A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19915078A1 (de) * 1999-04-01 2000-10-12 Siemens Ag Verfahren zur Prozessierung einer monokristallinen Halbleiterscheibe und teilweise prozessierte Halbleiterscheibe
US6460551B1 (en) * 1999-10-29 2002-10-08 Applied Materials, Inc. Megasonic resonator for disk cleaning and method for use thereof
US6840250B2 (en) * 2001-04-06 2005-01-11 Akrion Llc Nextgen wet process tank
US6595224B2 (en) * 2001-06-20 2003-07-22 P.C.T. Systems, Inc. Bath system with sonic transducers on vertical and angled walls
US7156927B2 (en) * 2002-04-03 2007-01-02 Fsi International, Inc. Transition flow treatment process and apparatus
EP1600039A2 (en) * 2002-11-01 2005-11-30 Akrion Llc Substrate process tank with acoustical source transmission and method of processing substrates
US7582180B2 (en) * 2004-08-19 2009-09-01 Micron Technology, Inc. Systems and methods for processing microfeature workpieces
KR101654436B1 (ko) 2014-12-17 2016-09-05 (주)수아 화약을 이용한 탈출구 확보장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4691722A (en) 1984-08-01 1987-09-08 Fsi Corporation Bowl for liquid spray processing machine
DE3712064A1 (de) 1987-04-09 1988-10-27 Prettl Laminar Flow & Prozesst Einrichtung zum bearbeiten von werkstuecken, insbesondere von wafern in einem reinraum einer halbleiterfertigung
JPH0278246A (ja) * 1988-09-14 1990-03-19 Kakizaki Seisakusho:Kk 薄板処理用バスケット
JP3194209B2 (ja) 1992-11-10 2001-07-30 東京エレクトロン株式会社 洗浄処理装置
JPH06283486A (ja) 1993-03-30 1994-10-07 Dainippon Screen Mfg Co Ltd ウエハ保持装置及びウエハ収納カセット
US5383484A (en) 1993-07-16 1995-01-24 Cfmt, Inc. Static megasonic cleaning system for cleaning objects
DE4413077C2 (de) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur chemischen Behandlung von Substraten
JP3145252B2 (ja) * 1994-07-29 2001-03-12 淀川化成株式会社 基板支承用側板およびそれを用いたカセット
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
DE19546990C2 (de) * 1995-01-05 1997-07-03 Steag Micro Tech Gmbh Anlage zur chemischen Naßbehandlung
DE19637875C2 (de) * 1996-04-17 1999-07-22 Steag Micro Tech Gmbh Anlage zur Naßbehandlung von Substraten
DE19616402C2 (de) * 1996-04-24 2001-11-29 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter
US5868882A (en) * 1996-06-28 1999-02-09 International Business Machines Corporation Polymer protected component
DE19644253A1 (de) 1996-10-24 1998-05-07 Steag Micro Tech Gmbh Vorrichtung zum Behandeln von Substraten

Also Published As

Publication number Publication date
US6189552B1 (en) 2001-02-20
KR20000057197A (ko) 2000-09-15
KR100323901B1 (ko) 2002-02-08
JP3365638B2 (ja) 2003-01-14
WO1998024114A1 (de) 1998-06-04
JP2000506682A (ja) 2000-05-30
DE19648498C1 (de) 1998-06-10
EP0948804A1 (de) 1999-10-13

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