TW322595B - - Google Patents

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Publication number
TW322595B
TW322595B TW084111554A TW84111554A TW322595B TW 322595 B TW322595 B TW 322595B TW 084111554 A TW084111554 A TW 084111554A TW 84111554 A TW84111554 A TW 84111554A TW 322595 B TW322595 B TW 322595B
Authority
TW
Taiwan
Prior art keywords
film
conductor
insulating film
semiconductor
conductor layer
Prior art date
Application number
TW084111554A
Other languages
English (en)
Chinese (zh)
Original Assignee
Hitachi Ltd
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Texas Instruments Inc filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW322595B publication Critical patent/TW322595B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Memories (AREA)
TW084111554A 1995-09-13 1995-11-01 TW322595B (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7235003A JPH0982800A (ja) 1995-09-13 1995-09-13 半導体集積回路装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW322595B true TW322595B (ja) 1997-12-11

Family

ID=16979627

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084111554A TW322595B (ja) 1995-09-13 1995-11-01

Country Status (3)

Country Link
JP (1) JPH0982800A (ja)
KR (1) KR970017961A (ja)
TW (1) TW322595B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW410435B (en) 1998-06-30 2000-11-01 United Microelectronics Corp The metal interconnection manufacture by using the chemical mechanical polishing process
JP2001284360A (ja) * 2000-03-31 2001-10-12 Hitachi Ltd 半導体装置
KR100434334B1 (ko) * 2002-09-13 2004-06-04 주식회사 하이닉스반도체 듀얼 마스크를 이용한 반도체 소자의 커패시터 제조 방법
JP7134902B2 (ja) * 2019-03-05 2022-09-12 キオクシア株式会社 半導体装置

Also Published As

Publication number Publication date
KR970017961A (ko) 1997-04-30
JPH0982800A (ja) 1997-03-28

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