JPH04162513A - Developing nozzle for photoresist film - Google Patents

Abstract

PURPOSE:To make the developing rate of a photoresist film inside the face of a wafer nearly uniform and to form a photoresist pattern over the whole region on the face of the wafer with good dimensional uniformity by making two or more holes through which a developing solution is dropped by its own weight before the developing solution is discharged. CONSTITUTION:A semiconductor substrate is coated with a photoresist; said semiconductor substrate is exposed to light through a mask or a reticle on which a prescribed circuit pattern has been drawn; the exposed semiconductor substrate is developed. At this time, a developing nozzle, for a photoresist film, which discharges a developing solution is provided with at least two or more holes 2a through which the developing solution is dropped by its own weight. For example, a nozzle main body 1a is formed to be a funnel shape, and many holes 2a which discharge a developing solution are made. Thereby, since the developing solution is dropped simultaneously to the whole region of a wafer, the time during which the developing solution is spread over the face of the wafer does not differ sharply inside the face of the wafer and the developing rate of a photoresist film does not differ sharply inside the face of the wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photoresist film developing nozzle that drops a developer onto an exposed photoresist film.

[Conventional technology]

FIGS. 3(a) and 3(b) are a sectional view and a bottom view of a photoresist film developer nozzle showing an example of the conventional technique. Conventionally,
This type of photoresist film developing nozzle has a structure in which a photoresist is coated on a semiconductor substrate (hereinafter referred to as a wafer), exposed to light, and a developer is discharged from a single developer discharge hole onto the unexposed wafer. It had become. That is, as shown in FIGS. 3(a) and 3(b), there is a cylindrical nozzle body 1 having a hole 2 at its tip for discharging the developer, and a filter attached inside the nozzle body 1. It was composed of 3.

When developing a photoresist film on a wafer using this photoresist film development nozzle, a fixed amount of developer is dropped with this nozzle, and the developer is developed by flowing over the entire surface of the semiconductor substrate with its fluidity. was.

[Problem to be solved by the invention]

The conventional photoresist film development nozzle described above has a structure in which the developer is discharged over the entire surface of the wafer from one developer discharge hole, so the time for the developer to spread over the wafer surface is significantly reduced. Therefore, the development rate of the photoresist film will vary significantly within the wafer plane. In this case, since the photoresist film is developed at different development rates within the wafer plane, there is a drawback that differences in pattern dimensions occur within the wafer plane due to differences in the development rate within the wafer plane.For example, 1 mm line pattern This results in a non-uniformity of approximately 20%. Furthermore, for fine pattern formation, the occurrence of differences in pattern dimensions within the wafer surface is fatal. On the other hand, instead of using this nozzle, it is conceivable that the developer may be discharged by a spray.
If the developer becomes atomized, the development will be insufficient, and if the spraying pressure is high, the developed pattern shape will collapse.

An object of the present invention is to provide a photoresist film developing nozzle that eliminates such drawbacks.

[Means for Solving the Problems] 1. The first photoresist film developing nozzle of the present invention applies a photoresist to a semiconductor substrate, passes it through a mask or reticle on which a predetermined circuit pattern is drawn, and applies the photoresist to the semiconductor substrate. When exposing and developing this exposed semiconductor substrate, a photoresist film developing nozzle that discharges a developer has at least a hole on the surface from which the developer is discharged, through which the developer is dripped by its own weight. It is characterized by having two or more.

2. The second photoresist film developing nozzle of the present invention is characterized in that the hole becomes larger from the center toward the periphery.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a sectional view and a bottom view of a photoresist film developing nozzle showing an embodiment of the present invention. As shown in the same figure, this photoresist film development nozzle is
The nozzle body 1a is shaped like a watering can, and a large number of holes 2a are provided for discharging the developer. In this way, by providing the hole 2a on the discharge side through which the developer drips under its own weight,
When developing a photoresist film, the developer is simultaneously dropped onto the entire wafer and can be spread over the entire surface of the wafer. The time it takes for the photoresist film to last on the wafer surface will no longer vary greatly within the wafer surface, and the development rate of the photoresist film will no longer vary significantly within the wafer surface. As a result, the development rate within the wafer surface becomes almost uniform, and the photoresist pattern is spread over the entire wafer surface at a rate of about 10%.
It cannot be formed with uniformity within 0%.

FIGS. 2(a) and 2(b) are a sectional view and a bottom view of a photoresist film developing nozzle showing another embodiment of the present invention.

As shown in the figure, this photoresist film developing nozzle has holes 2b to 2g each having a smaller size at the center and a larger size at the periphery, so that a relatively large amount of developer can be dropped and the required amount can be reduced. The structure allows more developer to be discharged around the wafer. Therefore, when developing a photoresist film on a large-diameter wafer, the time for the developer to spread over the wafer surface becomes faster, and as a result, compared to the above-mentioned example, The development rate is now more uniform, and even with larger wafers, the photoresist pattern can be spread across the entire surface of the wafer.
It has the advantage that it can be formed with good dimensional uniformity.

〔Effect of the invention〕

As explained above, in the present invention, by providing at least two or more developer discharge holes, the developer can be spread over the entire wafer almost simultaneously. As a result, the photoresist film development rate within the wafer surface becomes almost uniform, and a zero-length photoresist film development nozzle that can form a photoresist pattern with good dimensional uniformity over the entire wafer surface is obtained. There is.

[Brief explanation of drawings]

Figures 1(a) and (b) are a sectional view and bottom view of a photoresist film developing nozzle showing one embodiment of the present invention, and Figure 2(a) and (b) are
3(a) and (b) are cross-sectional views and bottom views of a photoresist film developing nozzle showing another embodiment of the present invention, and FIGS. 3(a) and (b) are views of a photoresist film developing nozzle showing a conventional example They are a sectional view and a bottom view. 1, la, lb--nozzle body, 2.2a, 2b, 2
c, 2d, 2e, 2f, 2g-hole, 3°3a...filter.

Claims (1)

[Claims] 1. When applying a photoresist to a semiconductor substrate, exposing the semiconductor substrate to light through a mask or reticle with a predetermined circuit pattern drawn thereon, and developing the exposed semiconductor substrate, A photoresist film developing nozzle for discharging a developer, characterized in that the surface from which the developer is discharged has at least two or more holes through which the developer is dropped by its own weight. 2. The photoresist film developing nozzle according to claim 1, wherein the hole becomes larger from the center toward the periphery.