TW344938B - Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board - Google Patents

Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board

Info

Publication number
TW344938B
TW344938B TW085114258A TW85114258A TW344938B TW 344938 B TW344938 B TW 344938B TW 085114258 A TW085114258 A TW 085114258A TW 85114258 A TW85114258 A TW 85114258A TW 344938 B TW344938 B TW 344938B
Authority
TW
Taiwan
Prior art keywords
circuit board
multilayer printed
conductive circuit
circuit layer
fabricating
Prior art date
Application number
TW085114258A
Other languages
English (en)
Inventor
Syuichi Okabe
Keizo Ing-Jiing
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW344938B publication Critical patent/TW344938B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW085114258A 1995-12-05 1996-11-20 Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board TW344938B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31668095A JP3234757B2 (ja) 1995-12-05 1995-12-05 多層配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
TW344938B true TW344938B (en) 1998-11-11

Family

ID=18079719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085114258A TW344938B (en) 1995-12-05 1996-11-20 Multilayer printed-circuit board and method of fabricating the multilayer printed-circuit board

Country Status (6)

Country Link
US (1) US6184479B1 (zh)
JP (1) JP3234757B2 (zh)
KR (1) KR100246863B1 (zh)
CN (1) CN1081434C (zh)
SG (1) SG72713A1 (zh)
TW (1) TW344938B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2111087B1 (en) * 1999-08-06 2011-01-19 Ibiden Co., Ltd. Multilayer printed wiring board
JP2001209918A (ja) * 1999-11-19 2001-08-03 Nitto Denko Corp 回路付サスペンション基板
JP4459406B2 (ja) * 2000-07-27 2010-04-28 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線板製造方法
CN1836472B (zh) * 2003-08-12 2010-06-16 株式会社藤仓 印刷布线板及其制造方法
JP2005166764A (ja) * 2003-11-28 2005-06-23 Toshiba Corp 多層プリント配線板および多層プリント配線板の製造方法
US8263878B2 (en) * 2008-03-25 2012-09-11 Ibiden Co., Ltd. Printed wiring board
US8272126B2 (en) * 2008-04-30 2012-09-25 Panasonic Corporation Method of producing circuit board
KR101286867B1 (ko) * 2008-04-30 2013-07-17 파나소닉 주식회사 애디티브법에 의해 회로 기판를 제조하는 방법 및 이 방법에 의해 얻어진 회로 기판과 다층 회로 기판
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
US8698003B2 (en) 2008-12-02 2014-04-15 Panasonic Corporation Method of producing circuit board, and circuit board obtained using the manufacturing method
US20110017498A1 (en) * 2009-07-27 2011-01-27 Endicott Interconnect Technologies, Inc. Photosensitive dielectric film
WO2011052211A1 (ja) * 2009-10-30 2011-05-05 パナソニック電工株式会社 回路基板及び回路基板に部品が実装された半導体装置
US9332642B2 (en) 2009-10-30 2016-05-03 Panasonic Corporation Circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113993A (ja) * 1983-11-25 1985-06-20 三菱電機株式会社 多層回路基板の製造方法
EP0557278B1 (en) * 1990-11-15 1994-12-07 International Business Machines Corporation A method of making a multilayer thin film structure
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5390412A (en) * 1993-04-08 1995-02-21 Gregoire; George D. Method for making printed circuit boards
JP3286651B2 (ja) * 1993-12-27 2002-05-27 株式会社住友金属エレクトロデバイス セラミック多層配線基板およびその製造法並びにセラミック多層配線基板用導電材料
US5723822A (en) * 1995-03-24 1998-03-03 Integrated Device Technology, Inc. Structure for fabricating a bonding pad having improved adhesion to an underlying structure
JP2917867B2 (ja) * 1995-08-14 1999-07-12 日本電気株式会社 多層配線基板

Also Published As

Publication number Publication date
CN1081434C (zh) 2002-03-20
JP3234757B2 (ja) 2001-12-04
KR100246863B1 (ko) 2000-03-15
SG72713A1 (en) 2000-05-23
JPH09162555A (ja) 1997-06-20
CN1162243A (zh) 1997-10-15
US6184479B1 (en) 2001-02-06

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