TW350996B - Puncture resistant electrostatic chuck - Google Patents
Puncture resistant electrostatic chuckInfo
- Publication number
- TW350996B TW350996B TW086117660A TW86117660A TW350996B TW 350996 B TW350996 B TW 350996B TW 086117660 A TW086117660 A TW 086117660A TW 86117660 A TW86117660 A TW 86117660A TW 350996 B TW350996 B TW 350996B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrostatic chuck
- puncture resistant
- resistant electrostatic
- puncture
- sort
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/23—Chucks or sockets with magnetic or electrostatic means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
- Jigs For Machine Tools (AREA)
Abstract
A sort of puncture resistant electrostatic chuck, including a compound insulation covering an electrode, including the compound insulation a sort of substrate material including at least one fiber layer on top of the electrode, being rigid enough to raise the resistance to puncture of the compound insulator.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/755,716 US5729423A (en) | 1994-01-31 | 1996-11-25 | Puncture resistant electrostatic chuck |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350996B true TW350996B (en) | 1999-01-21 |
Family
ID=25040344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086117660A TW350996B (en) | 1996-11-25 | 1997-11-25 | Puncture resistant electrostatic chuck |
Country Status (5)
Country | Link |
---|---|
US (2) | US5729423A (en) |
EP (1) | EP0844659A3 (en) |
JP (1) | JPH10247683A (en) |
KR (1) | KR19980042710A (en) |
TW (1) | TW350996B (en) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6278600B1 (en) * | 1994-01-31 | 2001-08-21 | Applied Materials, Inc. | Electrostatic chuck with improved temperature control and puncture resistance |
US5729423A (en) * | 1994-01-31 | 1998-03-17 | Applied Materials, Inc. | Puncture resistant electrostatic chuck |
US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
EP0948042A1 (en) * | 1998-03-06 | 1999-10-06 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung | Electrostatic device for clamping wafers and other parts |
JP3109471B2 (en) * | 1998-03-31 | 2000-11-13 | 日本電気株式会社 | Cleaning / drying equipment and semiconductor device manufacturing line |
US6067222A (en) * | 1998-11-25 | 2000-05-23 | Applied Materials, Inc. | Substrate support apparatus and method for fabricating same |
US6267839B1 (en) * | 1999-01-12 | 2001-07-31 | Applied Materials, Inc. | Electrostatic chuck with improved RF power distribution |
US6319102B1 (en) * | 1999-07-09 | 2001-11-20 | International Business Machines Corporation | Capacitor coupled chuck for carbon dioxide snow cleaning system |
WO2001011431A2 (en) * | 1999-08-06 | 2001-02-15 | Applied Materials, Inc. | Method and apparatus of holding semiconductor wafers for lithography and other wafer processes |
US6598559B1 (en) | 2000-03-24 | 2003-07-29 | Applied Materials, Inc. | Temperature controlled chamber |
US6452776B1 (en) * | 2000-04-06 | 2002-09-17 | Intel Corporation | Capacitor with defect isolation and bypass |
US6441349B1 (en) * | 2000-04-26 | 2002-08-27 | Advanced Micro Devices | System for facilitating uniform heating temperature of photoresist |
JP4014127B2 (en) * | 2000-10-04 | 2007-11-28 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing apparatus |
US6501636B1 (en) * | 2001-06-21 | 2002-12-31 | Stephen Edward Savas | Electrostatic clamp for holding workpieces with irregular surfaces |
JP2003017254A (en) * | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | Manufacturing method of electroluminescent display |
JP2003017255A (en) * | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | Manufacturing method of electroluminescent display |
