TW350790B - Device for and method of concentrating chemical substances for semiconductor - Google Patents

Device for and method of concentrating chemical substances for semiconductor

Info

Publication number
TW350790B
TW350790B TW086109218A TW86109218A TW350790B TW 350790 B TW350790 B TW 350790B TW 086109218 A TW086109218 A TW 086109218A TW 86109218 A TW86109218 A TW 86109218A TW 350790 B TW350790 B TW 350790B
Authority
TW
Taiwan
Prior art keywords
chemical substances
container
gas
heater
semiconductor
Prior art date
Application number
TW086109218A
Other languages
English (en)
Inventor
Yong-Woo Her
Heoung-Bin Lim
Byoung-Woo Son
Mi-Kyung Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of TW350790B publication Critical patent/TW350790B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D3/00—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping
    • B01D3/34—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping with one or more auxiliary substances
    • B01D3/343—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping with one or more auxiliary substances the substance being a gas
    • B01D3/346—Distillation or related exchange processes in which liquids are contacted with gaseous media, e.g. stripping with one or more auxiliary substances the substance being a gas the gas being used for removing vapours, e.g. transport gas

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
TW086109218A 1996-11-29 1997-06-28 Device for and method of concentrating chemical substances for semiconductor TW350790B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960060024A KR100211672B1 (ko) 1996-11-29 1996-11-29 반도체용 화학물질 농축장치 및 농축방법

Publications (1)

Publication Number Publication Date
TW350790B true TW350790B (en) 1999-01-21

Family

ID=19484799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109218A TW350790B (en) 1996-11-29 1997-06-28 Device for and method of concentrating chemical substances for semiconductor

Country Status (4)

Country Link
US (1) US6033989A (zh)
JP (1) JP3117671B2 (zh)
KR (1) KR100211672B1 (zh)
TW (1) TW350790B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4474260B2 (ja) * 2004-10-27 2010-06-02 株式会社日立ハイテクノロジーズ 自動分析装置の比例性確認試薬キット
JP5525677B2 (ja) * 2006-07-07 2014-06-18 株式会社半導体エネルギー研究所 精製装置
JP2012181092A (ja) * 2011-03-01 2012-09-20 Taiyo Nippon Sanso Corp 加熱濃縮装置、及び加熱濃縮方法
JP6179192B2 (ja) * 2013-05-27 2017-08-16 宇部興産株式会社 濃縮溶液の製造方法及び溶液濃縮用容器
CN111773748A (zh) * 2020-06-19 2020-10-16 广西壮族自治区亚热带作物研究所（广西亚热带农产品加工研究所） 一种浓缩装置及浓缩系统
CN111781054A (zh) * 2020-06-19 2020-10-16 广西壮族自治区亚热带作物研究所（广西亚热带农产品加工研究所） 一种赶酸装置及赶酸系统

Also Published As

Publication number Publication date
US6033989A (en) 2000-03-07
JPH10160653A (ja) 1998-06-19
KR100211672B1 (ko) 1999-08-02
JP3117671B2 (ja) 2000-12-18
KR19980040787A (ko) 1998-08-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees