TW368677B - Semiconductor device and method for making the same - Google Patents

Semiconductor device and method for making the same

Info

Publication number
TW368677B
TW368677B TW087107899A TW87107899A TW368677B TW 368677 B TW368677 B TW 368677B TW 087107899 A TW087107899 A TW 087107899A TW 87107899 A TW87107899 A TW 87107899A TW 368677 B TW368677 B TW 368677B
Authority
TW
Taiwan
Prior art keywords
movable plate
making
same
semiconductor device
fingers
Prior art date
Application number
TW087107899A
Other languages
English (en)
Inventor
Ronald James Gutteridge
Daniel N Koury Jr
Daniel Joseph Koch
Jonathan Hale Hammond
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW368677B publication Critical patent/TW368677B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
TW087107899A 1997-07-30 1998-05-21 Semiconductor device and method for making the same TW368677B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/903,087 US5914521A (en) 1997-07-30 1997-07-30 Sensor devices having a movable structure

Publications (1)

Publication Number Publication Date
TW368677B true TW368677B (en) 1999-09-01

Family

ID=25416922

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087107899A TW368677B (en) 1997-07-30 1998-05-21 Semiconductor device and method for making the same

Country Status (6)

Country Link
US (1) US5914521A (zh)
JP (1) JP4262327B2 (zh)
KR (1) KR100489157B1 (zh)
CN (1) CN1145800C (zh)
DE (1) DE19830476B4 (zh)
TW (1) TW368677B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6037211A (en) * 1997-05-05 2000-03-14 Vanguard International Semiconductor Corporation Method of fabricating contact holes in high density integrated circuits using polysilicon landing plug and self-aligned etching processes
US6228275B1 (en) * 1998-12-10 2001-05-08 Motorola, Inc. Method of manufacturing a sensor
DE19949605A1 (de) * 1999-10-15 2001-04-19 Bosch Gmbh Robert Beschleunigungssensor
US6677225B1 (en) * 2000-07-14 2004-01-13 Zyvex Corporation System and method for constraining totally released microcomponents
DE10055421A1 (de) * 2000-11-09 2002-05-29 Bosch Gmbh Robert Verfahren zur Erzeugung einer mikromechanischen Struktur und mikromechanische Struktur
KR100418624B1 (ko) * 2001-02-12 2004-02-11 (주) 인텔리마이크론즈 자이로스코프 및 그 제조 방법
DK1423714T3 (da) * 2001-09-04 2006-11-06 Tokyo Electron Ltd Mikrostruktur med bevægelig masse
US7232701B2 (en) * 2005-01-04 2007-06-19 Freescale Semiconductor, Inc. Microelectromechanical (MEM) device with a protective cap that functions as a motion stop
JP2011174881A (ja) * 2010-02-25 2011-09-08 Asahi Kasei Electronics Co Ltd 静電容量型加速度センサ
WO2013071118A1 (en) * 2011-11-09 2013-05-16 Robert Bosch Gmbh Proof mass positioning features having curved contact surfaces
FR3000484B1 (fr) * 2012-12-27 2017-11-10 Tronic's Microsystems Dispositif micro-electromecanique comprenant une masse mobile apte a se deplacer hors du plan
US9638712B2 (en) * 2015-01-22 2017-05-02 Nxp Usa, Inc. MEMS device with over-travel stop structure and method of fabrication
JP2020024098A (ja) * 2018-08-06 2020-02-13 セイコーエプソン株式会社 物理量センサー、センサーデバイス、電子機器、および移動体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4882933A (en) * 1988-06-03 1989-11-28 Novasensor Accelerometer with integral bidirectional shock protection and controllable viscous damping
DE4309917A1 (de) * 1992-03-30 1993-10-07 Awa Microelectronics Verfahren zur Herstellung von Siliziummikrostrukturen sowie Siliziummikrostruktur
US5181156A (en) * 1992-05-14 1993-01-19 Motorola Inc. Micromachined capacitor structure and method for making
JP3385688B2 (ja) * 1993-12-13 2003-03-10 株式会社デンソー 半導体ヨーレートセンサおよびその製造方法
US5542295A (en) * 1994-12-01 1996-08-06 Analog Devices, Inc. Apparatus to minimize stiction in micromachined structures

Also Published As

Publication number Publication date
KR100489157B1 (ko) 2006-05-11
DE19830476B4 (de) 2007-07-05
JP4262327B2 (ja) 2009-05-13
DE19830476A1 (de) 1999-02-04
US5914521A (en) 1999-06-22
CN1213778A (zh) 1999-04-14
CN1145800C (zh) 2004-04-14
KR19990014288A (ko) 1999-02-25
JPH1168122A (ja) 1999-03-09

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Legal Events

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MK4A Expiration of patent term of an invention patent