JP4252231B2 (en) * | 2001-09-05 | 2009-04-08 | 日本碍子株式会社 | Manufacturing method of semiconductor wafer support member assembly and semiconductor wafer support member assembly |
DE10156407A1 (en) * | 2001-11-16 | 2003-06-05 | Bosch Gmbh Robert | Holding device, in particular for fixing a semiconductor wafer in a plasma etching device, and method for supplying or removing heat from a substrate |
TWI327336B (en) | 2003-01-13 | 2010-07-11 | Oc Oerlikon Balzers Ag | Arrangement for processing a substrate |
US7884698B2 (en) * | 2003-05-08 | 2011-02-08 | Panasonic Corporation | Electronic component, and method for manufacturing the same |
US7697260B2 (en) * | 2004-03-31 | 2010-04-13 | Applied Materials, Inc. | Detachable electrostatic chuck |
US7595972B2 (en) * | 2004-04-09 | 2009-09-29 | Varian Semiconductor Equipment Associates, Inc. | Clamp for use in processing semiconductor workpieces |
KR100550019B1 (en) * | 2004-07-21 | 2006-02-08 | 주식회사 코미코 | Ceramic electrostatic chuck equipment having edge projected portion for preventing arc and method for manufacturing the equipment |
ATE474862T1 (en) * | 2004-11-25 | 2010-08-15 | Prime Polymer Co Ltd | POLYPROPYLENE AND APPLICATION OF POLYPROPYLENE TO ELECTRICAL MATERIAL |
WO2006094025A2 (en) * | 2005-02-28 | 2006-09-08 | The Regents Of The University Of California | Fabricated adhesive microstructures for making an electrical connection |
TW200715464A (en) * | 2005-06-30 | 2007-04-16 | Varian Semiconductor Equipment | Clamp for use in processing semiconductor workpieces |
US8226769B2 (en) * | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
US20080001485A1 (en) * | 2006-06-30 | 2008-01-03 | Ram Kumar Upadhyay | System and method for curing and consolidation of coil with insulation |
US7589950B2 (en) * | 2006-10-13 | 2009-09-15 | Applied Materials, Inc. | Detachable electrostatic chuck having sealing assembly |
JP5054022B2 (en) * | 2006-10-31 | 2012-10-24 | 株式会社巴川製紙所 | Electrostatic chuck device |
US7983017B2 (en) * | 2006-12-26 | 2011-07-19 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method of forming |
US20080151466A1 (en) * | 2006-12-26 | 2008-06-26 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method of forming |
US7989022B2 (en) * | 2007-07-20 | 2011-08-02 | Micron Technology, Inc. | Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto |
US8043433B2 (en) * | 2008-02-11 | 2011-10-25 | Applied Materials, Inc. | High efficiency electro-static chucks for semiconductor wafer processing |
US8540851B2 (en) * | 2009-02-19 | 2013-09-24 | Fujifilm Corporation | Physical vapor deposition with impedance matching network |
US8557088B2 (en) * | 2009-02-19 | 2013-10-15 | Fujifilm Corporation | Physical vapor deposition with phase shift |
US20110024049A1 (en) | 2009-07-30 | 2011-02-03 | c/o Lam Research Corporation | Light-up prevention in electrostatic chucks |
US8906164B2 (en) | 2010-08-05 | 2014-12-09 | Lam Research Corporation | Methods for stabilizing contact surfaces of electrostatic chucks |
KR101045102B1 (en) * | 2010-08-31 | 2011-06-29 | 한국기계연구원 | Active removable polymer chuck capable of controlling adhesive power |
KR101027752B1 (en) * | 2010-08-31 | 2011-04-07 | 한국기계연구원 | Active removable chuck |
WO2012158292A1 (en) * | 2011-05-13 | 2012-11-22 | Dow Global Technologies Llc | Insulation formulations |
US8980053B2 (en) | 2012-03-30 | 2015-03-17 | Sabic Innovative Plastics Ip B.V. | Transformer paper and other non-conductive transformer components |
US20130260123A1 (en) * | 2012-03-30 | 2013-10-03 | Sabic Innovative Plastics Ip B.V. | Electrical insulation paper, methods of manufacture, and articles manufactured therefrom |
US20130260124A1 (en) * | 2012-03-30 | 2013-10-03 | Sabic Innovative Plastics Ip B.V. | Electrical insulation paper, methods of manufacture, and articles manufactured therefrom |
