TW371347B - Structure of rotary arm and device chuck part of a device handler - Google Patents
Structure of rotary arm and device chuck part of a device handlerInfo
- Publication number
- TW371347B TW371347B TW085100154A TW85100154A TW371347B TW 371347 B TW371347 B TW 371347B TW 085100154 A TW085100154 A TW 085100154A TW 85100154 A TW85100154 A TW 85100154A TW 371347 B TW371347 B TW 371347B
- Authority
- TW
- Taiwan
- Prior art keywords
- guide rail
- vicinity above
- rotary arm
- dropping
- hook
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34109695 | 1995-12-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW371347B true TW371347B (en) | 1999-10-01 |
Family
ID=18343228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085100154A TW371347B (en) | 1995-12-27 | 1996-01-08 | Structure of rotary arm and device chuck part of a device handler |
Country Status (6)
Country | Link |
---|---|
US (1) | US5789685A (zh) |
KR (1) | KR100206641B1 (zh) |
DE (1) | DE19654231C2 (zh) |
MY (1) | MY112691A (zh) |
SG (1) | SG64413A1 (zh) |
TW (1) | TW371347B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI623750B (zh) * | 2017-02-23 | 2018-05-11 | 華邦電子股份有限公司 | 雙吸嘴式轉塔機台 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW449570B (en) * | 1998-11-28 | 2001-08-11 | Mirae Corp | A rotator for a module integrated circuit (IC) handler |
KR100334655B1 (ko) * | 1998-11-30 | 2002-06-20 | 정문술 | 모듈아이씨핸들러의모듈아이씨및캐리어핸들링방법 |
DE19953949A1 (de) * | 1999-11-09 | 2001-05-17 | Asys Gmbh & Co Kg | Vorrichtung zum Bestücken von Teileträgern für Mikrosysteme |
US6967475B2 (en) * | 2004-01-22 | 2005-11-22 | Asm Assembly Automation Ltd. | Device transfer mechanism for a test handler |
DE102006020513B4 (de) * | 2006-05-03 | 2014-07-03 | Martin Prasch | Hochleistungs-Standard-Gerät zum flexiblen Transportieren und Handhaben verschieden großer Halbleiterbauelemente |
US9636713B2 (en) | 2013-01-07 | 2017-05-02 | Electro Scientific Industries, Inc. | Systems and methods for handling components |
CN105329662A (zh) * | 2015-10-19 | 2016-02-17 | 张利平 | 一种自动收拢夹砖机 |
KR102066896B1 (ko) * | 2016-04-14 | 2020-01-16 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자부품의 특성 측정용 반송 장치 및 전자부품의 특성 측정용 수용부재의 제조 방법 |
CN108891923B (zh) * | 2018-08-15 | 2020-04-21 | 林杰 | 一种操作方便的插卡式自动进卡装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3750878A (en) * | 1971-11-15 | 1973-08-07 | Dixon K Corp | Electrical component testing apparatus |
DE4023772A1 (de) * | 1989-08-31 | 1991-03-14 | Gold Star Electronics | Vorrichtung zum beschicken und entladen von huelsen fuer ein ic-pruefgeraet |
JPH0567652A (ja) * | 1991-09-05 | 1993-03-19 | Tokyo Electron Ltd | プローブ装置 |
US6019564A (en) * | 1995-10-27 | 2000-02-01 | Advantest Corporation | Semiconductor device transporting and handling apparatus |
-
1996
- 1996-01-08 TW TW085100154A patent/TW371347B/zh active
- 1996-02-26 KR KR1019960004571A patent/KR100206641B1/ko not_active IP Right Cessation
- 1996-12-23 DE DE19654231A patent/DE19654231C2/de not_active Expired - Fee Related
- 1996-12-24 MY MYPI96005453A patent/MY112691A/en unknown
- 1996-12-26 US US08/773,105 patent/US5789685A/en not_active Expired - Fee Related
- 1996-12-26 SG SG1996011916A patent/SG64413A1/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI623750B (zh) * | 2017-02-23 | 2018-05-11 | 華邦電子股份有限公司 | 雙吸嘴式轉塔機台 |
Also Published As
Publication number | Publication date |
---|---|
MY112691A (en) | 2001-07-30 |
DE19654231C2 (de) | 1999-07-22 |
KR970048582A (ko) | 1997-07-29 |
KR100206641B1 (ko) | 1999-07-01 |
DE19654231A1 (de) | 1997-07-03 |
SG64413A1 (en) | 1999-04-27 |
US5789685A (en) | 1998-08-04 |
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