JP3846464B2 - 誘電体セラミック組成物およびこれを用いたセラミック電子部品 - Google Patents
誘電体セラミック組成物およびこれを用いたセラミック電子部品 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims description 88
- 239000000919 ceramic Substances 0.000 title claims description 61
- 239000004020 conductor Substances 0.000 claims description 44
- 229910052709 silver Inorganic materials 0.000 claims description 31
- 239000004332 silver Substances 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 24
- 238000010304 firing Methods 0.000 claims description 14
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 10
- 238000010586 diagram Methods 0.000 claims description 8
- 239000005751 Copper oxide Substances 0.000 claims description 7
- 229910000431 copper oxide Inorganic materials 0.000 claims description 7
- 229910018068 Li 2 O Inorganic materials 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 239000011575 calcium Substances 0.000 claims description 5
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 2
- 239000000292 calcium oxide Substances 0.000 claims description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 2
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 31
- 239000000463 material Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 8
- 229910010293 ceramic material Inorganic materials 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000000498 ball milling Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- -1 B 2 O 3 Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000011268 mixed slurry Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Description
A:(x,y,z)=(0.48,0.184,0.336)
B:(x,y,z)=(0.48,0.22,0.30)
C:(x,y,z)=(0.44,0.24,0.32)
D:(x,y,z)=(0.44,0.20,0.36)
前記副成分のガラス組成物をuSiO 2 −vLi 2 O−wMO(u,v,wは重量比、u+v+w=100、ただしMはCa,Sr,Baから少なくとも一種以上)と表したときの三成分組成図において、u,vおよびwが下記のE,F,G,Hを頂点とする四角形の領域内にあることを特徴とする誘電体セラミック組成物であり、
E:(u,v,w)=(50,5,45)
F:(u,v,w)=(70,5,25)
G:(u,v,w)=(70,15,15)
H:(u,v,w)=(50,15,35)
これにより焼成時における誘電体セラミック組成物と銀との反応が抑えられ、銀を主成分とする導体層と同時焼成してもQ値の劣化が小さく、マイクロ波特性に優れた誘電体セラミック組成物が得られるという作用効果を有する。
以下、実施の形態1を用いて、本発明の特に請求項1,3に記載の発明について説明する。
以下、実施の形態2を用いて、本発明の特に請求項2に記載の発明について説明する。
2 ストリップライン導体層
3 結合導体層
4 シールド導体層
5 端子電極(グランド)
6 端子電極(信号)
11 本発明の主成分であるBiO3/2−CaO−NbO5/2組成物の範囲
12 特許2798105号公報に示されている組成物の範囲
13 本発明の副成分であるガラス組成物の範囲
Claims (3)
- 酸化ビスマス、酸化カルシウムおよび酸化ニオブよりなる組成物をxBiO3/2−yCaO−zNbO5/2(x,y,zはモル比、x+y+z=1.0)と表したときの三成分組成図において、x,yおよびzが下記のA,B,C,Dを頂点とする四角形の領域内にある主成分に対し、副成分として少なくともSiO2,Li2O,MO(ただしMはCa,Sr,Baから少なくとも一種以上)を含むガラス組成物を0.05〜2重量%含有し、
A:(x,y,z)=(0.48,0.184,0.336)
B:(x,y,z)=(0.48,0.22,0.30)
C:(x,y,z)=(0.44,0.24,0.32)
D:(x,y,z)=(0.44,0.20,0.36)
前記副成分のガラス組成物をuSiO 2 −vLi 2 O−wMO(u,v,wは重量比、u+v+w=100、ただしMはCa,Sr,Baから少なくとも一種以上)と表したときの三成分組成図において、u,vおよびwが下記のE,F,G,Hを頂点とする四角形の領域内にあることを特徴とする誘電体セラミック組成物。
E:(u,v,w)=(50,5,45)
F:(u,v,w)=(70,5,25)
G:(u,v,w)=(70,15,15)
H:(u,v,w)=(50,15,35) - 請求項1に記載の誘電体セラミック組成物に対して、第二の副成分として酸化銅をCuOに換算して0.1重量%以下を主成分100重量%に対して含有させた誘電体セラミック組成物。
- 請求項1〜2のいずれか一つに記載の誘電体セラミック組成物からなる誘電体層と、銀を主成分とする導体層とを積層した後一体焼成して得られた積層体からなるセラミック電子部品。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003288763A JP3846464B2 (ja) | 2003-08-07 | 2003-08-07 | 誘電体セラミック組成物およびこれを用いたセラミック電子部品 |
CNB2004100703535A CN1293573C (zh) | 2003-08-07 | 2004-07-29 | 介电陶瓷组合物和采用其的陶瓷电子部件 |
EP04018587A EP1505043A3 (en) | 2003-08-07 | 2004-08-05 | Dielectric ceramic composition and ceramic electronic component employing the same |