DE102012215513A1 (en) | 2012-08-31 | 2014-03-06 | J. Schmalz Gmbh | gripping device |
JP6202111B2 (en) * | 2014-11-20 | 2017-09-27 | 住友大阪セメント株式会社 | Electrostatic chuck device |
KR102412612B1 (en) * | 2015-08-28 | 2022-06-23 | 삼성전자주식회사 | board for package and prepreg |
US10322890B2 (en) * | 2016-10-17 | 2019-06-18 | Oakland University | Sheet metal blank destacker |
JP6615153B2 (en) * | 2017-06-16 | 2019-12-04 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate mounting mechanism, and substrate processing method |
FR3073322B1 (en) * | 2017-11-07 | 2021-12-03 | Commissariat Energie Atomique | PROCESS FOR MAKING AT LEAST ONE CURVED ELECTRONIC CIRCUIT |
US11031272B2 (en) * | 2018-11-06 | 2021-06-08 | Mikro Mesa Technology Co., Ltd. | Micro device electrostatic chuck with diffusion blocking layer |
US20210035767A1 (en) * | 2019-07-29 | 2021-02-04 | Applied Materials, Inc. | Methods for repairing a recess of a chamber component |
US20220223384A1 (en) * | 2021-01-14 | 2022-07-14 | Samsung Electronics Co., Ltd. | Apparatus for manufacturing a semiconductor device |
EP4057068A1 (en) * | 2021-03-09 | 2022-09-14 | ASML Netherlands B.V. | Apparatus comprising an electrostatic clamp and method |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4184188A (en) * | 1978-01-16 | 1980-01-15 | Veeco Instruments Inc. | Substrate clamping technique in IC fabrication processes |
US4384918A (en) * | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
JPS57149734A (en) * | 1981-03-12 | 1982-09-16 | Anelva Corp | Plasma applying working device |
GB2106325A (en) * | 1981-09-14 | 1983-04-07 | Philips Electronic Associated | Electrostatic chuck |
JPS6059104B2 (en) * | 1982-02-03 | 1985-12-23 | 株式会社東芝 | electrostatic chuck board |
US4778326A (en) * | 1983-05-24 | 1988-10-18 | Vichem Corporation | Method and means for handling semiconductor and similar electronic devices |
JPS6060060A (en) * | 1983-09-12 | 1985-04-06 | 株式会社日立製作所 | Switchgear for door of railway rolling stock |
GB2147459A (en) * | 1983-09-30 | 1985-05-09 | Philips Electronic Associated | Electrostatic chuck for semiconductor wafers |
JPS6131636U (en) * | 1984-07-31 | 1986-02-26 | 株式会社 徳田製作所 | electrostatic chuck |
JPS6156842A (en) * | 1984-08-27 | 1986-03-22 | Kokusai Electric Co Ltd | Electrostatic attractive plate |
JPS6331732A (en) * | 1986-07-26 | 1988-02-10 | Idemitsu Petrochem Co Ltd | Thermoforming of vessel and the like |
JPS6372877A (en) * | 1986-09-12 | 1988-04-02 | Tokuda Seisakusho Ltd | Vacuum treatment device |
US4832781A (en) * | 1988-01-07 | 1989-05-23 | Varian Associates, Inc. | Methods and apparatus for thermal transfer with a semiconductor wafer in vacuum |
ATE95513T1 (en) * | 1988-04-26 | 1993-10-15 | Toto Ltd | PROCESS FOR MAKING DIELECTRIC CERAMIC FOR ELECTROSTATIC CLAMPS. |
JPH01298721A (en) * | 1988-05-27 | 1989-12-01 | Tokuda Seisakusho Ltd | Vacuum processor |
JPH0227748A (en) * | 1988-07-16 | 1990-01-30 | Tomoegawa Paper Co Ltd | Electrostatic chucking device and forming method therefor |
JP2665242B2 (en) * | 1988-09-19 | 1997-10-22 | 東陶機器株式会社 | Electrostatic chuck |
DE69103915T2 (en) * | 1990-01-25 | 1995-05-11 | Applied Materials Inc | Electrostatic clamp and method. |
US5338827A (en) * | 1990-01-30 | 1994-08-16 | Trw Inc. | Polyimide resins useful at high temperatures |
JPH03286835A (en) * | 1990-04-03 | 1991-12-17 | Nippon Plast Co Ltd | Method of decorating molded object |
JPH03286834A (en) * | 1990-04-03 | 1991-12-17 | Nippon Plast Co Ltd | Method of sticking skin object to core |
FR2661039B1 (en) * | 1990-04-12 | 1997-04-30 | Commissariat Energie Atomique | ELECTROSTATIC SUBSTRATE HOLDER. |
US4999507A (en) * | 1990-05-10 | 1991-03-12 | At&T Bell Laboratories | Apparatus comprising an electrostatic wafer cassette |
