KR100301753B1 - 로우프로파일의무삽입력소켓 - Google Patents
로우프로파일의무삽입력소켓 Download PDFInfo
- Publication number
- KR100301753B1 KR100301753B1 KR1019980702706A KR19980702706A KR100301753B1 KR 100301753 B1 KR100301753 B1 KR 100301753B1 KR 1019980702706 A KR1019980702706 A KR 1019980702706A KR 19980702706 A KR19980702706 A KR 19980702706A KR 100301753 B1 KR100301753 B1 KR 100301753B1
- Authority
- KR
- South Korea
- Prior art keywords
- support plate
- socket
- pcb
- cam
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/50—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8/542425 | 1995-10-12 | ||
| US08/542425 | 1995-10-12 | ||
| US08/542,425 US5707247A (en) | 1995-10-12 | 1995-10-12 | Low-profile zero-insertion force socket |
| PCT/US1996/016236 WO1997014195A1 (en) | 1995-10-12 | 1996-10-10 | Low-profile zero-insertion-force socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19990064220A KR19990064220A (ko) | 1999-07-26 |
| KR100301753B1 true KR100301753B1 (ko) | 2001-09-06 |
Family
ID=24163787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980702706A Expired - Fee Related KR100301753B1 (ko) | 1995-10-12 | 1996-10-10 | 로우프로파일의무삽입력소켓 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US5707247A (enExample) |
| EP (1) | EP0878033B1 (enExample) |
| JP (1) | JPH11513837A (enExample) |
| KR (1) | KR100301753B1 (enExample) |
| CN (1) | CN100372176C (enExample) |
| AU (1) | AU7436896A (enExample) |
| BR (1) | BR9610924A (enExample) |
| DE (1) | DE69621046T2 (enExample) |
| MY (1) | MY116533A (enExample) |
| TW (1) | TW312860B (enExample) |
| WO (1) | WO1997014195A1 (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5855489A (en) * | 1997-05-12 | 1999-01-05 | The Whitaker Corporation | Low profile actuator for ZIF socket |
| US6164999A (en) * | 1997-07-30 | 2000-12-26 | Intel Corporation | Zero insertion force socket and method for employing same to mount a processor |
| US20010000765A1 (en) * | 1997-10-03 | 2001-05-03 | Enplas Corporation, A Japan Corporation | Socket for an electric device |
| US6269535B1 (en) * | 1998-09-04 | 2001-08-07 | Hon Hai Precision Ind. Co., Ltd. | Handle tool used for a ZIF socket and an assembly comprising the handle tool and the ZIF socket |
| JP3256898B2 (ja) | 1998-12-05 | 2002-02-18 | モレックス インコーポレーテッド | ピングリッドアレイパッケージ用ソケット |
| US6168976B1 (en) | 1999-01-06 | 2001-01-02 | Intel Corporation | Socketable BGA package |
| TW415684U (en) * | 1999-04-27 | 2000-12-11 | Hon Hai Prec Ind Co Ltd | Grid array electrical connector |
| TW433625U (en) * | 1999-05-15 | 2001-05-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| TW592400U (en) * | 1999-05-15 | 2004-06-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| US6247953B1 (en) * | 1999-06-07 | 2001-06-19 | Hon Hai Precision Ind. Co., Ltd. | Single-point driving mechanism of a ZIF PGA socket and the socket using the same |
| JP3287464B2 (ja) | 1999-06-15 | 2002-06-04 | タイコエレクトロニクスアンプ株式会社 | Zif型ソケット |
| TW417833U (en) * | 1999-07-14 | 2001-01-01 | Foxconn Prec Components Co Ltd | Chip mounting/dismounting tool |
| US6146178A (en) * | 1999-09-24 | 2000-11-14 | Hon Hai Precision Ind. Co., Ltd. | Cam mechanism for a zero-insertion-force connector |
| US6203350B1 (en) * | 1999-11-12 | 2001-03-20 | Hon Hai Precision Inc. Co., Ltd. | Zif socket |
| US6347951B1 (en) * | 1999-11-15 | 2002-02-19 | The Whitaker Corporation | Zero insertion force socket actuation tool |
| TW435836U (en) * | 1999-11-30 | 2001-05-16 | Hon Hai Prec Ind Co Ltd | Socket connector |
| US6533613B1 (en) | 1999-12-20 | 2003-03-18 | Intel Corporation | Shielded zero insertion force socket |
| TW438132U (en) * | 2000-01-28 | 2001-05-28 | Hon Hai Prec Ind Co Ltd | Socket connector |
| US6477051B1 (en) * | 2001-09-20 | 2002-11-05 | Hewlett-Packard Company | Socket activation interlock |
| US6623290B2 (en) | 2001-12-18 | 2003-09-23 | Intel Corporation | Coverless ZIF socket for mounting an integrated circuit package on a circuit board |
| TW549637U (en) * | 2002-06-06 | 2003-08-21 | Hon Hai Prec Ind Co Ltd | Connector |
| US6921277B2 (en) * | 2002-10-01 | 2005-07-26 | Tyco Electronics Corporation | Processor and heat sink actuation system |
| US6903941B2 (en) * | 2002-10-24 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Printed circuit board assembly employing a press fit electrical connector |
| US7056143B2 (en) * | 2003-03-27 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Electronic device having removable processor assembly and method of operating same |
| US6969270B2 (en) * | 2003-06-26 | 2005-11-29 | Intel Corporation | Integrated socket and cable connector |
| US7242097B2 (en) | 2003-06-30 | 2007-07-10 | Intel Corporation | Electromigration barrier layers for solder joints |
| US6857889B1 (en) * | 2003-09-26 | 2005-02-22 | General Motors Corporation | Vehicle body to chassis connection and method |
