JPS5567133A - Method for manufacturing electrode of semiconductor device - Google Patents
Method for manufacturing electrode of semiconductor deviceInfo
- Publication number
- JPS5567133A JPS5567133A JP13932778A JP13932778A JPS5567133A JP S5567133 A JPS5567133 A JP S5567133A JP 13932778 A JP13932778 A JP 13932778A JP 13932778 A JP13932778 A JP 13932778A JP S5567133 A JPS5567133 A JP S5567133A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- electrode
- gun
- particles
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE: To prevent the scattering in the quality of an electrode and its cracking and simplify the manufacture of the electrode, by setting a semiconductor wafer in an enclosed container and spraying particles of a molten electrode material upon the wafer to manufacture the electrode thereon.
CONSTITUTION: A rest 22 whereon numerous semiconductor wafers 19 are attracted by suction is so set in an enclosed unit 15 containing a spraying gun 17 that the rest faces the gun 17. An inert gas of Ar, N2 or the like is filled in the enclosed unit or the interior of the unit is evacuated. Molten solder particles 18 are projected from the gun 17 to the wafers 19 so that electrodes of desired pattern are manufactured on the wafers. If a number of times of projection scanning is selected, the deposited particles are set at a prescribed thickness. The manufacturing work is thus simplified. This manufacturing method is appropriate to mass production. The diameter of the wafers is not limited. The wafers are not damaged.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13932778A JPS5567133A (en) | 1978-11-14 | 1978-11-14 | Method for manufacturing electrode of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13932778A JPS5567133A (en) | 1978-11-14 | 1978-11-14 | Method for manufacturing electrode of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5567133A true JPS5567133A (en) | 1980-05-21 |
Family
ID=15242724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13932778A Pending JPS5567133A (en) | 1978-11-14 | 1978-11-14 | Method for manufacturing electrode of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5567133A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0592165A (en) * | 1991-05-16 | 1993-04-16 | Sansha Electric Mfg Co Ltd | Method for applying metal to ceramics substrate by plasma spray |
EP0768708A3 (en) * | 1995-10-16 | 1998-04-08 | Texas Instruments Incorporated | Method for forming bumps on substrates for electronic components |
-
1978
- 1978-11-14 JP JP13932778A patent/JPS5567133A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0592165A (en) * | 1991-05-16 | 1993-04-16 | Sansha Electric Mfg Co Ltd | Method for applying metal to ceramics substrate by plasma spray |
EP0768708A3 (en) * | 1995-10-16 | 1998-04-08 | Texas Instruments Incorporated | Method for forming bumps on substrates for electronic components |
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