GB9708043D0 - Process for the manufacture of semiconductor components containing micromechanical structures - Google Patents

Process for the manufacture of semiconductor components containing micromechanical structures

Info

Publication number
GB9708043D0
GB9708043D0 GB9708043A GB9708043A GB9708043D0 GB 9708043 D0 GB9708043 D0 GB 9708043D0 GB 9708043 A GB9708043 A GB 9708043A GB 9708043 A GB9708043 A GB 9708043A GB 9708043 D0 GB9708043 D0 GB 9708043D0
Authority
GB
United Kingdom
Prior art keywords
manufacture
semiconductor components
micromechanical structures
components containing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9708043A
Other versions
GB2312553B (en
GB2312553A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB9708043D0 publication Critical patent/GB9708043D0/en
Publication of GB2312553A publication Critical patent/GB2312553A/en
Application granted granted Critical
Publication of GB2312553B publication Critical patent/GB2312553B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up

Abstract

The micromechanical structures (16) produced in a separate wafer (14) and this wafer (14) is aligned with and placed on a wafer (12) containing integrated circuits by interposing a metallic connecting element (20). The device may be used as a capacitive acceleration sensor.
GB9708043A 1996-04-23 1997-04-21 Process for the manufacture of semiconductor components containing micromechanical structures Expired - Fee Related GB2312553B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996116014 DE19616014B4 (en) 1996-04-23 1996-04-23 Method for producing semiconductor devices having micromechanical structures

Publications (3)

Publication Number Publication Date
GB9708043D0 true GB9708043D0 (en) 1997-06-11
GB2312553A GB2312553A (en) 1997-10-29
GB2312553B GB2312553B (en) 1998-07-15

Family

ID=7792094

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9708043A Expired - Fee Related GB2312553B (en) 1996-04-23 1997-04-21 Process for the manufacture of semiconductor components containing micromechanical structures

Country Status (3)

Country Link
DE (1) DE19616014B4 (en)
FR (1) FR2747841B1 (en)
GB (1) GB2312553B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19616970B4 (en) * 1996-04-27 2012-04-12 Robert Bosch Gmbh Method for producing semiconductor devices having micromechanical structures
DE10136219A1 (en) * 2001-07-25 2003-02-06 Conti Temic Microelectronic Method for leak testing capacitive sensors
DE10350460B4 (en) * 2003-10-29 2006-07-13 X-Fab Semiconductor Foundries Ag Method for producing semiconductor devices having micromechanical and / or microelectronic structures, which result from the fixed connection of at least two semiconductor wafers, and corresponding arrangement
DE102007060785B4 (en) * 2007-12-17 2011-12-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a (multi) component based on ultra-planar metal structures
CN101633490B (en) * 2008-07-25 2014-06-04 亚太优势微系统股份有限公司 Component and component module provided with micro-cap, and wafer-level packaging methods thereof
DE102008041721B4 (en) * 2008-08-29 2018-11-15 Robert Bosch Gmbh Method for producing a micromechanical component
DE102020204773A1 (en) 2020-04-15 2021-10-21 Robert Bosch Gesellschaft mit beschränkter Haftung A sensor arrangement comprising a plurality of individual and separate sensor elements
DE102020210130A1 (en) 2020-08-11 2022-02-17 Robert Bosch Gesellschaft mit beschränkter Haftung chip arrangement; method for manufacturing a chip arrangement; Method for operating a chip arrangement
DE102020214547A1 (en) 2020-11-18 2022-05-19 Robert Bosch Gesellschaft mit beschränkter Haftung Micromechanical device and method of manufacture

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855732A (en) * 1981-09-30 1983-04-02 Hitachi Ltd Electrostatic capacity type pressure sensor
US4786357A (en) * 1987-11-27 1988-11-22 Xerox Corporation Thermal ink jet printhead and fabrication method therefor
JP2730201B2 (en) * 1989-08-07 1998-03-25 株式会社デンソー Semiconductor acceleration sensor
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
DE4201104C1 (en) * 1992-01-17 1993-05-13 Mannesmann Kienzle Gmbh, 7730 Villingen-Schwenningen, De
JP2776142B2 (en) * 1992-05-15 1998-07-16 株式会社日立製作所 Acceleration sensor
FR2710741B1 (en) * 1993-09-30 1995-10-27 Commissariat Energie Atomique Electronic sensor intended for the characterization of physical quantities and method for producing such a sensor.
DE4445553A1 (en) * 1993-12-21 1995-06-22 Nippon Denso Co Semiconductor accelerometer for motor vehicle engine or safety control
DE4418163B4 (en) * 1994-05-25 2007-04-05 Robert Bosch Gmbh Process for the production of micromechanical structures
DE19541388A1 (en) * 1995-11-07 1997-05-15 Telefunken Microelectron Micromechanical acceleration sensor

Also Published As

Publication number Publication date
DE19616014B4 (en) 2006-04-20
DE19616014A1 (en) 1997-10-30
GB2312553B (en) 1998-07-15
GB2312553A (en) 1997-10-29
FR2747841A1 (en) 1997-10-24
FR2747841B1 (en) 2005-09-02

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20150421