TW330371B - The method for inspecting defect in soldering-paste printing - Google Patents

The method for inspecting defect in soldering-paste printing

Info

Publication number
TW330371B
TW330371B TW085113335A TW85113335A TW330371B TW 330371 B TW330371 B TW 330371B TW 085113335 A TW085113335 A TW 085113335A TW 85113335 A TW85113335 A TW 85113335A TW 330371 B TW330371 B TW 330371B
Authority
TW
Taiwan
Prior art keywords
soldering
correcting
printing
paste
circuit
Prior art date
Application number
TW085113335A
Other languages
English (en)
Inventor
Akihiro Ishihara
Katashi Suzuki
Original Assignee
Aiphone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiphone Co Ltd filed Critical Aiphone Co Ltd
Application granted granted Critical
Publication of TW330371B publication Critical patent/TW330371B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW085113335A 1996-03-29 1996-10-24 The method for inspecting defect in soldering-paste printing TW330371B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8075686A JPH09266372A (ja) 1996-03-29 1996-03-29 クリームハンダ印刷劣化検出方法

Publications (1)

Publication Number Publication Date
TW330371B true TW330371B (en) 1998-04-21

Family

ID=13583336

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085113335A TW330371B (en) 1996-03-29 1996-10-24 The method for inspecting defect in soldering-paste printing

Country Status (7)

Country Link
US (1) US5809642A (zh)
JP (1) JPH09266372A (zh)
KR (1) KR100281735B1 (zh)
CN (1) CN1096826C (zh)
ID (1) ID16346A (zh)
MY (1) MY112065A (zh)
TW (1) TW330371B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3622462B2 (ja) * 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
KR100323512B1 (ko) * 1999-04-30 2002-02-04 구자홍 다층 기판 형성방법
JP2000326495A (ja) * 1999-05-24 2000-11-28 Matsushita Electric Ind Co Ltd クリーム半田印刷の検査方法
JP3893132B2 (ja) * 2004-01-22 2007-03-14 アンリツ株式会社 印刷はんだ検査装置
JP2007139727A (ja) * 2005-11-22 2007-06-07 Omron Corp 半田材検査装置、半田材検査方法、半田材検査装置の制御プログラム、および半田材検査装置の制御プログラムを記録した記録媒体
US8251924B2 (en) * 2006-07-07 2012-08-28 Ambient Corporation Neural translator
JP4454612B2 (ja) * 2006-11-13 2010-04-21 パナソニック株式会社 クリーム半田印刷方法及びクリーム半田印刷装置
US9661755B2 (en) 2009-07-06 2017-05-23 Camtek Ltd. System and a method for solder mask inspection
JP5407632B2 (ja) * 2009-07-22 2014-02-05 富士通株式会社 プリント基板試験支援装置、プリント基板試験支援方法、及びプリント基板試験支援プログラム
CN102991164B (zh) * 2011-07-28 2016-12-21 卡姆特有限公司 用于焊接掩模检验的系统和方法
CN103582316A (zh) * 2012-07-31 2014-02-12 西门子公司 用于组装电子元件的系统、置放机及其操作方法
KR101982243B1 (ko) * 2012-09-28 2019-05-24 삼성전자주식회사 사용자 단말 장치, 전자 장치 및 그 제어 방법
US10576566B2 (en) * 2016-06-06 2020-03-03 International Business Machines Corporation Solder paste misprint cleaning
JP6571617B2 (ja) * 2016-09-07 2019-09-04 ファナック株式会社 プリント板
US11718087B2 (en) * 2021-08-24 2023-08-08 Robert Bosch Gmbh Squeegee for stencil printing
US11622452B2 (en) 2021-08-24 2023-04-04 Robert Bosch Gmbh Method of manufacturing a conductive track on a board via stencil printing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5258606A (en) * 1975-11-07 1977-05-14 Hitachi Ltd Printing metal mask
JPH04106459A (ja) * 1990-08-28 1992-04-08 Sharp Corp 半田ペーストの印刷状態検査装置
JPH05338370A (ja) * 1992-06-10 1993-12-21 Dainippon Screen Mfg Co Ltd スクリーン印刷用メタルマスク版
US5564183A (en) * 1992-09-30 1996-10-15 Matsushita Electric Industrial Co., Ltd. Producing system of printed circuit board and method therefor
CN1094420C (zh) * 1994-04-14 2002-11-20 松下电器产业株式会社 网板印刷装置及网板印刷方法
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5493075A (en) * 1994-09-30 1996-02-20 International Business Machines Corporation Fine pitch solder formation on printed circuit board process and product

Also Published As

Publication number Publication date
ID16346A (id) 1997-09-25
CN1160983A (zh) 1997-10-01
US5809642A (en) 1998-09-22
MY112065A (en) 2001-03-31
CN1096826C (zh) 2002-12-18
KR100281735B1 (ko) 2001-02-15
JPH09266372A (ja) 1997-10-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees