FR2747841B1 - Procede de fabrication d'elements semi-conducteurs presentant des structures micromecaniques - Google Patents

Procede de fabrication d'elements semi-conducteurs presentant des structures micromecaniques

Info

Publication number
FR2747841B1
FR2747841B1 FR9704891A FR9704891A FR2747841B1 FR 2747841 B1 FR2747841 B1 FR 2747841B1 FR 9704891 A FR9704891 A FR 9704891A FR 9704891 A FR9704891 A FR 9704891A FR 2747841 B1 FR2747841 B1 FR 2747841B1
Authority
FR
France
Prior art keywords
semiconductor elements
micromechanical structures
producing semiconductor
wafer
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9704891A
Other languages
English (en)
Other versions
FR2747841A1 (fr
Inventor
Franz Laermer
Andrea Schilp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2747841A1 publication Critical patent/FR2747841A1/fr
Application granted granted Critical
Publication of FR2747841B1 publication Critical patent/FR2747841B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
FR9704891A 1996-04-23 1997-04-21 Procede de fabrication d'elements semi-conducteurs presentant des structures micromecaniques Expired - Fee Related FR2747841B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996116014 DE19616014B4 (de) 1996-04-23 1996-04-23 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen

Publications (2)

Publication Number Publication Date
FR2747841A1 FR2747841A1 (fr) 1997-10-24
FR2747841B1 true FR2747841B1 (fr) 2005-09-02

Family

ID=7792094

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9704891A Expired - Fee Related FR2747841B1 (fr) 1996-04-23 1997-04-21 Procede de fabrication d'elements semi-conducteurs presentant des structures micromecaniques

Country Status (3)

Country Link
DE (1) DE19616014B4 (fr)
FR (1) FR2747841B1 (fr)
GB (1) GB2312553B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616970B4 (de) * 1996-04-27 2012-04-12 Robert Bosch Gmbh Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen
DE10136219A1 (de) * 2001-07-25 2003-02-06 Conti Temic Microelectronic Verfahren zur Dichtigkeitsprüfung von kapazitiven Sensoren
DE10350460B4 (de) * 2003-10-29 2006-07-13 X-Fab Semiconductor Foundries Ag Verfahren zur Herstellung von mikromechanische und/ oder mikroelektronische Strukturen aufweisenden Halbleiterbauelementen, die durch das feste Verbinden von mindestens zwei Halbleiterscheiben entstehen, und entsprechende Anordnung
DE102007060785B4 (de) * 2007-12-17 2011-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines (Vielfach-) Bauelements auf Basis ultraplanarer Metallstrukturen
CN101633490B (zh) * 2008-07-25 2014-06-04 亚太优势微系统股份有限公司 具有微帽盖的元件、模组及其晶圆级封装方法
DE102008041721B4 (de) * 2008-08-29 2018-11-15 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauteils
DE102020204773A1 (de) 2020-04-15 2021-10-21 Robert Bosch Gesellschaft mit beschränkter Haftung Sensoranordnung, umfassend eine Mehrzahl von einzelnen und separaten Sensorelementen
DE102020210130A1 (de) 2020-08-11 2022-02-17 Robert Bosch Gesellschaft mit beschränkter Haftung Chip-Anordnung; Verfahren zur Herstellung einer Chip-Anordnung; Verfahren zum Betreiben einer Chip-Anordnung
DE102020214547A1 (de) 2020-11-18 2022-05-19 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanische Vorrichtung und Verfahren zur Herstellung

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855732A (ja) * 1981-09-30 1983-04-02 Hitachi Ltd 静電容量型圧力センサ
US4786357A (en) * 1987-11-27 1988-11-22 Xerox Corporation Thermal ink jet printhead and fabrication method therefor
JP2730201B2 (ja) * 1989-08-07 1998-03-25 株式会社デンソー 半導体加速度センサ
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
DE4201104C1 (fr) * 1992-01-17 1993-05-13 Mannesmann Kienzle Gmbh, 7730 Villingen-Schwenningen, De
JP2776142B2 (ja) * 1992-05-15 1998-07-16 株式会社日立製作所 加速度センサ
FR2710741B1 (fr) * 1993-09-30 1995-10-27 Commissariat Energie Atomique Capteur électronique destiné à la caractérisation de grandeurs physiques et procédé de réalisation d'un tel capteur.
DE4445553A1 (de) * 1993-12-21 1995-06-22 Nippon Denso Co Halbleiterbeschleunigungssensor
DE4418163B4 (de) * 1994-05-25 2007-04-05 Robert Bosch Gmbh Verfahren zur Herstellung von mikromechanischen Strukturen
DE19541388A1 (de) * 1995-11-07 1997-05-15 Telefunken Microelectron Mikromechanischer Beschleunigungssensor

Also Published As

Publication number Publication date
DE19616014A1 (de) 1997-10-30
GB9708043D0 (en) 1997-06-11
FR2747841A1 (fr) 1997-10-24
GB2312553A (en) 1997-10-29
GB2312553B (en) 1998-07-15
DE19616014B4 (de) 2006-04-20

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Legal Events

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Effective date: 20151231