TW376456B - Semiconductor IC tester - Google Patents

Semiconductor IC tester

Info

Publication number
TW376456B
TW376456B TW087109180A TW87109180A TW376456B TW 376456 B TW376456 B TW 376456B TW 087109180 A TW087109180 A TW 087109180A TW 87109180 A TW87109180 A TW 87109180A TW 376456 B TW376456 B TW 376456B
Authority
TW
Taiwan
Prior art keywords
test
head
logic
rows
memory
Prior art date
Application number
TW087109180A
Other languages
English (en)
Inventor
Hisao Hayama
Toshio Goto
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW376456B publication Critical patent/TW376456B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3177—Testing of logic operation, e.g. by logic analysers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
TW087109180A 1997-06-13 1998-06-09 Semiconductor IC tester TW376456B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9156925A JPH112657A (ja) 1997-06-13 1997-06-13 複合ｉｃ試験装置

Publications (1)

Publication Number Publication Date
TW376456B true TW376456B (en) 1999-12-11

Family

ID=15638376

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087109180A TW376456B (en) 1997-06-13 1998-06-09 Semiconductor IC tester

Country Status (6)

Country Link
JP (1) JPH112657A (zh)
KR (1) KR19990006956A (zh)
CN (1) CN1218183A (zh)
DE (1) DE19826314A1 (zh)
SG (1) SG79979A1 (zh)
TW (1) TW376456B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
DE19916346C2 (de) * 1999-04-12 2003-12-18 Helmuth Heigl Vorrichtung zum Zuführen elektronischer Bauteile
DE19921246C2 (de) * 1999-05-07 2003-06-12 Infineon Technologies Ag Anlage zur Fertigung von Halbleiterprodukten
DE19922936B4 (de) * 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
DE10060438B4 (de) 2000-12-05 2004-09-09 Infineon Technologies Ag Testanordnung zum parallelen Test einer Mehrzahl von integrierten Schaltkreisen und Testverfahren
WO2004108366A1 (ja) * 2003-06-06 2004-12-16 Advantest Corporation 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法
CN1328590C (zh) * 2003-07-01 2007-07-25 台北歆科科技有限公司 万用型半导体检测机的测试机构
JP4694983B2 (ja) * 2006-02-10 2011-06-08 ヤマハ発動機株式会社 表面実装機
WO2008050442A1 (fr) * 2006-10-27 2008-05-02 Advantest Corporation Appareil de test de composants électroniques
CN101290330B (zh) * 2007-04-16 2010-06-23 普诚科技股份有限公司 电路测试装置
CN101452010B (zh) * 2007-11-30 2011-12-14 上海华虹Nec电子有限公司 用于芯片测试的探针卡的测试方法
CN102636739B (zh) * 2012-03-20 2014-08-13 杭州长川科技有限公司 集成电路测试多工位定位装置
CN103616611B (zh) * 2013-11-07 2016-08-17 珠海市运泰利自动化设备有限公司 一种循环测试设备
CN109085444B (zh) * 2018-08-08 2020-11-03 广东电网有限责任公司广州供电局 转接箱及其避雷器检测装置
CN110723523B (zh) * 2019-10-23 2021-10-22 珠海格力智能装备有限公司 收板机的控制方法、装置及系统

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359899A (ja) * 1989-07-27 1991-03-14 Nec Corp 半導体メモリ
US5420520A (en) * 1993-06-11 1995-05-30 International Business Machines Corporation Method and apparatus for testing of integrated circuit chips
JPH10340937A (ja) * 1997-06-10 1998-12-22 Advantest Corp 複合ｉｃテストシステム

Also Published As

Publication number Publication date
CN1218183A (zh) 1999-06-02
SG79979A1 (en) 2001-04-17
DE19826314A1 (de) 1998-12-24
KR19990006956A (ko) 1999-01-25
JPH112657A (ja) 1999-01-06

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