TW278211B - - Google Patents

Info

Publication number
TW278211B
TW278211B TW083110852A TW83110852A TW278211B TW 278211 B TW278211 B TW 278211B TW 083110852 A TW083110852 A TW 083110852A TW 83110852 A TW83110852 A TW 83110852A TW 278211 B TW278211 B TW 278211B
Authority
TW
Taiwan
Application number
TW083110852A
Other languages
Chinese (zh)
Original Assignee
Memc Electronic Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memc Electronic Materials filed Critical Memc Electronic Materials
Application granted granted Critical
Publication of TW278211B publication Critical patent/TW278211B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H10P72/0472—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H10P72/7602—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW083110852A 1994-05-13 1994-12-02 TW278211B (esLanguage)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/242,560 US5605487A (en) 1994-05-13 1994-05-13 Semiconductor wafer polishing appartus and method

Publications (1)

Publication Number Publication Date
TW278211B true TW278211B (esLanguage) 1996-06-11

Family

ID=22915284

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083110852A TW278211B (esLanguage) 1994-05-13 1994-12-02

Country Status (9)

Country Link
US (1) US5605487A (esLanguage)
EP (1) EP0758941B1 (esLanguage)
JP (2) JPH10501098A (esLanguage)
KR (1) KR100371762B1 (esLanguage)
CN (1) CN1073907C (esLanguage)
DE (1) DE69524404T2 (esLanguage)
MY (1) MY116349A (esLanguage)
TW (1) TW278211B (esLanguage)
WO (1) WO1995031309A1 (esLanguage)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI886498B (zh) * 2022-06-29 2025-06-11 日商富士金股份有限公司 控制閥的底座滲漏偵測方法

