TW294814B - - Google Patents

Download PDF

Info

Publication number
TW294814B
TW294814B TW84110223A TW84110223A TW294814B TW 294814 B TW294814 B TW 294814B TW 84110223 A TW84110223 A TW 84110223A TW 84110223 A TW84110223 A TW 84110223A TW 294814 B TW294814 B TW 294814B
Authority
TW
Taiwan
Prior art keywords
particles
resin
item
conductive film
alloy particles
Prior art date
Application number
TW84110223A
Other languages
English (en)
Chinese (zh)
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW294814B publication Critical patent/TW294814B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H10W72/073—
    • H10W72/325—
    • H10W72/351—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW84110223A 1994-09-30 1995-09-30 TW294814B (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23654794A JPH08102218A (ja) 1994-09-30 1994-09-30 異方性導電フィルム

Publications (1)

Publication Number Publication Date
TW294814B true TW294814B (OSRAM) 1997-01-01

Family

ID=17002280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84110223A TW294814B (OSRAM) 1994-09-30 1995-09-30

Country Status (4)

Country Link
US (1) US5770305A (OSRAM)
JP (1) JPH08102218A (OSRAM)
KR (1) KR0175678B1 (OSRAM)
TW (1) TW294814B (OSRAM)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6319594B1 (en) * 1998-03-17 2001-11-20 Dai Nippon Printing Co., Ltd. Low reflective antistatic hardcoat film
US6048919A (en) 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
US6287894B1 (en) 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
US6620497B2 (en) 2000-01-11 2003-09-16 Cool Options, Inc. Polymer composition with boron nitride coated carbon flakes
US20010049028A1 (en) * 2000-01-11 2001-12-06 Mccullough Kevin A Metal injection molding material with high aspect ratio filler
US6680015B2 (en) 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
US6379053B1 (en) 2000-05-30 2002-04-30 Infineon Technologies North America Corp. Multi-fiber fiber optic connectors
US6710109B2 (en) * 2000-07-13 2004-03-23 Cool Options, Inc. A New Hampshire Corp. Thermally conductive and high strength injection moldable composition
JP2002075064A (ja) * 2000-08-23 2002-03-15 Tdk Corp 異方導電性フィルム及びその製造方法並びに異方導電性フィルムを用いた表示装置
JP3851767B2 (ja) * 2000-10-16 2006-11-29 ソニーケミカル＆インフォメーションデバイス株式会社 接着フィルム、及び接着フィルムの製造方法
US6703566B1 (en) 2000-10-25 2004-03-09 Sae Magnetics (H.K.), Ltd. Bonding structure for a hard disk drive suspension using anisotropic conductive film
US20020074637A1 (en) * 2000-12-19 2002-06-20 Intel Corporation Stacked flip chip assemblies
US6847747B2 (en) * 2001-04-30 2005-01-25 Intel Corporation Optical and electrical interconnect
KR100418031B1 (ko) * 2001-05-11 2004-02-14 엘지전자 주식회사 표시장치
KR100435034B1 (ko) * 2001-11-08 2004-06-09 엘지전선 주식회사 이방성 도전필름
US20040086704A1 (en) * 2002-11-04 2004-05-06 Schneider Terry L. Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
US20040086705A1 (en) * 2002-11-04 2004-05-06 Schneider Terry L. Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
US20040086706A1 (en) * 2002-11-04 2004-05-06 Schneider Terry L. Polymer composite structure reinforced with shape memory alloy and method of manufacturing same
TWI238444B (en) * 2002-12-10 2005-08-21 Seiko Epson Corp Method for manufacturing optoelectronic device, optoelectronic device and electronic machine
US7038327B2 (en) * 2003-11-11 2006-05-02 Au Optronics Corp. Anisotropic conductive film bonding pad
TWI243386B (en) * 2004-02-26 2005-11-11 Au Optronics Corp Anisotropic conductive film pad
KR100597391B1 (ko) * 2004-05-12 2006-07-06 제일모직주식회사 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름
JP5004654B2 (ja) * 2007-05-16 2012-08-22 パナソニック株式会社 配線基板の接続方法および配線基板構造
KR100900458B1 (ko) * 2007-09-21 2009-06-02 한국과학기술원 유연성이 증대된 플렉시블 디스플레이용 폴리머 기판
JP2013182823A (ja) * 2012-03-02 2013-09-12 Dexerials Corp 接続体の製造方法、及び異方性導電接着剤
JP2014065766A (ja) * 2012-09-24 2014-04-17 Dexerials Corp 異方性導電接着剤
KR20160046977A (ko) * 2014-10-20 2016-05-02 삼성디스플레이 주식회사 이방성 도전입자
KR102454104B1 (ko) 2022-03-02 2022-10-17 표준머신비전 주식회사 Acf 도전필름 외관 검사장치 및 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6280912A (ja) * 1985-10-02 1987-04-14 セイコーエプソン株式会社 異方性導電膜
JPS62290078A (ja) * 1986-06-09 1987-12-16 古河電気工業株式会社 電子回路部材の接続部
JPH083963B2 (ja) * 1987-05-29 1996-01-17 日立化成工業株式会社 回路の接続部材
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JPH01315906A (ja) * 1988-06-14 1989-12-20 Nec Corp 異方性導電膜
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JPH02226610A (ja) * 1989-02-25 1990-09-10 Nippon Steel Corp 異方性導電接着剤およびそれを用いた電子部品の接続方法
JPH07123179B2 (ja) * 1990-10-05 1995-12-25 信越ポリマー株式会社 異方導電接着剤による回路基板の接続構造
US5346558A (en) * 1993-06-28 1994-09-13 W. R. Grace & Co.-Conn. Solderable anisotropically conductive composition and method of using same