US10/912,236 US7098160B2 (en) | 2003-08-07 | 2004-08-06 | Dielectric ceramic composition and ceramic electronic component employing the same |
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JP2003288763A JP3846464B2 (ja) | 2003-08-07 | 2003-08-07 | 誘電体セラミック組成物およびこれを用いたセラミック電子部品 |
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JP3846464B2 true JP3846464B2 (ja) | 2006-11-15 |
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US (1) | US7098160B2 (ja) |
EP (1) | EP1505043A3 (ja) |
JP (1) | JP3846464B2 (ja) |
CN (1) | CN1293573C (ja) |
Families Citing this family (8)
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CN100522873C (zh) * | 2005-12-30 | 2009-08-05 | 中国科学院上海硅酸盐研究所 | 一种铋层状结构弛豫铁电陶瓷材料及其制备方法 |
CN102531558A (zh) * | 2011-12-31 | 2012-07-04 | 嘉兴佳利电子股份有限公司 | 一种低温烧结微波介质陶瓷材料及其制备方法 |
CN103145404B (zh) * | 2013-04-02 | 2014-10-22 | 清华大学深圳研究生院 | 一种低温烧结的中介电常数微波介质陶瓷及其制备方法 |
CN104310985B (zh) * | 2014-10-16 | 2016-07-06 | 桂林理工大学 | 超低介电常数微波介电陶瓷Ca2PO4F及其制备方法 |
CN104311030B (zh) * | 2014-10-17 | 2015-11-11 | 三峡大学 | 一种温度稳定型超低介电常数微波介电陶瓷及其制备方法 |
CN108585515B (zh) * | 2018-05-09 | 2021-07-20 | 同济大学 | 高储能密度的铌酸铋基玻璃陶瓷材料及其制备方法和应用 |
CN111646796B (zh) * | 2020-05-19 | 2021-08-06 | 电子科技大学 | 低温烧结低介微波陶瓷材料Sr2VxO7及其制备方法 |
CN113149645B (zh) * | 2021-03-31 | 2023-08-15 | 中国振华集团云科电子有限公司 | 一种低温烧结温度稳定型复合微波介质陶瓷及其制备方法 |
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JPS51101900A (ja) * | 1975-03-05 | 1976-09-08 | Tdk Electronics Co Ltd | |
US4978646A (en) * | 1989-03-03 | 1990-12-18 | Corning Incorporated | Capacitors and high dielectric constant ceramics therefor |
US5004713A (en) * | 1989-07-05 | 1991-04-02 | Corning Incorporated | Frequency stable NPO ceramics |
JP2798105B2 (ja) | 1992-02-14 | 1998-09-17 | 松下電器産業株式会社 | 誘電体磁器組成物及び積層型マイクロ波デバイス |
US5273943A (en) * | 1992-02-28 | 1993-12-28 | Matsushita Electric Industrial Co., Ltd. | Dielectric ceramic compositions and microwave devices using the same |
JPH0757540A (ja) * | 1993-06-30 | 1995-03-03 | Matsushita Electric Ind Co Ltd | 誘電体磁器組成物とそれを用いた積層型誘電体部品 |
JPH07312511A (ja) * | 1994-05-19 | 1995-11-28 | Matsushita Electric Ind Co Ltd | マイクロ波用多層複合基板およびその製造方法 |
US5629252A (en) * | 1995-06-15 | 1997-05-13 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing a dielectric ceramic composition dielectric ceramic and multilayer high frequency device |
JP3087657B2 (ja) * | 1996-07-26 | 2000-09-11 | 株式会社村田製作所 | 誘電体磁器組成物 |
JP2000306762A (ja) * | 1999-04-22 | 2000-11-02 | Matsushita Electric Ind Co Ltd | 積層セラミックコンデンサ |
GB2371775B (en) * | 2000-12-19 | 2002-12-31 | Murata Manufacturing Co | Composite multilayer ceramic electronic parts and method of manfacturing the same |
JP2003119076A (ja) * | 2001-10-10 | 2003-04-23 | Matsushita Electric Ind Co Ltd | 誘電体セラミック組成物およびこれを用いたセラミック電子部品 |
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- 2003-08-07 JP JP2003288763A patent/JP3846464B2/ja not_active Expired - Fee Related
-
2004
- 2004-07-29 CN CNB2004100703535A patent/CN1293573C/zh not_active Expired - Fee Related
- 2004-08-05 EP EP04018587A patent/EP1505043A3/en not_active Withdrawn
- 2004-08-06 US US10/912,236 patent/US7098160B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US7098160B2 (en) | 2006-08-29 |
JP2005053761A (ja) | 2005-03-03 |
EP1505043A3 (en) | 2009-05-06 |
EP1505043A2 (en) | 2005-02-09 |
CN1581368A (zh) | 2005-02-16 |
CN1293573C (zh) | 2007-01-03 |
US20050030701A1 (en) | 2005-02-10 |
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