TW350972B - Semiconductor and the manufacturing method - Google Patents

Semiconductor and the manufacturing method

Info

Publication number
TW350972B
TW350972B TW086109996A TW86109996A TW350972B TW 350972 B TW350972 B TW 350972B TW 086109996 A TW086109996 A TW 086109996A TW 86109996 A TW86109996 A TW 86109996A TW 350972 B TW350972 B TW 350972B
Authority
TW
Taiwan
Prior art keywords
retaining layer
forming
area
semiconductor
manufacturing
Prior art date
Application number
TW086109996A
Other languages
English (en)
Inventor
Toshiyuki Kondo
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW350972B publication Critical patent/TW350972B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
    • H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/05—Etch and refill

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Element Separation (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW086109996A 1996-07-16 1997-07-15 Semiconductor and the manufacturing method TW350972B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18579096A JP3688816B2 (ja) 1996-07-16 1996-07-16 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW350972B true TW350972B (en) 1999-01-21

Family

ID=16176949

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109996A TW350972B (en) 1996-07-16 1997-07-15 Semiconductor and the manufacturing method

Country Status (4)

Country Link
US (1) US6010947A (zh)
JP (1) JP3688816B2 (zh)
KR (1) KR100276680B1 (zh)
TW (1) TW350972B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851916A (en) * 1995-11-03 1998-12-22 Micron Technology, Inc. Formation of a self-aligned integrated circuit structures using planarization to form a top surface
US6372601B1 (en) * 1998-09-03 2002-04-16 Micron Technology, Inc. Isolation region forming methods
US6274498B1 (en) * 1998-09-03 2001-08-14 Micron Technology, Inc. Methods of forming materials within openings, and method of forming isolation regions
JP4136145B2 (ja) * 1998-12-25 2008-08-20 富士通株式会社 半導体装置の製造方法
JP2001144170A (ja) * 1999-11-11 2001-05-25 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6645840B2 (en) * 2000-10-19 2003-11-11 Texas Instruments Incorporated Multi-layered polysilicon process
KR100399986B1 (ko) 2001-03-20 2003-09-29 삼성전자주식회사 셸로우트렌치 소자분리방법
KR20020091982A (ko) * 2001-06-01 2002-12-11 삼성전자 주식회사 얕은 트렌치 소자분리 구조를 가지는 비휘발성 메모리소자 및 그 제조방법
DE10138510B4 (de) * 2001-08-06 2006-08-10 Infineon Technologies Ag Grabenisolation mit selbstjustierender Oberflächenversiegelung und Verfahren zur Herstellung einer solchen Grabenisolation
KR100476691B1 (ko) * 2002-04-18 2005-03-18 삼성전자주식회사 셸로우 트렌치 소자분리 방법 및 이를 이용한 불휘발성메모리 장치의 제조방법
KR100485518B1 (ko) * 2002-09-18 2005-04-27 동부아남반도체 주식회사 셀로우 트렌치 소자분리막의 제조 방법
KR100546852B1 (ko) * 2002-12-28 2006-01-25 동부아남반도체 주식회사 반도체 소자의 제조 방법
US6890833B2 (en) * 2003-03-26 2005-05-10 Infineon Technologies Ag Trench isolation employing a doped oxide trench fill
KR102649372B1 (ko) * 2016-01-08 2024-03-21 삼성전자주식회사 3차원 반도체 메모리 장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53132275A (en) * 1977-04-25 1978-11-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor device and its production
US5290396A (en) * 1991-06-06 1994-03-01 Lsi Logic Corporation Trench planarization techniques
US5362669A (en) * 1993-06-24 1994-11-08 Northern Telecom Limited Method of making integrated circuits
BE1007588A3 (nl) * 1993-09-23 1995-08-16 Philips Electronics Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een halfgeleiderlichaam met veldisolatiegebieden gevormd door met isolerend materiaal gevulde groeven.
JP2955459B2 (ja) * 1993-12-20 1999-10-04 株式会社東芝 半導体装置の製造方法
JPH07193121A (ja) * 1993-12-27 1995-07-28 Toshiba Corp 半導体装置の製造方法
JP3438446B2 (ja) * 1995-05-15 2003-08-18 ソニー株式会社 半導体装置の製造方法
US5712185A (en) * 1996-04-23 1998-01-27 United Microelectronics Method for forming shallow trench isolation

Also Published As

Publication number Publication date
JPH1032240A (ja) 1998-02-03
KR100276680B1 (ko) 2001-01-15
JP3688816B2 (ja) 2005-08-31
KR980011680A (ko) 1998-04-30
US6010947A (en) 2000-01-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees