TW312860B - - Google Patents
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- Publication number
- TW312860B TW312860B TW085107705A TW85107705A TW312860B TW 312860 B TW312860 B TW 312860B TW 085107705 A TW085107705 A TW 085107705A TW 85107705 A TW85107705 A TW 85107705A TW 312860 B TW312860 B TW 312860B
- Authority
- TW
- Taiwan
- Prior art keywords
- pcb
- support plate
- patent application
- socket
- item
- Prior art date
Links
- 238000000034 method Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 claims 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000004883 computer application Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 101100221174 Mus musculus Cnst gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/50—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/542,425 US5707247A (en) | 1995-10-12 | 1995-10-12 | Low-profile zero-insertion force socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW312860B true TW312860B (enExample) | 1997-08-11 |
Family
ID=24163787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW085107705A TW312860B (enExample) | 1995-10-12 | 1996-06-26 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5707247A (enExample) |
| EP (1) | EP0878033B1 (enExample) |
| JP (1) | JPH11513837A (enExample) |
| KR (1) | KR100301753B1 (enExample) |
| CN (1) | CN100372176C (enExample) |
| AU (1) | AU7436896A (enExample) |
| BR (1) | BR9610924A (enExample) |
| DE (1) | DE69621046T2 (enExample) |
| MY (1) | MY116533A (enExample) |
| TW (1) | TW312860B (enExample) |
| WO (1) | WO1997014195A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5855489A (en) * | 1997-05-12 | 1999-01-05 | The Whitaker Corporation | Low profile actuator for ZIF socket |
| US6164999A (en) * | 1997-07-30 | 2000-12-26 | Intel Corporation | Zero insertion force socket and method for employing same to mount a processor |
| US20010000765A1 (en) * | 1997-10-03 | 2001-05-03 | Enplas Corporation, A Japan Corporation | Socket for an electric device |
| US6269535B1 (en) * | 1998-09-04 | 2001-08-07 | Hon Hai Precision Ind. Co., Ltd. | Handle tool used for a ZIF socket and an assembly comprising the handle tool and the ZIF socket |
| JP3256898B2 (ja) | 1998-12-05 | 2002-02-18 | モレックス インコーポレーテッド | ピングリッドアレイパッケージ用ソケット |
| US6168976B1 (en) | 1999-01-06 | 2001-01-02 | Intel Corporation | Socketable BGA package |
| TW415684U (en) * | 1999-04-27 | 2000-12-11 | Hon Hai Prec Ind Co Ltd | Grid array electrical connector |
| TW433625U (en) * | 1999-05-15 | 2001-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| TW592400U (en) * | 1999-05-15 | 2004-06-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| US6247953B1 (en) * | 1999-06-07 | 2001-06-19 | Hon Hai Precision Ind. Co., Ltd. | Single-point driving mechanism of a ZIF PGA socket and the socket using the same |
| JP3287464B2 (ja) | 1999-06-15 | 2002-06-04 | タイコエレクトロニクスアンプ株式会社 | Ｚｉｆ型ソケット |
| TW417833U (en) * | 1999-07-14 | 2001-01-01 | Foxconn Prec Components Co Ltd | Chip mounting/dismounting tool |
| US6146178A (en) * | 1999-09-24 | 2000-11-14 | Hon Hai Precision Ind. Co., Ltd. | Cam mechanism for a zero-insertion-force connector |
| US6203350B1 (en) * | 1999-11-12 | 2001-03-20 | Hon Hai Precision Inc. Co., Ltd. | Zif socket |
| US6347951B1 (en) * | 1999-11-15 | 2002-02-19 | The Whitaker Corporation | Zero insertion force socket actuation tool |
| TW435836U (en) * | 1999-11-30 | 2001-05-16 | Hon Hai Prec Ind Co Ltd | Socket connector |
| US6533613B1 (en) | 1999-12-20 | 2003-03-18 | Intel Corporation | Shielded zero insertion force socket |
| TW438132U (en) * | 2000-01-28 | 2001-05-28 | Hon Hai Prec Ind Co Ltd | Socket connector |
| US6477051B1 (en) * | 2001-09-20 | 2002-11-05 | Hewlett-Packard Company | Socket activation interlock |
| US6623290B2 (en) | 2001-12-18 | 2003-09-23 | Intel Corporation | Coverless ZIF socket for mounting an integrated circuit package on a circuit board |
