TW364158B - Device of treating substrate and method for transporting substrate - Google Patents

Device of treating substrate and method for transporting substrate

Info

Publication number
TW364158B
TW364158B TW087101572A TW87101572A TW364158B TW 364158 B TW364158 B TW 364158B TW 087101572 A TW087101572 A TW 087101572A TW 87101572 A TW87101572 A TW 87101572A TW 364158 B TW364158 B TW 364158B
Authority
TW
Taiwan
Prior art keywords
substrate
treating
transporting
treating device
transferring
Prior art date
Application number
TW087101572A
Other languages
English (en)
Inventor
Tatsuya Iwasaki
Kiyohisa Tateyama
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW364158B publication Critical patent/TW364158B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/916—Differential etching apparatus including chamber cleaning means or shield for preventing deposits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/905—Cleaning of reaction chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW087101572A 1997-03-13 1998-02-06 Device of treating substrate and method for transporting substrate TW364158B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9076686A JPH10256345A (ja) 1997-03-13 1997-03-13 基板処理装置および基板搬送方法

Publications (1)

Publication Number Publication Date
TW364158B true TW364158B (en) 1999-07-11

Family

ID=13612345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087101572A TW364158B (en) 1997-03-13 1998-02-06 Device of treating substrate and method for transporting substrate

Country Status (4)

Country Link
US (1) US6187132B1 (zh)
JP (1) JPH10256345A (zh)
KR (1) KR100292322B1 (zh)
TW (1) TW364158B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100500169B1 (ko) * 2003-07-02 2005-07-07 주식회사 디엠에스 도킹형 기판 이송 및 처리 시스템과, 그를 이용한 이송 및 처리 방법
US7846340B2 (en) 2003-11-13 2010-12-07 Siemens Water Technologies Corp. Water treatment system and method
KR101302250B1 (ko) * 2008-09-30 2013-09-02 가와사키 쥬코교 가부시키가이샤 로봇용 모니터링 장치
JP5050018B2 (ja) * 2009-08-24 2012-10-17 東京エレクトロン株式会社 塗布現像装置及び塗布現像方法
JP4748263B2 (ja) * 2009-09-28 2011-08-17 東京エレクトロン株式会社 塗布、現像装置
JP4897030B2 (ja) * 2009-11-09 2012-03-14 東京エレクトロン株式会社 搬送アームの洗浄方法及び基板処理装置
JP6051858B2 (ja) * 2012-12-28 2016-12-27 東京エレクトロン株式会社 基板処理装置
JP2019021674A (ja) * 2017-07-12 2019-02-07 東京エレクトロン株式会社 基板処理システム、および基板処理方法
JP7339860B2 (ja) * 2019-11-15 2023-09-06 株式会社ディスコ 加工装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766171A (ja) * 1993-08-30 1995-03-10 Hitachi Ltd 半導体装置の製造装置
US5695817A (en) * 1994-08-08 1997-12-09 Tokyo Electron Limited Method of forming a coating film
JP3422121B2 (ja) * 1995-03-06 2003-06-30 ソニー株式会社 スクラブ洗浄装置

Also Published As

Publication number Publication date
US6187132B1 (en) 2001-02-13
KR19980080165A (ko) 1998-11-25
KR100292322B1 (ko) 2001-07-12
JPH10256345A (ja) 1998-09-25

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