TW358228B - Method of minimizing damage to gate dielectric layer during gate electrode plasma etching - Google Patents

Method of minimizing damage to gate dielectric layer during gate electrode plasma etching

Info

Publication number
TW358228B
TW358228B TW085106892A TW85106892A TW358228B TW 358228 B TW358228 B TW 358228B TW 085106892 A TW085106892 A TW 085106892A TW 85106892 A TW85106892 A TW 85106892A TW 358228 B TW358228 B TW 358228B
Authority
TW
Taiwan
Prior art keywords
gate electrode
forming
layer
plasma etching
dielectric layer
Prior art date
Application number
TW085106892A
Other languages
English (en)
Inventor
ming-xi Liu
Original Assignee
Winbond Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winbond Electronics Corp filed Critical Winbond Electronics Corp
Priority to TW085106892A priority Critical patent/TW358228B/zh
Priority to US08/697,024 priority patent/US5759919A/en
Application granted granted Critical
Publication of TW358228B publication Critical patent/TW358228B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Drying Of Semiconductors (AREA)
  • Electrodes Of Semiconductors (AREA)
TW085106892A 1996-06-08 1996-06-08 Method of minimizing damage to gate dielectric layer during gate electrode plasma etching TW358228B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW085106892A TW358228B (en) 1996-06-08 1996-06-08 Method of minimizing damage to gate dielectric layer during gate electrode plasma etching
US08/697,024 US5759919A (en) 1996-06-08 1996-08-16 Method for reducing gate oxide damages during gate electrode plasma etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085106892A TW358228B (en) 1996-06-08 1996-06-08 Method of minimizing damage to gate dielectric layer during gate electrode plasma etching

Publications (1)

Publication Number Publication Date
TW358228B true TW358228B (en) 1999-05-11

Family

ID=21625279

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085106892A TW358228B (en) 1996-06-08 1996-06-08 Method of minimizing damage to gate dielectric layer during gate electrode plasma etching

Country Status (2)

Country Link
US (1) US5759919A (zh)
TW (1) TW358228B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW526550B (en) * 2000-10-26 2003-04-01 United Microelectronics Corp Conductive structure capable of preventing wafer from being damaged by plasma and method for producing the same
US6635573B2 (en) * 2001-10-29 2003-10-21 Applied Materials, Inc Method of detecting an endpoint during etching of a material within a recess

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4472237A (en) * 1981-05-22 1984-09-18 At&T Bell Laboratories Reactive ion etching of tantalum and silicon
US5030590A (en) * 1989-06-09 1991-07-09 Applied Materials, Inc. Process for etching polysilicon layer in formation of integrated circuit structure
JPH05121701A (ja) * 1991-10-25 1993-05-18 Rohm Co Ltd Ｎａｎｄ構造の半導体装置の製造方法
JP3179872B2 (ja) * 1991-12-19 2001-06-25 東京エレクトロン株式会社 エッチング方法
US5603848A (en) * 1995-01-03 1997-02-18 Texas Instruments Incorporated Method for etching through a substrate to an attached coating

Also Published As

Publication number Publication date
US5759919A (en) 1998-06-02

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