JPS5567133A - Method for manufacturing electrode of semiconductor device - Google Patents

Method for manufacturing electrode of semiconductor device

Info

Publication number
JPS5567133A
JPS5567133A JP13932778A JP13932778A JPS5567133A JP S5567133 A JPS5567133 A JP S5567133A JP 13932778 A JP13932778 A JP 13932778A JP 13932778 A JP13932778 A JP 13932778A JP S5567133 A JPS5567133 A JP S5567133A
Authority
JP
Japan
Prior art keywords
wafers
electrode
gun
particles
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13932778A
Other languages
Japanese (ja)
Inventor
Toshiaki Yoshino
Kazuo Watanabe
Kenichi Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13932778A priority Critical patent/JPS5567133A/en
Publication of JPS5567133A publication Critical patent/JPS5567133A/en
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent the scattering in the quality of an electrode and its cracking and simplify the manufacture of the electrode, by setting a semiconductor wafer in an enclosed container and spraying particles of a molten electrode material upon the wafer to manufacture the electrode thereon.
CONSTITUTION: A rest 22 whereon numerous semiconductor wafers 19 are attracted by suction is so set in an enclosed unit 15 containing a spraying gun 17 that the rest faces the gun 17. An inert gas of Ar, N2 or the like is filled in the enclosed unit or the interior of the unit is evacuated. Molten solder particles 18 are projected from the gun 17 to the wafers 19 so that electrodes of desired pattern are manufactured on the wafers. If a number of times of projection scanning is selected, the deposited particles are set at a prescribed thickness. The manufacturing work is thus simplified. This manufacturing method is appropriate to mass production. The diameter of the wafers is not limited. The wafers are not damaged.
COPYRIGHT: (C)1980,JPO&Japio
JP13932778A 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device Pending JPS5567133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13932778A JPS5567133A (en) 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13932778A JPS5567133A (en) 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5567133A true JPS5567133A (en) 1980-05-21

Family

ID=15242724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13932778A Pending JPS5567133A (en) 1978-11-14 1978-11-14 Method for manufacturing electrode of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5567133A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0592165A (en) * 1991-05-16 1993-04-16 Sansha Electric Mfg Co Ltd Method for applying metal to ceramics substrate by plasma spray
EP0768708A3 (en) * 1995-10-16 1998-04-08 Texas Instruments Incorporated Method for forming bumps on substrates for electronic components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0592165A (en) * 1991-05-16 1993-04-16 Sansha Electric Mfg Co Ltd Method for applying metal to ceramics substrate by plasma spray
EP0768708A3 (en) * 1995-10-16 1998-04-08 Texas Instruments Incorporated Method for forming bumps on substrates for electronic components

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