TW373190B - Dielectric ceramic composition - Google Patents

Dielectric ceramic composition

Info

Publication number
TW373190B
TW373190B TW086110468A TW86110468A TW373190B TW 373190 B TW373190 B TW 373190B TW 086110468 A TW086110468 A TW 086110468A TW 86110468 A TW86110468 A TW 86110468A TW 373190 B TW373190 B TW 373190B
Authority
TW
Taiwan
Prior art keywords
dielectric ceramic
ceramic composition
main component
composition
inductive capacity
Prior art date
Application number
TW086110468A
Other languages
English (en)
Inventor
Tadahiro Minamikawa
Akira Ando
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Application granted granted Critical
Publication of TW373190B publication Critical patent/TW373190B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1254—Ceramic dielectrics characterised by the ceramic dielectric material based on niobium or tungsteen, tantalum oxides or niobates, tantalates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Ceramic Capacitors (AREA)
TW086110468A 1996-07-26 1997-07-23 Dielectric ceramic composition TW373190B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08197701A JP3087657B2 (ja) 1996-07-26 1996-07-26 誘電体磁器組成物

Publications (1)

Publication Number Publication Date
TW373190B true TW373190B (en) 1999-11-01

Family

ID=16378929

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110468A TW373190B (en) 1996-07-26 1997-07-23 Dielectric ceramic composition

Country Status (7)

Country Link
US (1) US5763346A (zh)
EP (1) EP0820968B1 (zh)
JP (1) JP3087657B2 (zh)
KR (1) KR100207900B1 (zh)
CN (1) CN1090372C (zh)
DE (1) DE69701209T2 (zh)
TW (1) TW373190B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426631B (zh) * 2005-02-07 2014-02-11 Hochiki Co 熱感知器及熱感應元件的製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3228175B2 (ja) * 1997-04-28 2001-11-12 株式会社村田製作所 圧電磁器組成物
JP2000516190A (ja) * 1997-05-30 2000-12-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ セラミック（多層）キャパシタ及び当該キャパシタに用いるセラミック組成物
WO1999018587A2 (en) * 1997-10-08 1999-04-15 Koninklijke Philips Electronics N.V. Ceramic multilayer capacitor
JP4396136B2 (ja) * 2003-05-21 2010-01-13 株式会社村田製作所 圧電磁器組成物およびそれを用いた圧電セラミック素子
JP3846464B2 (ja) * 2003-08-07 2006-11-15 松下電器産業株式会社 誘電体セラミック組成物およびこれを用いたセラミック電子部品
JP5087938B2 (ja) * 2007-02-01 2012-12-05 株式会社村田製作所 誘電体セラミック組成物及び積層セラミックコンデンサ
KR101575244B1 (ko) 2013-12-09 2015-12-08 현대자동차 주식회사 온도보상용 유전체 재료 및 이의 제조 방법
US9255034B1 (en) 2014-09-15 2016-02-09 Hyundai Motor Company Dielectric material for temperature compensation and method of preparing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548407B2 (zh) * 1973-08-15 1980-12-05
US4978646A (en) * 1989-03-03 1990-12-18 Corning Incorporated Capacitors and high dielectric constant ceramics therefor
JP2798105B2 (ja) * 1992-02-14 1998-09-17 松下電器産業株式会社 誘電体磁器組成物及び積層型マイクロ波デバイス
JP3479324B2 (ja) * 1993-08-19 2003-12-15 日本特殊陶業株式会社 マイクロ波誘電体磁器組成物及びその製造方法
DE69409477T2 (de) * 1993-12-27 1998-08-06 Ngk Spark Plug Co Mikrowellendielektrische keramische Zusammensetzung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI426631B (zh) * 2005-02-07 2014-02-11 Hochiki Co 熱感知器及熱感應元件的製造方法

Also Published As

Publication number Publication date
US5763346A (en) 1998-06-09
DE69701209D1 (de) 2000-03-02
KR100207900B1 (en) 1999-07-15
EP0820968A1 (en) 1998-01-28
CN1173024A (zh) 1998-02-11
KR980009198A (ko) 1998-04-30
EP0820968B1 (en) 2000-01-26
DE69701209T2 (de) 2000-09-28
JP3087657B2 (ja) 2000-09-11
CN1090372C (zh) 2002-09-04
JPH1036172A (ja) 1998-02-10

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Legal Events

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MK4A Expiration of patent term of an invention patent