TW301047B - - Google Patents

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Publication number
TW301047B
TW301047B TW082104103A TW82104103A TW301047B TW 301047 B TW301047 B TW 301047B TW 082104103 A TW082104103 A TW 082104103A TW 82104103 A TW82104103 A TW 82104103A TW 301047 B TW301047 B TW 301047B
Authority
TW
Taiwan
Prior art keywords
patent application
item
polymerization adhesive
adhesive
scope
Prior art date
Application number
TW082104103A
Other languages
English (en)
Chinese (zh)
Inventor
Archambault Helene
Boutin Lynda
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW301047B publication Critical patent/TW301047B/zh

Links

Classifications

    • H10W74/47—
    • H10W74/00—
    • H10W70/415—
    • H10W72/0198—
    • H10W74/127—
    • H10W72/073—
    • H10W72/075—
    • H10W72/5522—
    • H10W72/865—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW082104103A 1993-03-15 1993-05-25 TW301047B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US3142793A 1993-03-15 1993-03-15

Publications (1)

Publication Number Publication Date
TW301047B true TW301047B (OSRAM) 1997-03-21

Family

ID=21859396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082104103A TW301047B (OSRAM) 1993-03-15 1993-05-25

Country Status (4)

Country Link
EP (1) EP0619607A3 (OSRAM)
JP (1) JP2933300B2 (OSRAM)
KR (1) KR0167465B1 (OSRAM)
TW (1) TW301047B (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104987840A (zh) * 2015-08-06 2015-10-21 南昌航空大学 一种用空气为介质的低温等离子体处理丁腈橡胶提高粘接性能的方法
US9704786B2 (en) * 2015-09-25 2017-07-11 Infineon Technologies Ag Direct selective adhesion promotor plating

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857443A (ja) * 1981-09-29 1983-04-05 Dainippon Printing Co Ltd 接着性フイルム及びその製造方法
JPS59195851A (ja) * 1983-04-22 1984-11-07 Hitachi Ltd 半導体装置の製造方法
JPH0212995A (ja) * 1988-06-30 1990-01-17 Nec Corp 電波吸収体
EP0407585A4 (en) * 1988-07-15 1992-06-10 Toray Silicone Co. Ltd. Semiconductor device sealed with resin and a method of producing the same

Also Published As

Publication number Publication date
JP2933300B2 (ja) 1999-08-09
KR0167465B1 (ko) 1999-01-15
EP0619607A2 (en) 1994-10-12
EP0619607A3 (en) 1994-11-02
KR940022810A (ko) 1994-10-21
JPH06299123A (ja) 1994-10-25

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