TW372901B - Chemical and mechanical polishing apparatus - Google Patents
Chemical and mechanical polishing apparatusInfo
- Publication number
- TW372901B TW372901B TW087101462A TW87101462A TW372901B TW 372901 B TW372901 B TW 372901B TW 087101462 A TW087101462 A TW 087101462A TW 87101462 A TW87101462 A TW 87101462A TW 372901 B TW372901 B TW 372901B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- carrier
- pad
- adhered
- thickness
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 4
- 239000004809 Teflon Substances 0.000 abstract 2
- 229920006362 Teflon® Polymers 0.000 abstract 2
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3842797A JPH10217112A (ja) | 1997-02-06 | 1997-02-06 | Cmp装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW372901B true TW372901B (en) | 1999-11-01 |
Family
ID=12525025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW087101462A TW372901B (en) | 1997-02-06 | 1998-02-05 | Chemical and mechanical polishing apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US6030488A (zh) |
EP (1) | EP0857541A3 (zh) |
JP (1) | JPH10217112A (zh) |
KR (1) | KR19980071123A (zh) |
TW (1) | TW372901B (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11138429A (ja) * | 1997-11-11 | 1999-05-25 | Sony Corp | 研磨装置 |
JPH11204468A (ja) * | 1998-01-09 | 1999-07-30 | Speedfam Co Ltd | 半導体ウエハの表面平坦化装置 |
JP2000141215A (ja) | 1998-11-05 | 2000-05-23 | Sony Corp | 平坦化研磨装置及び平坦化研磨方法 |
WO2000069595A2 (en) * | 1999-05-19 | 2000-11-23 | Speedfam-Ipec Corporation | Method and apparatus for automatically adjusting the contour of a wafer carrier surface |
US6340326B1 (en) | 2000-01-28 | 2002-01-22 | Lam Research Corporation | System and method for controlled polishing and planarization of semiconductor wafers |
US6705930B2 (en) * | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
DE10009656B4 (de) * | 2000-02-24 | 2005-12-08 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
WO2001091971A1 (en) * | 2000-05-27 | 2001-12-06 | Rodel Holdings, Inc. | Polishing pads for chemical mechanical planarization |
US6652357B1 (en) | 2000-09-22 | 2003-11-25 | Lam Research Corporation | Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing |
US7481695B2 (en) | 2000-08-22 | 2009-01-27 | Lam Research Corporation | Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head |
US6640155B2 (en) | 2000-08-22 | 2003-10-28 | Lam Research Corporation | Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head |
US6585572B1 (en) | 2000-08-22 | 2003-07-01 | Lam Research Corporation | Subaperture chemical mechanical polishing system |
US6471566B1 (en) | 2000-09-18 | 2002-10-29 | Lam Research Corporation | Sacrificial retaining ring CMP system and methods for implementing the same |
US6443815B1 (en) | 2000-09-22 | 2002-09-03 | Lam Research Corporation | Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing |
JP4009087B2 (ja) * | 2001-07-06 | 2007-11-14 | アプライド マテリアルズ インコーポレイテッド | 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法 |
US6530829B1 (en) | 2001-08-30 | 2003-03-11 | Micron Technology, Inc. | CMP pad having isolated pockets of continuous porosity and a method for using such pad |
US6736720B2 (en) * | 2001-12-26 | 2004-05-18 | Lam Research Corporation | Apparatus and methods for controlling wafer temperature in chemical mechanical polishing |
US6592437B1 (en) | 2001-12-26 | 2003-07-15 | Lam Research Corporation | Active gimbal ring with internal gel and methods for making same |
US6937915B1 (en) | 2002-03-28 | 2005-08-30 | Lam Research Corporation | Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control |
CA2519942A1 (en) * | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (cmp) |
US20070215280A1 (en) * | 2006-03-15 | 2007-09-20 | Sandhu Rajinder R | Semiconductor surface processing |
JP5008922B2 (ja) * | 2006-07-31 | 2012-08-22 | セツ子 近藤 | ロアチャックパッド |
US20080125021A1 (en) * | 2006-11-27 | 2008-05-29 | United Microelectronics Corp. | Disk holder and disk rotating device having the same |
JP2010118424A (ja) * | 2008-11-12 | 2010-05-27 | Disco Abrasive Syst Ltd | 薄板状ワークの搬送装置 |
US20180281151A1 (en) * | 2017-03-30 | 2018-10-04 | Applied Materials, Inc. | Adhesive-less carriers for chemical mechanical polishing |
KR20210061273A (ko) * | 2019-11-19 | 2021-05-27 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판을 보유 지지하기 위한 톱링 및 기판 처리 장치 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62297063A (ja) * | 1986-02-21 | 1987-12-24 | Hitachi Ltd | 薄片状部材研磨用真空チヤツク装置 |
JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
JPH03173129A (ja) * | 1989-12-01 | 1991-07-26 | Hitachi Ltd | 研磨装置 |
JP2632738B2 (ja) * | 1990-04-27 | 1997-07-23 | 信越半導体 株式会社 | パッキングパッド、および半導体ウェーハの研磨方法 |
JP3024373B2 (ja) * | 1992-07-07 | 2000-03-21 | 信越半導体株式会社 | シート状弾性発泡体及びウェーハ研磨加工用治具 |
JP3463345B2 (ja) * | 1994-05-23 | 2003-11-05 | ソニー株式会社 | 研磨装置および研磨方法と張り合わせ方法 |
-
1997
- 1997-02-06 JP JP3842797A patent/JPH10217112A/ja active Pending
-
1998
- 1998-01-26 US US09/013,250 patent/US6030488A/en not_active Expired - Fee Related
- 1998-01-27 EP EP98101376A patent/EP0857541A3/de not_active Withdrawn
- 1998-02-05 TW TW087101462A patent/TW372901B/zh active
- 1998-02-06 KR KR1019980003370A patent/KR19980071123A/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0857541A2 (en) | 1998-08-12 |
JPH10217112A (ja) | 1998-08-18 |
KR19980071123A (ko) | 1998-10-26 |
US6030488A (en) | 2000-02-29 |
EP0857541A3 (de) | 1999-02-03 |
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