TW373285B - Robot blade for automatic handling of semiconductor substrate - Google Patents

Robot blade for automatic handling of semiconductor substrate

Info

Publication number
TW373285B
TW373285B TW086116229A TW86116229A TW373285B TW 373285 B TW373285 B TW 373285B TW 086116229 A TW086116229 A TW 086116229A TW 86116229 A TW86116229 A TW 86116229A TW 373285 B TW373285 B TW 373285B
Authority
TW
Taiwan
Prior art keywords
semiconductor substrate
handling blade
single crystal
blade
preferred
Prior art date
Application number
TW086116229A
Other languages
English (en)
Inventor
Behzad Shamlou
Wen Chiang Tu
Xuyen Pham
Yu Chang
Daniel O Clark
Wu Shun
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW373285B publication Critical patent/TW373285B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S294/00—Handling: hand and hoist-line implements
    • Y10S294/907—Sensor controlled device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
TW086116229A 1996-11-04 1997-10-30 Robot blade for automatic handling of semiconductor substrate TW373285B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/740,886 US6024393A (en) 1996-11-04 1996-11-04 Robot blade for handling of semiconductor substrate

Publications (1)

Publication Number Publication Date
TW373285B true TW373285B (en) 1999-11-01

Family

ID=24978475

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086116229A TW373285B (en) 1996-11-04 1997-10-30 Robot blade for automatic handling of semiconductor substrate

Country Status (3)

Country Link
US (2) US6024393A (zh)
JP (1) JPH10181875A (zh)
TW (1) TW373285B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8168017B2 (en) 2007-01-24 2012-05-01 Asml Holding N.V. Bonding silicon silicon carbide to glass ceramics

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6454332B1 (en) * 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
TW439782U (en) * 1999-01-04 2001-06-07 United Microelectronics Corp Transmission robot device
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP3356115B2 (ja) * 1999-05-20 2002-12-09 ウシオ電機株式会社 レジスト硬化装置
JP4872989B2 (ja) * 1999-07-22 2012-02-08 東京エレクトロン株式会社 静電容量型センサ部品、物体搭載体、半導体製造装置および液晶表示素子製造装置
US6206441B1 (en) * 1999-08-03 2001-03-27 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for transferring wafers by robot
WO2001050503A1 (en) * 1999-12-30 2001-07-12 Speedfam-Ipec Corporation Advanced wafer passive end-effector
JP2001267400A (ja) * 2000-03-16 2001-09-28 Kyocera Corp ウエハ支持部材
US6631935B1 (en) 2000-08-04 2003-10-14 Tru-Si Technologies, Inc. Detection and handling of semiconductor wafer and wafer-like objects
US6297480B1 (en) * 2000-12-22 2001-10-02 Taiwan Semiconductor Manufacturing Company, Ltd Method and apparatus for preventing contamination in a hot plate oven
US20030014155A1 (en) * 2001-07-12 2003-01-16 Applied Material, Inc. High temperature substrate transfer robot
US6638004B2 (en) 2001-07-13 2003-10-28 Tru-Si Technologies, Inc. Article holders and article positioning methods
US6935830B2 (en) 2001-07-13 2005-08-30 Tru-Si Technologies, Inc. Alignment of semiconductor wafers and other articles
US6615113B2 (en) 2001-07-13 2003-09-02 Tru-Si Technologies, Inc. Articles holders with sensors detecting a type of article held by the holder
CN100435269C (zh) * 2001-07-15 2008-11-19 应用材料有限公司 处理系统
JP3535853B2 (ja) * 2001-09-18 2004-06-07 エム・エフエスアイ株式会社 基板の支持固定具、及びこれを用いた基板表面の乾燥方法
US7011484B2 (en) * 2002-01-11 2006-03-14 Taiwan Semiconductor Manufacturing Co., Ltd. End effector with tapered fingertips
TW536459B (en) * 2002-04-22 2003-06-11 Taiwan Semiconductor Mfg Robot arm having wafer-scratching prevention function
US6679064B2 (en) * 2002-05-13 2004-01-20 Taiwan Semiconductor Manufacturing Co., Ltd Wafer transfer system with temperature control apparatus
US6896304B2 (en) * 2002-09-03 2005-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic sensing wafer blade and method for using
EP1540706A1 (en) * 2002-09-16 2005-06-15 Integrated Dynamics Engineering, Inc. Substrate end effector
US20050036855A1 (en) * 2003-08-13 2005-02-17 Texas Instruments Incorporated Robot blade for handling of semiconductor waffers
US7490878B1 (en) * 2003-12-29 2009-02-17 Storage Technology Corporation ESD safe vacuum wand tip
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method
CN101627148B (zh) * 2007-03-01 2012-05-30 应用材料公司 传送腔室接口用的浮动狭缝阀
JP4821756B2 (ja) * 2007-10-19 2011-11-24 東京エレクトロン株式会社 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム
JP4447631B2 (ja) 2007-11-05 2010-04-07 東京エレクトロン株式会社 位置検出用治具
US8215890B2 (en) * 2009-03-12 2012-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer robot alignment system and method
US9663374B2 (en) 2011-04-21 2017-05-30 The United States Of America, As Represented By The Secretary Of The Navy Situ grown SiC coatings on carbon materials
JP2013045817A (ja) * 2011-08-23 2013-03-04 Hitachi High-Technologies Corp 真空処理装置および真空処理方法
US20150290815A1 (en) * 2014-04-11 2015-10-15 Varian Semiconductor Equipment Associates, Inc. Planar end effector and method of making a planar end effector
US9415519B2 (en) * 2014-07-01 2016-08-16 Varian Semiconductor Equipment Associates, Inc. Composite end effector and method of making a composite end effector
EP3153282B1 (de) * 2015-10-06 2021-12-08 J. Schmalz GmbH Greifvorrichtung und betriebsverfahren für eine greifvorrichtung
US10566230B2 (en) * 2016-04-01 2020-02-18 Sunpower Corporation Gripper for semiconductor devices
DE102017205095B3 (de) 2017-03-27 2018-06-28 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung und Verfahren zum Entnehmen eines Werkstückteils aus einem Restwerkstück
CN109461693B (zh) 2017-09-06 2023-06-02 台湾积体电路制造股份有限公司 晶片传送装置、晶片处理系统及方法
JP7261000B2 (ja) * 2018-12-03 2023-04-19 キヤノン株式会社 容器、処理装置、異物除去方法、および物品の製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1513444A (en) * 1974-09-06 1978-06-07 Chemical Reactor Equip As Pick-up devices for lifting and moving semiconductor wafers
US4545327A (en) * 1982-08-27 1985-10-08 Anicon, Inc. Chemical vapor deposition apparatus
US4518349A (en) * 1983-12-01 1985-05-21 Better Semiconductor Processes (Bsp) Cantilevered boat-free semiconductor wafer handling system
JPS60153788U (ja) * 1984-03-21 1985-10-14 シャープ株式会社 位置検知センサ付ロボツトハンド
US5280983A (en) * 1985-01-22 1994-01-25 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
US5224809A (en) * 1985-01-22 1993-07-06 Applied Materials, Inc. Semiconductor processing system with robotic autoloader and load lock
DE3681799D1 (de) * 1985-01-22 1991-11-14 Applied Materials Inc Halbleiter-bearbeitungseinrichtung.
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
US4705951A (en) * 1986-04-17 1987-11-10 Varian Associates, Inc. Wafer processing system
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US4819167A (en) * 1987-04-20 1989-04-04 Applied Materials, Inc. System and method for detecting the center of an integrated circuit wafer
US5080549A (en) * 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
JPH01209739A (ja) * 1988-02-17 1989-08-23 Toshiba Corp 半導体素子吸引治具
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
US5280979A (en) * 1991-06-20 1994-01-25 Recif, S.A. Tip for a vacuum pipette with improved electrostatic discharge properties
US5445486A (en) * 1992-03-29 1995-08-29 Tokyo Electron Sagami Limited Substrate transferring apparatus
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
EP0597637B1 (en) * 1992-11-12 2000-08-23 Applied Materials, Inc. System and method for automated positioning of a substrate in a processing chamber
US5387067A (en) * 1993-01-14 1995-02-07 Applied Materials, Inc. Direct load/unload semiconductor wafer cassette apparatus and transfer system
EP0634787B1 (en) * 1993-07-15 1997-05-02 Applied Materials, Inc. Subsrate tray and ceramic blade for semiconductor processing apparatus
US5669644A (en) * 1995-11-13 1997-09-23 Kokusai Electric Co., Ltd. Wafer transfer plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8168017B2 (en) 2007-01-24 2012-05-01 Asml Holding N.V. Bonding silicon silicon carbide to glass ceramics