US5452177A (en) * | 1990-06-08 | 1995-09-19 | Varian Associates, Inc. | Electrostatic wafer clamp |
US5255153A (en) * | 1990-07-20 | 1993-10-19 | Tokyo Electron Limited | Electrostatic chuck and plasma apparatus equipped therewith |
US5055964A (en) * | 1990-09-07 | 1991-10-08 | International Business Machines Corporation | Electrostatic chuck having tapered electrodes |
DE69130205T2 (en) * | 1990-12-25 | 1999-03-25 | Ngk Insulators Ltd | Semiconductor wafer heater and method of manufacturing the same |
US5166856A (en) * | 1991-01-31 | 1992-11-24 | International Business Machines Corporation | Electrostatic chuck with diamond coating |
JPH04367247A (en) * | 1991-06-14 | 1992-12-18 | Kyocera Corp | Ceramic electrostatic chuck |
US5184398A (en) * | 1991-08-30 | 1993-02-09 | Texas Instruments Incorporated | In-situ real-time sheet resistance measurement method |
JPH0569489A (en) * | 1991-09-11 | 1993-03-23 | Araco Corp | Recessed-surface sheet cover structure |
US5275683A (en) * | 1991-10-24 | 1994-01-04 | Tokyo Electron Limited | Mount for supporting substrates and plasma processing apparatus using the same |
JPH05166757A (en) * | 1991-12-13 | 1993-07-02 | Tokyo Electron Ltd | Temperature regulator for material to be pr0cessed |
US5213349A (en) * | 1991-12-18 | 1993-05-25 | Elliott Joe C | Electrostatic chuck |
JP2865472B2 (en) * | 1992-02-20 | 1999-03-08 | 信越化学工業株式会社 | Electrostatic chuck |
KR100238629B1 (en) * | 1992-12-17 | 2000-01-15 | 히가시 데쓰로 | Stage having eletrostatic chuck and plasma processing apparatus using same |
US5384682A (en) * | 1993-03-22 | 1995-01-24 | Toto Ltd. | Electrostatic chuck |
JPH06326175A (en) * | 1993-04-22 | 1994-11-25 | Applied Materials Inc | Protective coating for dielectric material of wafer support used in integrated circuit processing equipment and formation method therefor |
EP0635870A1 (en) * | 1993-07-20 | 1995-01-25 | Applied Materials, Inc. | An electrostatic chuck having a grooved surface |
US5636098A (en) * | 1994-01-06 | 1997-06-03 | Applied Materials, Inc. | Barrier seal for electrostatic chuck |
US5463526A (en) * | 1994-01-21 | 1995-10-31 | Lam Research Corporation | Hybrid electrostatic chuck |
KR100430643B1 (en) * | 1994-01-31 | 2004-05-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Electrostatic chuck with conformal insulator film |
US5729423A (en) * | 1994-01-31 | 1998-03-17 | Applied Materials, Inc. | Puncture resistant electrostatic chuck |
US5606485A (en) * | 1994-07-18 | 1997-02-25 | Applied Materials, Inc. | Electrostatic chuck having improved erosion resistance |
US5583736A (en) * | 1994-11-17 | 1996-12-10 | The United States Of America As Represented By The Department Of Energy | Micromachined silicon electrostatic chuck |
US5691876A (en) * | 1995-01-31 | 1997-11-25 | Applied Materials, Inc. | High temperature polyimide electrostatic chuck |
US5708557A (en) * | 1996-08-22 | 1998-01-13 | Packard Hughes Interconnect Company | Puncture-resistant electrostatic chuck with flat surface and method of making the same |
-
1996
- 1996-11-25 US US08/755,716 patent/US5729423A/en not_active Expired - Lifetime
-
1997
- 1997-11-25 JP JP9363048A patent/JPH10247683A/en not_active Withdrawn
- 1997-11-25 KR KR1019970062552A patent/KR19980042710A/en not_active Application Discontinuation
- 1997-11-25 TW TW086117660A patent/TW350996B/en active
- 1997-11-25 EP EP97309498A patent/EP0844659A3/en not_active Withdrawn
-
1998
- 1998-01-29 US US09/015,802 patent/US5986875A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5986875A (en) | 1999-11-16 |
EP0844659A3 (en) | 1999-11-17 |
EP0844659A2 (en) | 1998-05-27 |
KR19980042710A (en) | 1998-08-17 |
JPH10247683A (en) | 1998-09-14 |
US5729423A (en) | 1998-03-17 |
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