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JP4197103B2 (ja) 2002-04-15 2008-12-17 株式会社荏原製作所 ポリッシング装置
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KR20060017591A (ko) * 2003-04-21 2006-02-24 이노플라 아엔씨 하나 이상의 연마면들을 사용하여 반도체 웨이퍼들을연마하기 위한 장치 및 방법
US11260500B2 (en) * 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
JP5296985B2 (ja) 2003-11-13 2013-09-25 アプライド マテリアルズ インコーポレイテッド 整形面をもつリテーニングリング
US20050126708A1 (en) * 2003-12-10 2005-06-16 Applied Materials, Inc. Retaining ring with slurry transport grooves
US20050157308A1 (en) * 2004-01-15 2005-07-21 Andrei Brunfeld Apparatus and method for measuring thickness variation of wax film
JP2006237492A (ja) * 2005-02-28 2006-09-07 Dainippon Screen Mfg Co Ltd ウエハ処理装置
JP4787063B2 (ja) * 2005-12-09 2011-10-05 株式会社荏原製作所 研磨装置及び研磨方法
KR101106203B1 (ko) * 2006-02-22 2012-01-20 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치
CN100400233C (zh) * 2006-05-26 2008-07-09 中国科学院上海技术物理研究所 Ⅱ-ⅵ族半导体材料保护侧边缘的表面抛光方法
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DE102009030292B4 (de) * 2009-06-24 2011-12-01 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
CN101712130B (zh) * 2009-12-22 2012-11-14 中国电子科技集团公司第四十五研究所 应用于硅片化学机械抛光设备中的定位转换装置
JP5099111B2 (ja) * 2009-12-24 2012-12-12 信越半導体株式会社 両面研磨装置
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
CN102615583A (zh) * 2011-01-28 2012-08-01 鸿富锦精密工业（深圳）有限公司 研磨装置
JP5817142B2 (ja) * 2011-02-22 2015-11-18 セイコーエプソン株式会社 水平多関節ロボット
JP5821210B2 (ja) * 2011-02-22 2015-11-24 セイコーエプソン株式会社 水平多関節ロボット及び水平多関節ロボットの制御方法
KR101838109B1 (ko) * 2011-12-06 2018-03-14 삼성전자주식회사 컨택터 및 이를 포함하는 반도체 테스트 장치
WO2013119261A1 (en) * 2012-02-09 2013-08-15 Duescher Wayne O Coplanar alignment apparatus for rotary spindles
ES1078824Y (es) * 2013-02-08 2013-06-10 Matriruiz S L Conjunto de medios mecánicos incorporables a un robot delta para realización de engomado de tapas
KR101446721B1 (ko) * 2013-07-09 2014-10-06 주식회사 엘지실트론 연마용 블록에 웨이퍼를 마운팅하는 방법
US9382801B2 (en) 2014-02-26 2016-07-05 General Electric Company Method for removing a rotor bucket from a turbomachine rotor wheel
US10654145B2 (en) 2015-06-30 2020-05-19 Globalwafers Co., Ltd. Methods and systems for polishing pad control
CN108584321A (zh) * 2018-04-09 2018-09-28 浙江理工大学 一种滑触线的安装装置和方法
CN108705438A (zh) * 2018-07-18 2018-10-26 四川三虎家居有限公司重庆分公司 一种家具板材用抛光装置
CN109623658B (zh) * 2018-12-26 2024-07-23 浙江杰奈尔新材料有限公司 一种研磨机用清洗装置
CN109877694B (zh) * 2019-03-04 2023-08-08 天通日进精密技术有限公司 晶圆边缘抛光装置及晶圆边缘抛光方法
CN110328606A (zh) * 2019-06-27 2019-10-15 浙江晶盛机电股份有限公司 一种全自动一体式单片单面研磨减薄设备
KR102262803B1 (ko) * 2019-07-10 2021-06-09 주식회사 에스피에스테크 웨이퍼용 cmp 시스템
KR102258721B1 (ko) * 2019-08-28 2021-05-28 에스케이실트론 주식회사 웨이퍼 마운팅 장치 및 그 동작 방법
CN113059453B (zh) * 2019-12-31 2024-06-18 浙江芯晖装备技术有限公司 一种抛光设备
CN111673607B (zh) * 2020-04-28 2021-11-26 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
CN115066316B (zh) * 2020-06-29 2024-09-27 应用材料公司 控制化学机械抛光的蒸汽产生
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机
KR102860594B1 (ko) * 2023-06-17 2025-09-17 주식회사 문성엠에스케이 반도체 웨이퍼 제조용 파츠 가공장치
CN116854467B (zh) * 2023-07-12 2024-10-29 江西兆驰半导体有限公司 一种生瓷复合材料及用其制备晶圆搬运臂的制备方法
EP4524582A1 (en) * 2023-09-15 2025-03-19 Microtest S.p.A. Shell for wafer level burn-in (wlbi) chip test, method for loading said shell and machine for burn-in test comprising said shell
CN117457548B (zh) * 2023-12-22 2024-03-22 北京特思迪半导体设备有限公司 晶圆贴片装置及晶圆无蜡抛光上料设备
KR102702556B1 (ko) * 2024-06-10 2024-09-04 (주) 티로보틱스 진공 챔버 내에서 기판을 이송하는 기판 이송 장치

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI886498B (zh) * 2022-06-29 2025-06-11 日商富士金股份有限公司 控制閥的底座滲漏偵測方法

Also Published As

Publication number Publication date
CN1073907C (zh) 2001-10-31
EP0758941A4 (en) 1997-07-30
JPH10501098A (ja) 1998-01-27
CN1147782A (zh) 1997-04-16
JP2006237647A (ja) 2006-09-07
EP0758941A1 (en) 1997-02-26
EP0758941B1 (en) 2001-12-05
KR970703222A (ko) 1997-07-03
WO1995031309A1 (en) 1995-11-23
KR100371762B1 (ko) 2003-04-11
US5605487A (en) 1997-02-25
DE69524404T2 (de) 2002-04-11
DE69524404D1 (de) 2002-01-17
MY116349A (en) 2004-01-31
JP4012927B2 (ja) 2007-11-28

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