| JP4319574B2 (ja) * | 2004-04-14 | 2009-08-26 | タイコエレクトロニクスアンプ株式会社 | Icソケット |
| US7374446B2 (en) * | 2004-04-14 | 2008-05-20 | Tyco Electronics Amp K.K | IC socket |
| JP2007053071A (ja) | 2005-07-20 | 2007-03-01 | Alps Electric Co Ltd | 接続素子および前記接続素子を使用した回路接続装置 |
| WO2007023596A1 (ja) | 2005-08-25 | 2007-03-01 | Sumitomo Electric Industries, Ltd. | 異方性導電シート、その製造方法、接続方法および検査方法 |
| US7604486B2 (en) * | 2006-12-21 | 2009-10-20 | Intel Corporation | Lateral force countering load mechanism for LGA sockets |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4420205A (en) * | 1981-09-14 | 1983-12-13 | Augat Inc. | Low insertion force electronic component socket |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676832A (en) * | 1970-12-28 | 1972-07-11 | Ibm | Connector |
| US4322119A (en) * | 1980-03-05 | 1982-03-30 | Bell Telephone Laboratories, Incorporated | Circuit module mounting assembly |
| US4498725A (en) * | 1982-06-02 | 1985-02-12 | Amp Incorporated | Electrical connector |
| GB8309402D0 (en) * | 1983-04-07 | 1983-05-11 | Int Computers Ltd | Electrical connectors |
| US4773873A (en) * | 1986-10-01 | 1988-09-27 | Thinking Machines Corporation | Bistable zero insertion force connector |
| US4950980A (en) * | 1988-07-29 | 1990-08-21 | Pfaff Wayne | Test socket for electronic device packages |
| US5384692A (en) * | 1993-12-16 | 1995-01-24 | Intel Corporation | Socket with in-socket embedded integrated circuit |
| US5425652A (en) * | 1994-10-03 | 1995-06-20 | Hsu; Feng-Chien | Fastening device in an IC socket |
-
1995
- 1995-10-12 US US08/542,425 patent/US5707247A/en not_active Expired - Lifetime
-
1996
- 1996-06-19 MY MYPI96002467A patent/MY116533A/en unknown
- 1996-06-26 TW TW085107705A patent/TW312860B/zh active
- 1996-10-10 DE DE69621046T patent/DE69621046T2/de not_active Expired - Lifetime
- 1996-10-10 KR KR1019980702706A patent/KR100301753B1/ko not_active Expired - Fee Related
- 1996-10-10 BR BR9610924A patent/BR9610924A/pt not_active Application Discontinuation
- 1996-10-10 AU AU74368/96A patent/AU7436896A/en not_active Abandoned
- 1996-10-10 CN CNB961988010A patent/CN100372176C/zh not_active Expired - Fee Related
- 1996-10-10 JP JP9515197A patent/JPH11513837A/ja active Pending
- 1996-10-10 EP EP96936329A patent/EP0878033B1/en not_active Expired - Lifetime
- 1996-10-10 WO PCT/US1996/016236 patent/WO1997014195A1/en not_active Ceased
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4420205A (en) * | 1981-09-14 | 1983-12-13 | Augat Inc. | Low insertion force electronic component socket |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69621046T2 (de) | 2003-01-02 |
| DE69621046D1 (de) | 2002-06-06 |
| EP0878033A4 (en) | 1999-01-27 |
| TW312860B (enExample) | 1997-08-11 |
| EP0878033B1 (en) | 2002-05-02 |
| CN100372176C (zh) | 2008-02-27 |
| BR9610924A (pt) | 1999-02-17 |
| AU7436896A (en) | 1997-04-30 |
| CN1203701A (zh) | 1998-12-30 |
| JPH11513837A (ja) | 1999-11-24 |
| EP0878033A1 (en) | 1998-11-18 |
| US5707247A (en) | 1998-01-13 |
| WO1997014195A1 (en) | 1997-04-17 |
| MY116533A (en) | 2004-02-28 |
| KR19990064220A (ko) | 1999-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100301753B1 (ko) | 로우프로파일의무삽입력소켓 | |
| US9746879B2 (en) | Rigid circuit board with flexibly attached module | |
| US9338895B2 (en) | Method for making an electrical circuit | |
| US8817458B2 (en) | Flexible circuit board and connection system | |
| US8179693B2 (en) | Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements | |
| US8899994B2 (en) | Compression connector system | |
| KR100204617B1 (ko) | 전기 회로 부재를 위치시키는 방법 및 장치 | |
| US6884086B1 (en) | System and method for connecting a power converter to a land grid array socket | |
| US6449155B1 (en) | Land grid array subassembly for multichip modules | |
| US6392899B1 (en) | Processor power delivery system | |
| US8834182B2 (en) | Pierced flexible circuit and compression joint | |
| US20140104786A1 (en) | Electronic module with heat spreading enclosure | |
| US6461169B1 (en) | Interconnecting circuit modules to a motherboard using an edge connector with conductive polymer contacts | |
| US6074220A (en) | Direct circuit to circuit stored energy connector | |
| US8902606B2 (en) | Electronic interconnect system | |
| US4674811A (en) | Apparatus for connecting pin grid array devices to printed wiring boards | |
| CN2400930Y (zh) | 低构形零插入力连接器 | |
| Chan et al. | BGA sockets-a dendritic solution | |
| JPH08512168A (ja) | 高密度電子装置用コネクタ | |
| US6817878B2 (en) | Zero mounting force solder-free connector/component and method | |
| HK1016755A (en) | Low-profile zero-insertion-force socket | |
| HK1016755B (en) | Low-profile zero-insertion-force socket | |
| JP2000138330A (ja) | 変換モジュール |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20040628 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20040628 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |