TW291572B - - Google Patents

Info

Publication number
TW291572B
TW291572B TW085105355A TW85105355A TW291572B TW 291572 B TW291572 B TW 291572B TW 085105355 A TW085105355 A TW 085105355A TW 85105355 A TW85105355 A TW 85105355A TW 291572 B TW291572 B TW 291572B
Authority
TW
Taiwan
Application number
TW085105355A
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Application granted granted Critical
Publication of TW291572B publication Critical patent/TW291572B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
    • H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising semiconducting material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Recrystallisation Techniques (AREA)
TW085105355A 1995-05-04 1996-05-04 TW291572B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950010983A KR100208439B1 (ko) 1995-05-04 1995-05-04 반도체 소자의 폴리실리콘층 형성방법

Publications (1)

Publication Number Publication Date
TW291572B true TW291572B (zh) 1996-11-21

Family

ID=19413757

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105355A TW291572B (zh) 1995-05-04 1996-05-04

Country Status (6)

Country Link
JP (1) JPH08306642A (zh)
KR (1) KR100208439B1 (zh)
CN (1) CN1083158C (zh)
DE (1) DE19617833A1 (zh)
GB (1) GB2300517B (zh)
TW (1) TW291572B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107192A (en) * 1997-12-30 2000-08-22 Applied Materials, Inc. Reactive preclean prior to metallization for sub-quarter micron application
JP2010123866A (ja) 2008-11-21 2010-06-03 Sharp Corp 半導体装置及びその製造方法
KR102178535B1 (ko) 2014-02-19 2020-11-13 삼성전자주식회사 반도체 소자의 제조 방법
CN106571289B (zh) * 2015-10-13 2020-01-03 中芯国际集成电路制造(上海)有限公司 一种半导体器件及其制备方法、电子装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1239706A (en) * 1984-11-26 1988-07-26 Hisao Hayashi Method of forming a thin semiconductor film
JPH0322527A (ja) * 1989-06-20 1991-01-30 Fujitsu Ltd 半導体装置の製造方法
JPH0350823A (ja) * 1989-07-19 1991-03-05 Nec Corp 半導体装置の製造方法
JP3125302B2 (ja) * 1990-11-21 2001-01-15 セイコーエプソン株式会社 半導体装置の製造方法
JPH05275365A (ja) * 1992-03-30 1993-10-22 Oki Electric Ind Co Ltd 半導体素子の製造方法
US5266514A (en) * 1992-12-21 1993-11-30 Industrial Technology Research Institute Method for producing a roughened surface capacitor
JPH0729852A (ja) * 1993-07-07 1995-01-31 Kawasaki Steel Corp 半導体装置の製造方法
JP2697645B2 (ja) * 1994-10-31 1998-01-14 日本電気株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
KR100208439B1 (ko) 1999-07-15
GB9608822D0 (en) 1996-07-03
CN1083158C (zh) 2002-04-17
GB2300517B (en) 1999-07-28
GB2300517A (en) 1996-11-06
JPH08306642A (ja) 1996-11-22
DE19617833A1 (de) 1996-11-07
CN1144397A (zh) 1997-03-05

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