| TW549637U (en) * | 2002-06-06 | 2003-08-21 | Hon Hai Prec Ind Co Ltd | Connector |
| US6921277B2 (en) * | 2002-10-01 | 2005-07-26 | Tyco Electronics Corporation | Processor and heat sink actuation system |
| US6903941B2 (en) * | 2002-10-24 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Printed circuit board assembly employing a press fit electrical connector |
| US7056143B2 (en) * | 2003-03-27 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Electronic device having removable processor assembly and method of operating same |
| US6969270B2 (en) * | 2003-06-26 | 2005-11-29 | Intel Corporation | Integrated socket and cable connector |
| US7242097B2 (en) | 2003-06-30 | 2007-07-10 | Intel Corporation | Electromigration barrier layers for solder joints |
| US6857889B1 (en) * | 2003-09-26 | 2005-02-22 | General Motors Corporation | Vehicle body to chassis connection and method |
| JP4319574B2 (ja) * | 2004-04-14 | 2009-08-26 | タイコエレクトロニクスアンプ株式会社 | Ｉｃソケット |
| US7374446B2 (en) * | 2004-04-14 | 2008-05-20 | Tyco Electronics Amp K.K | IC socket |
| JP2007053071A (ja) | 2005-07-20 | 2007-03-01 | Alps Electric Co Ltd | 接続素子および前記接続素子を使用した回路接続装置 |
| WO2007023596A1 (ja) | 2005-08-25 | 2007-03-01 | Sumitomo Electric Industries, Ltd. | 異方性導電シート、その製造方法、接続方法および検査方法 |
| US7604486B2 (en) * | 2006-12-21 | 2009-10-20 | Intel Corporation | Lateral force countering load mechanism for LGA sockets |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676832A (en) * | 1970-12-28 | 1972-07-11 | Ibm | Connector |
| US4322119A (en) * | 1980-03-05 | 1982-03-30 | Bell Telephone Laboratories, Incorporated | Circuit module mounting assembly |
| US4420205A (en) * | 1981-09-14 | 1983-12-13 | Augat Inc. | Low insertion force electronic component socket |
| US4498725A (en) * | 1982-06-02 | 1985-02-12 | Amp Incorporated | Electrical connector |
| GB8309402D0 (en) * | 1983-04-07 | 1983-05-11 | Int Computers Ltd | Electrical connectors |
| US4773873A (en) * | 1986-10-01 | 1988-09-27 | Thinking Machines Corporation | Bistable zero insertion force connector |
| US4950980A (en) * | 1988-07-29 | 1990-08-21 | Pfaff Wayne | Test socket for electronic device packages |
| US5384692A (en) * | 1993-12-16 | 1995-01-24 | Intel Corporation | Socket with in-socket embedded integrated circuit |
| US5425652A (en) * | 1994-10-03 | 1995-06-20 | Hsu; Feng-Chien | Fastening device in an IC socket |
-
1995
- 1995-10-12 US US08/542,425 patent/US5707247A/en not_active Expired - Lifetime
-
1996
- 1996-06-19 MY MYPI96002467A patent/MY116533A/en unknown
- 1996-06-26 TW TW085107705A patent/TW312860B/zh active
- 1996-10-10 DE DE69621046T patent/DE69621046T2/de not_active Expired - Lifetime
- 1996-10-10 KR KR1019980702706A patent/KR100301753B1/ko not_active Expired - Fee Related
- 1996-10-10 BR BR9610924A patent/BR9610924A/pt not_active Application Discontinuation
- 1996-10-10 AU AU74368/96A patent/AU7436896A/en not_active Abandoned
- 1996-10-10 CN CNB961988010A patent/CN100372176C/zh not_active Expired - Fee Related
- 1996-10-10 JP JP9515197A patent/JPH11513837A/ja active Pending
- 1996-10-10 EP EP96936329A patent/EP0878033B1/en not_active Expired - Lifetime
- 1996-10-10 WO PCT/US1996/016236 patent/WO1997014195A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE69621046T2 (de) | 2003-01-02 |
| DE69621046D1 (de) | 2002-06-06 |
| EP0878033A4 (en) | 1999-01-27 |
| EP0878033B1 (en) | 2002-05-02 |
| CN100372176C (zh) | 2008-02-27 |
| BR9610924A (pt) | 1999-02-17 |
| AU7436896A (en) | 1997-04-30 |
| CN1203701A (zh) | 1998-12-30 |
| JPH11513837A (ja) | 1999-11-24 |
| EP0878033A1 (en) | 1998-11-18 |
| US5707247A (en) | 1998-01-13 |
| WO1997014195A1 (en) | 1997-04-17 |
| MY116533A (en) | 2004-02-28 |
| KR19990064220A (ko) | 1999-07-26 |
| KR100301753B1 (ko) | 2001-09-06 |
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