Also Published As

Publication number Publication date
KR0175678B1 (ko) 1999-05-15
JPH08102218A (ja) 1996-04-16
US5770305A (en) 1998-06-23
KR960012041A (ko) 1996-04-20

Similar Documents

Publication Publication Date Title
TW294814B (OSRAM)
TW389005B (en) Self-assembled low-insertion force connection
JPS62177082A (ja) 異方導電性接着剤
CN101775205A (zh) 各向异性感压导电橡胶及其制备方法
TW503403B (en) Anisotropically electroconductive connecting material
US20060148285A1 (en) Anisotropic conductive connector and probe member and wafer inspecting device and wafer inspecting method
JPS5830193A (ja) 基体上の一組の導電路と印刷回路上の協同する一組の導電路との永久的接続法
TWI220931B (en) Method of testing FPC bonding yield and FPC having testing pads thereon
TW556016B (en) Liquid crystal display and a method for detecting two connected pins thereof
CN203760716U (zh) 一种简易钢桥疲劳测试应变片接线端子
CN203037760U (zh) 一种显示屏点亮检测治具
JP3241276B2 (ja) 導電性微球体及び液晶表示素子
CN109994392A (zh) 连接方法及接合体
TW436654B (en) Testing method for testing liquid crystal display
CN221884085U (zh) 显示面板和显示装置
JP2001337340A (ja) 液晶表示装置およびその製造方法並びに異方性導電フィルムおよび外部回路実装方法
JP3766123B2 (ja) 電極間の導電接続方法及び導電性微粒子
CN209104408U (zh) 单层粒子导电弹性体
JP3163626B2 (ja) 回路基板検査用アダプター装置の製造方法および回路基板検査用アダプター装置
JPS5843125A (ja) 異状発熱検知機能を有する電路の接続部
JP2001214149A (ja) 異方導電接着剤
CN222053454U (zh) 用于压力传感器的电路板垂直连接用导电簧片
CN109988518A (zh) 一种各向异性导电胶及制备方法
CN220283968U (zh) 一种耐高温热熔胶膜
TWI261350B (en) Electronic member with conductive connection structure

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent