TW334368B - Perforation method and apparatus, hole inspection method and apparatus for plank work piece - Google Patents

Perforation method and apparatus, hole inspection method and apparatus for plank work piece

Info

Publication number
TW334368B
TW334368B TW086108706A TW86108706A TW334368B TW 334368 B TW334368 B TW 334368B TW 086108706 A TW086108706 A TW 086108706A TW 86108706 A TW86108706 A TW 86108706A TW 334368 B TW334368 B TW 334368B
Authority
TW
Taiwan
Prior art keywords
work piece
perforation
basis
holes
fixture plate
Prior art date
Application number
TW086108706A
Other languages
English (en)
Chinese (zh)
Inventor
Tsutomu Saitou
Original Assignee
Seiko Precision Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Precision Kk filed Critical Seiko Precision Kk
Application granted granted Critical
Publication of TW334368B publication Critical patent/TW334368B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41G—APPARATUS FOR BRONZE PRINTING, LINE PRINTING, OR FOR BORDERING OR EDGING SHEETS OR LIKE ARTICLES; AUXILIARY FOR PERFORATING IN CONJUNCTION WITH PRINTING
    • B41G7/00—Auxiliary perforating apparatus associated with printing devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Machine Tool Sensing Apparatuses (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW086108706A 1996-07-31 1997-06-21 Perforation method and apparatus, hole inspection method and apparatus for plank work piece TW334368B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20242396A JP3550462B2 (ja) 1996-07-31 1996-07-31 板状ワークの穴明け方法及び穴明け装置及び穴位置検出方法及び穴位置検出装置

Publications (1)

Publication Number Publication Date
TW334368B true TW334368B (en) 1998-06-21

Family

ID=16457271

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086108706A TW334368B (en) 1996-07-31 1997-06-21 Perforation method and apparatus, hole inspection method and apparatus for plank work piece

Country Status (3)

Country Link
JP (1) JP3550462B2 (ja)
KR (1) KR100221895B1 (ja)
TW (1) TW334368B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505884B (zh) * 2012-03-29 2015-11-01 Seiko Precision Kk Drilling device
TWI505883B (zh) * 2012-03-29 2015-11-01 Seiko Precision Kk Drilling device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1753570B1 (en) * 2004-06-09 2014-09-17 Novator AB Method and system for producing holes of various dimensions and configurations in a workpiece
JP4840559B2 (ja) * 2005-04-19 2011-12-21 株式会社トッパンＮｅｃサーキットソリューションズ プリント配線板及びその製造装置並びに製造方法
JP4542046B2 (ja) 2006-01-30 2010-09-08 セイコープレシジョン株式会社 穴開け方法及び穴開け装置
JP5131755B2 (ja) 2008-03-11 2013-01-30 ヤマハファインテック株式会社 被処理物処理装置
CN102284718B (zh) * 2011-07-21 2013-05-08 上海瑞纽机械装备制造有限公司 加工具有多个孔的板件的方法
JP5466686B2 (ja) * 2011-11-04 2014-04-09 セイコープレシジョン株式会社 配線板測定装置及び配線板測定方法
JP5965232B2 (ja) * 2012-07-17 2016-08-03 株式会社アマダホールディングス タレットパンチプレス
CN104942873B (zh) * 2014-03-27 2017-02-01 维嘉数控科技（苏州）有限公司 印制电路板的钻孔方法
CN104476611B (zh) * 2014-12-03 2016-05-04 深圳崇达多层线路板有限公司 一种大尺寸背板分区域钻孔方法
CN108537153B (zh) * 2018-03-27 2021-08-24 华南农业大学 一种基于椭圆拟合的原木板材孔洞缺陷检测与定位方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505884B (zh) * 2012-03-29 2015-11-01 Seiko Precision Kk Drilling device
TWI505883B (zh) * 2012-03-29 2015-11-01 Seiko Precision Kk Drilling device

Also Published As

Publication number Publication date
KR980008571A (ko) 1998-04-30
JPH1043917A (ja) 1998-02-17
KR100221895B1 (ko) 1999-09-15
JP3550462B2 (ja) 2004-08-04

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Legal Events

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MK4A Expiration of patent term of an invention patent