TW359013B - Method and apparatus for forming bumps on substrates - Google Patents

Method and apparatus for forming bumps on substrates

Info

Publication number
TW359013B
TW359013B TW086106033A TW86106033A TW359013B TW 359013 B TW359013 B TW 359013B TW 086106033 A TW086106033 A TW 086106033A TW 86106033 A TW86106033 A TW 86106033A TW 359013 B TW359013 B TW 359013B
Authority
TW
Taiwan
Prior art keywords
bumps
mask
plasma
substrate
forming
Prior art date
Application number
TW086106033A
Other languages
English (en)
Inventor
Donald C Abbott
Raymond A Frechette
Gary D Marsh
Richard M Brook
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW359013B publication Critical patent/TW359013B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H10W70/093—
    • H10W72/012—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H10W72/251—
    • H10W72/9445—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW086106033A 1995-10-16 1997-05-07 Method and apparatus for forming bumps on substrates TW359013B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54378495A 1995-10-16 1995-10-16

Publications (1)

Publication Number Publication Date
TW359013B true TW359013B (en) 1999-05-21

Family

ID=24169547

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086106033A TW359013B (en) 1995-10-16 1997-05-07 Method and apparatus for forming bumps on substrates

Country Status (4)

Country Link
EP (1) EP0768708A3 (zh)
JP (1) JPH09129650A (zh)
SG (1) SG47183A1 (zh)
TW (1) TW359013B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042953A (en) * 1996-03-21 2000-03-28 Matsushita Electric Industrial Co., Ltd. Substrate on which bumps are formed and method of forming the same
DE102006037532A1 (de) 2006-08-10 2008-02-14 Siemens Ag Verfahren zur Erzeugung einer elektrischen Funktionsschicht auf einer Oberfläche eines Substrats

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567133A (en) * 1978-11-14 1980-05-21 Toshiba Corp Method for manufacturing electrode of semiconductor device
DE3304672C3 (de) * 1983-02-11 1993-12-02 Ant Nachrichtentech Verfahren zur Kontaktierung von Körpern und seine Anwendung
ATE138225T1 (de) * 1989-08-17 1996-06-15 Canon Kk Prozess zur gegenseitigen konnektion von elektrodenanschlüssen

Also Published As

Publication number Publication date
EP0768708A2 (en) 1997-04-16
EP0768708A3 (en) 1998-04-08
SG47183A1 (en) 1998-03-20
JPH09129650A (ja) 1997-05-16

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