TW328613B - Method and apparatus for releasing a workpiece from an electrostatic chuck - Google Patents

Method and apparatus for releasing a workpiece from an electrostatic chuck

Info

Publication number
TW328613B
TW328613B TW086108260A TW86108260A TW328613B TW 328613 B TW328613 B TW 328613B TW 086108260 A TW086108260 A TW 086108260A TW 86108260 A TW86108260 A TW 86108260A TW 328613 B TW328613 B TW 328613B
Authority
TW
Taiwan
Prior art keywords
workpiece
electrostatic chuck
releasing
inductor
electrode
Prior art date
Application number
TW086108260A
Other languages
English (en)
Inventor
Shel Viktor
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW328613B publication Critical patent/TW328613B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Jigs For Machine Tools (AREA)
TW086108260A 1996-07-31 1997-06-14 Method and apparatus for releasing a workpiece from an electrostatic chuck TW328613B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/690,086 US5790365A (en) 1996-07-31 1996-07-31 Method and apparatus for releasing a workpiece from and electrostatic chuck

Publications (1)

Publication Number Publication Date
TW328613B true TW328613B (en) 1998-03-21

Family

ID=24771021

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086108260A TW328613B (en) 1996-07-31 1997-06-14 Method and apparatus for releasing a workpiece from an electrostatic chuck

Country Status (5)

Country Link
US (1) US5790365A (zh)
EP (1) EP0822590A3 (zh)
JP (1) JPH1074826A (zh)
KR (1) KR980012817A (zh)
TW (1) TW328613B (zh)

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US6840600B2 (en) 1997-07-15 2005-01-11 Silverbrook Research Pty Ltd Fluid ejection device that incorporates covering formations for actuators of the fluid ejection device
US7246884B2 (en) 1997-07-15 2007-07-24 Silverbrook Research Pty Ltd Inkjet printhead having enclosed inkjet actuators
US7556356B1 (en) 1997-07-15 2009-07-07 Silverbrook Research Pty Ltd Inkjet printhead integrated circuit with ink spread prevention
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US6221221B1 (en) 1998-11-16 2001-04-24 Applied Materials, Inc. Apparatus for providing RF return current path control in a semiconductor wafer processing system
US6236555B1 (en) * 1999-04-19 2001-05-22 Applied Materials, Inc. Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
US6821571B2 (en) 1999-06-18 2004-11-23 Applied Materials Inc. Plasma treatment to enhance adhesion and to minimize oxidation of carbon-containing layers
JP3464177B2 (ja) * 1999-09-06 2003-11-05 沖電気工業株式会社 半導体製造装置および静電気除去方法
EP1096561A3 (en) * 1999-10-08 2002-04-17 Applied Materials, Inc. Method for rapid dechucking of a semiconductor wafer from an electrostatic chuck
US6307728B1 (en) 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
US6676800B1 (en) * 2000-03-15 2004-01-13 Applied Materials, Inc. Particle contamination cleaning from substrates using plasmas, reactive gases, and mechanical agitation
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
JP4559595B2 (ja) * 2000-07-17 2010-10-06 東京エレクトロン株式会社 被処理体の載置装置及びプラズマ処理装置
KR100376879B1 (ko) * 2000-11-01 2003-03-19 주식회사 하이닉스반도체 스틱킹이 없는 정전척
JP2002203837A (ja) * 2000-12-28 2002-07-19 Mitsubishi Electric Corp プラズマ処理方法および装置並びに半導体装置の製造方法
US6403322B1 (en) 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
US6665168B2 (en) 2001-03-30 2003-12-16 Taiwan Semiconductor Manufacturing Co. Ltd Electrostatic chuck apparatus and method for efficiently dechucking a substrate therefrom
US6962879B2 (en) * 2001-03-30 2005-11-08 Lam Research Corporation Method of plasma etching silicon nitride
JP2003060018A (ja) * 2001-08-13 2003-02-28 Nissin Electric Co Ltd 基板吸着方法およびその装置
US7897029B2 (en) * 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US8361340B2 (en) * 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US7387738B2 (en) 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
US7198276B2 (en) * 2003-10-24 2007-04-03 International Business Machines Corporation Adaptive electrostatic pin chuck
US7534301B2 (en) * 2004-09-21 2009-05-19 Applied Materials, Inc. RF grounding of cathode in process chamber
US7511936B2 (en) * 2005-07-20 2009-03-31 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for dynamic plasma treatment of bipolar ESC system
JP5094002B2 (ja) * 2005-09-06 2012-12-12 ルネサスエレクトロニクス株式会社 プラズマ処理装置およびその異常放電抑止方法
KR100819078B1 (ko) * 2006-11-27 2008-04-02 삼성전자주식회사 정전 척에서 웨이퍼를 디척킹하는 장치 및 방법
KR101312292B1 (ko) * 2006-12-11 2013-09-27 엘아이지에이디피 주식회사 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법
US7508494B2 (en) * 2006-12-22 2009-03-24 Asml Netherlands B.V. Lithographic apparatus and a subtrate table for exciting a shockwave in a substrate
KR101295776B1 (ko) * 2007-08-02 2013-08-12 삼성전자주식회사 직류 및 교류 전압들을 교대로 사용하는 웨이퍼의 디척킹방법 및 이를 채택하는 반도체 소자의 제조 장치
US7995323B2 (en) * 2008-07-14 2011-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for securely dechucking wafers
US8416555B2 (en) 2008-07-14 2013-04-09 Taiwan Semiconductor Manufacturing Co., Ltd. System for securely dechucking wafers
US8000081B2 (en) * 2008-07-14 2011-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for safely dechucking wafers
CN101872733B (zh) * 2009-04-24 2012-06-27 中微半导体设备(上海)有限公司 感测和移除被加工半导体工艺件的残余电荷的系统和方法
CN102044466B (zh) * 2009-10-12 2013-03-27 北京北方微电子基地设备工艺研究中心有限责任公司 一种静电卡盘及其残余电荷的消除方法
US9666466B2 (en) 2013-05-07 2017-05-30 Applied Materials, Inc. Electrostatic chuck having thermally isolated zones with minimal crosstalk
US9232626B2 (en) 2013-11-04 2016-01-05 Kla-Tencor Corporation Wafer grounding using localized plasma source
KR102371870B1 (ko) * 2017-03-09 2022-03-07 에베 그룹 에. 탈너 게엠베하 정전식 기판 홀더
CN110581099B (zh) * 2018-06-07 2022-06-14 北京北方华创微电子装备有限公司 静电卡盘和工艺腔室
US11798833B2 (en) 2020-02-26 2023-10-24 Applied Materials, Inc. Methods of use of a servo control system
US11415230B2 (en) 2020-03-31 2022-08-16 Applied Material, Inc. Slit valve pneumatic control
CN113862645B (zh) * 2021-09-28 2023-09-08 北京北方华创微电子装备有限公司 承载装置及半导体工艺腔室

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US5459632A (en) * 1994-03-07 1995-10-17 Applied Materials, Inc. Releasing a workpiece from an electrostatic chuck

Also Published As

Publication number Publication date
US5790365A (en) 1998-08-04
KR980012817A (ko) 1998-04-30
EP0822590A2 (en) 1998-02-04
JPH1074826A (ja) 1998-03-17
EP0822590A3 (en) 1999-10-13

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