TW370620B - Testing head allocating apparatus for semiconductor element testing device - Google Patents

Testing head allocating apparatus for semiconductor element testing device

Info

Publication number
TW370620B
TW370620B TW087112165A TW87112165A TW370620B TW 370620 B TW370620 B TW 370620B TW 087112165 A TW087112165 A TW 087112165A TW 87112165 A TW87112165 A TW 87112165A TW 370620 B TW370620 B TW 370620B
Authority
TW
Taiwan
Prior art keywords
testing head
testing
arms
wheeling
semiconductor element
Prior art date
Application number
TW087112165A
Other languages
English (en)
Inventor
Makoto Nemoto
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Application granted granted Critical
Publication of TW370620B publication Critical patent/TW370620B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW087112165A 1997-07-25 1998-07-24 Testing head allocating apparatus for semiconductor element testing device TW370620B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20025597 1997-07-25

Publications (1)

Publication Number Publication Date
TW370620B true TW370620B (en) 1999-09-21

Family

ID=16421340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087112165A TW370620B (en) 1997-07-25 1998-07-24 Testing head allocating apparatus for semiconductor element testing device

Country Status (6)

Country Link
US (1) US6271657B1 (zh)
KR (1) KR100352493B1 (zh)
CN (1) CN1120501C (zh)
DE (1) DE19833500B4 (zh)
SG (1) SG70647A1 (zh)
TW (1) TW370620B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100368574B1 (ko) * 2000-06-22 2003-01-24 메카텍스 (주) 피씨 베이스 모듈아이씨 테스트 핸들러의 위치변환장치
MY127154A (en) * 2000-09-22 2006-11-30 Intest Corp Apparatus and method for balancing and for providing a compliant range to a test head
US6646431B1 (en) 2002-01-22 2003-11-11 Elite E/M, Inc. Test head manipulator
KR100481707B1 (ko) * 2002-04-03 2005-04-11 주식회사 넥사이언 히팅챔버 내에서의 테스트 트레이 이송장치
EP1549961B1 (en) * 2002-10-02 2007-06-13 inTEST Corporation Test head positioning apparatus
US7235964B2 (en) * 2003-03-31 2007-06-26 Intest Corporation Test head positioning system and method
US6771062B1 (en) * 2003-05-14 2004-08-03 Advantest Corporation Apparatus for supporting and manipulating a testhead in an automatic test equipment system
US20060113444A1 (en) * 2004-10-29 2006-06-01 Edwin Parsons Post driver safety latch
US20060237286A1 (en) * 2005-04-25 2006-10-26 Ecrm Incorporated System and method for positioning imaging plates within a cassette tray
KR101251559B1 (ko) * 2007-04-13 2013-04-08 삼성테크윈 주식회사 칩마운터용 백업테이블
KR100910168B1 (ko) * 2007-04-16 2009-07-31 볼보 컨스트럭션 이키프먼트 홀딩 스웨덴 에이비 웨이트 밸런싱을 갖는 높낮이 조절장치가 구비된 중장비용콘솔박스
US20110248738A1 (en) * 2010-04-12 2011-10-13 Sze Chak Tong Testing apparatus for electronic devices
TWI395633B (zh) * 2010-04-23 2013-05-11 私立中原大學 肘節式定位平台
US20130048149A1 (en) * 2011-08-25 2013-02-28 Rong-Cheng Liu Woodworking Machining Apparatus
CN103292124B (zh) * 2013-04-09 2015-12-09 广东省东莞市质量监督检测中心 一种斜度测试装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705447A (en) * 1983-08-11 1987-11-10 Intest Corporation Electronic test head positioner for test systems
DE3382550D1 (de) 1982-08-25 1992-05-27 Intest Corp Einstellvorrichtung fuer elektronische testkoepfe.
US5149029A (en) 1982-08-25 1992-09-22 Intest Corporation Electronic test head positioner for test systems
EP0237697B1 (en) 1982-08-25 1993-12-29 InTest Corporation Electronic test head positioner for test systems
DE3526137C2 (de) 1985-07-22 1994-07-07 Heigl Helmuth Testkopf-Manipulator
DE3615941A1 (de) 1986-05-12 1987-11-19 Willberg Hans Heinrich Geraet zum pruefen von elektronischen bauelementen, insbesondere ic's
DE3617741A1 (de) 1986-05-27 1987-12-03 Heigl Helmuth Handhabungsvorrichtung
JP2578084B2 (ja) 1986-11-25 1997-02-05 東京エレクトロン株式会社 ウエハプローバ
DE4007011C2 (de) 1990-03-06 1999-11-18 Helmuth Heigl Positioniervorrichtung
US5506512A (en) 1993-11-25 1996-04-09 Tokyo Electron Limited Transfer apparatus having an elevator and prober using the same
JP2967798B2 (ja) * 1993-12-16 1999-10-25 株式会社東京精密 ウエハプローバ
KR960019641A (ko) * 1994-11-24 1996-06-17 오우라 히로시 테스트·헤드 접속 장치를 장비한 반도체 시험 장치
US5606262A (en) 1995-06-07 1997-02-25 Teradyne, Inc. Manipulator for automatic test equipment test head

Also Published As

Publication number Publication date
DE19833500B4 (de) 2004-11-18
CN1208935A (zh) 1999-02-24
SG70647A1 (en) 2000-02-22
KR100352493B1 (ko) 2002-11-18
KR19990014185A (ko) 1999-02-25
DE19833500A1 (de) 1999-03-11
CN1120501C (zh) 2003-09-03
US6271657B1 (en) 2001-08-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees