TW263596B - - Google Patents
Info
- Publication number
- TW263596B TW263596B TW082105506A TW82105506A TW263596B TW 263596 B TW263596 B TW 263596B TW 082105506 A TW082105506 A TW 082105506A TW 82105506 A TW82105506 A TW 82105506A TW 263596 B TW263596 B TW 263596B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/077—Connecting of TAB connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35860792A JP2509509B2 (ja) | 1992-01-20 | 1992-12-28 | テ―プキャリアおよびこれを用いたテ―プキャリアデバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW263596B true TW263596B (https=) | 1995-11-21 |
Family
ID=18460193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW082105506A TW263596B (https=) | 1992-12-28 | 1993-07-10 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US5477080A (https=) |
| KR (1) | KR0123187B1 (https=) |
| TW (1) | TW263596B (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR950034696A (ko) * | 1994-05-16 | 1995-12-28 | 김광호 | 초박형 반도체 패키지 및 그 제조방법 |
| JP2970491B2 (ja) * | 1995-09-20 | 1999-11-02 | ソニー株式会社 | 半導体パッケージ及びその製造方法 |
| JP3343642B2 (ja) * | 1996-04-26 | 2002-11-11 | シャープ株式会社 | テープキャリアパッケージ及び液晶表示装置 |
| US6074898A (en) * | 1996-09-18 | 2000-06-13 | Sony Corporation | Lead frame and integrated circuit package |
| JPH10173003A (ja) * | 1996-12-13 | 1998-06-26 | Sharp Corp | 半導体装置とその製造方法およびフィルムキャリアテープとその製造方法 |
| US6580157B2 (en) * | 1997-06-10 | 2003-06-17 | Micron Technology, Inc. | Assembly and method for modified bus bar with Kapton™ tape or insulative material in LOC packaged part |
| US5780923A (en) * | 1997-06-10 | 1998-07-14 | Micron Technology, Inc. | Modified bus bar with Kapton™ tape or insulative material on LOC packaged part |
| KR100554864B1 (ko) | 1999-04-22 | 2006-02-24 | 아지노모토 가부시키가이샤 | 열경화성 수지 조성물, 및 이를 사용하는 가요성 회로 오버코트제 |
| JP3750113B2 (ja) * | 2002-03-25 | 2006-03-01 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープ及びその製造方法 |
| US7626255B2 (en) * | 2003-10-15 | 2009-12-01 | Koninklijke Philips Electronics N.V. | Device, system and electric element |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5277972B1 (en) * | 1988-09-29 | 1996-11-05 | Tomoegawa Paper Co Ltd | Adhesive tapes |
| US5091251A (en) * | 1989-05-29 | 1992-02-25 | Tomoegawa Paper Co., Ltd. | Adhesive tapes and semiconductor devices |
| US5258331A (en) * | 1989-10-20 | 1993-11-02 | Texas Instruments Incorporated | Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars |
| JPH03136267A (ja) * | 1989-10-20 | 1991-06-11 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
| US5227232A (en) * | 1991-01-23 | 1993-07-13 | Lim Thiam B | Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution |
| JP2982450B2 (ja) * | 1991-11-26 | 1999-11-22 | 日本電気株式会社 | フィルムキャリア半導体装置及びその製造方法 |
| JPH0828396B2 (ja) * | 1992-01-31 | 1996-03-21 | 株式会社東芝 | 半導体装置 |
-
1993
- 1993-07-10 TW TW082105506A patent/TW263596B/zh active
- 1993-07-27 US US08/098,428 patent/US5477080A/en not_active Expired - Lifetime
- 1993-07-31 KR KR1019930014798A patent/KR0123187B1/ko not_active Expired - Lifetime
-
1995
- 1995-10-04 US US08/538,627 patent/US5814879A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5477080A (en) | 1995-12-19 |
| KR950005125A (ko) | 1995-02-18 |
| KR0123187B1 (ko) | 1997-11-22 |
| US5814879A (en) | 1998-09-29 |