Also Published As

Publication number Publication date
JPH10181875A (ja) 1998-07-07
US6024393A (en) 2000-02-15
US6199927B1 (en) 2001-03-13

Similar Documents

Publication Publication Date Title
TW373285B (en) Robot blade for automatic handling of semiconductor substrate
AU569527B2 (en) Granular abrasive material
KR102422725B1 (ko) 플라즈마 환경들 내의 챔버 컴포넌트들을 위한 Y2O3-ZrO2 부식 저항성 재료
NO930680L (no) Fremgangsmaate og anordning for aa fjerne skade like under overflaten i halvledermaterialer ved hjelp av plasmaetsing
EP1055486A3 (en) Dressing apparatus and polishing apparatus
EP0684634A3 (en) Method of rough polishing semiconductor wafers to reduce surface roughness
SG53191G (en) Film for machining wafers
CA2294420A1 (en) A non-sticking diamond like nanocomposite composition
TW376350B (en) Process for polishing a semiconductor device substrate
TW428225B (en) A method of polishing a surface of a substrate, a method of manufacturing semiconductor device, and an apparatus of manufacturing the same
EP0778611A3 (en) End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
WO2002101797A3 (en) Megasonic cleaner and dryer system
EP0926706A3 (en) Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
EP1154049A4 (en) PROCESS FOR THE PRODUCTION OF MONOCRYSTAL SILICON CARBIDE
EP0547684A2 (en) Method of manufacturing a semiconductor body comprising a carrier wafer and a monocrystalline semiconducting top layer
WO2003052792A3 (en) Water carrier for semiconductor process tool
US5890951A (en) Utility wafer for chemical-mechanical planarization
EP0860238A3 (en) Polishing apparatus
WO2001039257A3 (fr) Couche de silicium tres sensible a l'oxygene et procede d'obtention de cette couche
ATE120807T1 (de) Werkzeug oder instrument mit einer verschleissresistenten hartschicht zum be- oder verarbeiten von organischem material.
EP0497497A3 (en) Low-contaminate work surface for processing semiconductor grade silicon
JPH07326597A (ja) シリコンウェーハ研磨用研磨剤及び研磨方法
WO2002081618A3 (en) Adsorbing and non-adsorbing surfaces for biological materials
JPS577923A (en) Manufacture of receiving table for processing single silicon crystal wafer
JPS5366164A (en) Susceptor for semiconductor wafer processing