TW371786B - Ultrahigh frequency electronic component and method of manufacturing the same - Google Patents

Ultrahigh frequency electronic component and method of manufacturing the same

Info

Publication number
TW371786B
TW371786B TW086106348A TW86106348A TW371786B TW 371786 B TW371786 B TW 371786B TW 086106348 A TW086106348 A TW 086106348A TW 86106348 A TW86106348 A TW 86106348A TW 371786 B TW371786 B TW 371786B
Authority
TW
Taiwan
Prior art keywords
ultrahigh frequency
electronic component
sealing layer
frequency electronic
manufacturing
Prior art date
Application number
TW086106348A
Other languages
English (en)
Inventor
Seiji Ichikawa
Tomoaki Hirokawa
Tomoaki Kimura
Taku Sato
Junichi Tanaka
Kenji Uchida
Original Assignee
Nec Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Electronics Corp filed Critical Nec Electronics Corp
Application granted granted Critical
Publication of TW371786B publication Critical patent/TW371786B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW086106348A 1996-05-14 1997-05-13 Ultrahigh frequency electronic component and method of manufacturing the same TW371786B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8118831A JP2871591B2 (ja) 1996-05-14 1996-05-14 高周波用電子部品および高周波用電子部品の製造方法

Publications (1)

Publication Number Publication Date
TW371786B true TW371786B (en) 1999-10-11

Family

ID=14746240

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086106348A TW371786B (en) 1996-05-14 1997-05-13 Ultrahigh frequency electronic component and method of manufacturing the same

Country Status (5)

Country Link
US (2) US5889232A (zh)
EP (1) EP0807971A3 (zh)
JP (1) JP2871591B2 (zh)
KR (1) KR100291227B1 (zh)
TW (1) TW371786B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787389B1 (en) * 1997-10-09 2004-09-07 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having pads for connecting a semiconducting element to a mother board
US6740960B1 (en) 1997-10-31 2004-05-25 Micron Technology, Inc. Semiconductor package including flex circuit, interconnects and dense array external contacts
TW469611B (en) * 1998-03-12 2001-12-21 Delta Electronics Inc Packaging method for electronic device
US6384487B1 (en) * 1999-12-06 2002-05-07 Micron Technology, Inc. Bow resistant plastic semiconductor package and method of fabrication
US6700210B1 (en) 1999-12-06 2004-03-02 Micron Technology, Inc. Electronic assemblies containing bow resistant semiconductor packages
NL1016260C2 (nl) 2000-02-07 2001-08-08 Thales Nederland Bv Behuizing voor microgolfcomponenten.
SE0101107D0 (sv) * 2001-03-28 2001-03-28 Ericsson Telefon Ab L M Encapsulation arrangement
JP2003100782A (ja) * 2001-09-20 2003-04-04 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置
JP2003133484A (ja) * 2001-10-30 2003-05-09 Tokai Rika Co Ltd 半導体装置及びその製造方法
US20090097222A1 (en) * 2004-06-25 2009-04-16 Wilfried Babutzka Electrical Subassembly Comprising a Protective Sheathing
US7435625B2 (en) * 2005-10-24 2008-10-14 Freescale Semiconductor, Inc. Semiconductor device with reduced package cross-talk and loss
JP2007180160A (ja) * 2005-12-27 2007-07-12 Showa Denko Kk コンデンサチップ及びその製造方法
JP2008098400A (ja) * 2006-10-12 2008-04-24 Mitsubishi Electric Corp 電界効果型トランジスタ及びその製造方法
DE102007008464B4 (de) * 2007-02-19 2012-01-05 Hottinger Baldwin Messtechnik Gmbh Optischer Dehnungsmessstreifen
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
JP5088104B2 (ja) * 2007-11-13 2012-12-05 三菱電機株式会社 半導体装置及びその製造方法
US20120249375A1 (en) * 2008-05-23 2012-10-04 Nokia Corporation Magnetically controlled polymer nanocomposite material and methods for applying and curing same, and nanomagnetic composite for RF applications
US7812463B2 (en) * 2008-07-10 2010-10-12 National Semiconductor Corporation Packaging integrated circuits for high stress environments
KR20120000805A (ko) 2010-06-28 2012-01-04 삼성전자주식회사 반도체 패키지의 몰딩 방법
KR20140068654A (ko) * 2012-11-28 2014-06-09 삼성전기주식회사 전자부품 패키지 및 전자부품 패키지의 제조방법
US9099391B2 (en) * 2013-03-14 2015-08-04 Infineon Technologies Austria Ag Semiconductor package with top-side insulation layer
US10026701B1 (en) * 2014-07-28 2018-07-17 National Technology & Engineering Solutions Of Sandia, Llc Electromagnetic isolation structure
WO2016084417A1 (ja) * 2014-11-28 2016-06-02 京セラ株式会社 圧電部品

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3670091A (en) * 1971-05-20 1972-06-13 Sqrague Electric Co Encapsulated electrical components with protective pre-coat containing collapsible microspheres
JPS61166138A (ja) * 1985-01-18 1986-07-26 Matsushita Electronics Corp 半導体装置の製造方法
JPS61237455A (ja) * 1985-04-15 1986-10-22 Sony Corp モ−ルド電気部品
JPS6331149A (ja) * 1986-07-25 1988-02-09 Fujitsu Ltd 半導体装置
JPS6379353A (ja) * 1986-09-24 1988-04-09 Hitachi Ltd 樹脂封止型半導体装置
JPH0793392B2 (ja) * 1986-10-25 1995-10-09 新光電気工業株式会社 超高周波素子用パツケ−ジ
JPS63177435A (ja) * 1987-01-17 1988-07-21 Mitsubishi Electric Corp 半導体素子の電極構造
JPH01192154A (ja) * 1988-01-28 1989-08-02 Nippon Motoroola Kk リードフレーム
JP2603507B2 (ja) * 1988-03-28 1997-04-23 ローム株式会社 半導体装置のパッケージ構造およびその製造方法
JP3059560B2 (ja) * 1991-12-25 2000-07-04 株式会社日立製作所 半導体装置の製造方法およびそれに使用される成形材料
JPH05251591A (ja) * 1992-03-06 1993-09-28 Hitachi Ltd 半導体装置の実装構造
JP2988117B2 (ja) * 1992-03-30 1999-12-06 日本電気株式会社 樹脂封止型半導体装置
JPH08111478A (ja) * 1994-10-06 1996-04-30 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
US5889232A (en) 1999-03-30
KR970077384A (ko) 1997-12-12
US5970322A (en) 1999-10-19
JP2871591B2 (ja) 1999-03-17
EP0807971A3 (en) 1999-07-28
JPH09307028A (ja) 1997-11-28
EP0807971A2 (en) 1997-11-19
KR100291227B1 (ko) 2001-07-12

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