TW260810B - - Google Patents

Info

Publication number
TW260810B
TW260810B TW082110968A TW82110968A TW260810B TW 260810 B TW260810 B TW 260810B TW 082110968 A TW082110968 A TW 082110968A TW 82110968 A TW82110968 A TW 82110968A TW 260810 B TW260810 B TW 260810B
Authority
TW
Taiwan
Application number
TW082110968A
Inventor
Ohmi Tadahiro
Original Assignee
Furontec Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furontec Kk filed Critical Furontec Kk
Application granted granted Critical
Publication of TW260810B publication Critical patent/TW260810B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inorganic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Detergent Compositions (AREA)
TW082110968A 1992-09-30 1993-12-24 TW260810B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4285338A JP2681433B2 (ja) 1992-09-30 1992-09-30 エッチング剤およびこのエッチング剤を使用するシリコン半導体部材のエッチング方法、および洗浄剤およびこの洗浄剤を使用するシリコン半導体部材の洗浄方法

Publications (1)

Publication Number Publication Date
TW260810B true TW260810B (zh) 1995-10-21

Family

ID=17690262

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082110968A TW260810B (zh) 1992-09-30 1993-12-24

Country Status (4)

Country Link
US (1) US5409569A (zh)
JP (1) JP2681433B2 (zh)
KR (1) KR0140688B1 (zh)
TW (1) TW260810B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2743823B2 (ja) * 1994-03-25 1998-04-22 日本電気株式会社 半導体基板のウエット処理方法
JP2792550B2 (ja) * 1994-03-31 1998-09-03 株式会社フロンテック エッチング剤
US5714407A (en) * 1994-03-31 1998-02-03 Frontec Incorporated Etching agent, electronic device and method of manufacturing the device
WO1996004412A1 (fr) * 1994-08-01 1996-02-15 Komatsu Electronic Metals Co., Ltd. Procede de production de silicone decorative
US20040140288A1 (en) * 1996-07-25 2004-07-22 Bakul Patel Wet etch of titanium-tungsten film
JP4240424B2 (ja) * 1998-10-23 2009-03-18 エルジー ディスプレイ カンパニー リミテッド エッチング剤及びこれを用いた電子機器用基板の製造方法
TW490756B (en) * 1999-08-31 2002-06-11 Hitachi Ltd Method for mass production of semiconductor integrated circuit device and manufacturing method of electronic components
US6915592B2 (en) * 2002-07-29 2005-07-12 Applied Materials, Inc. Method and apparatus for generating gas to a processing chamber
WO2005027728A2 (en) * 2003-09-17 2005-03-31 Becton, Dickinson And Company Method for creating trenches in silicon wafers using a router
JP4355201B2 (ja) * 2003-12-02 2009-10-28 関東化学株式会社 タングステン金属除去液及びそれを用いたタングステン金属の除去方法
JP4400281B2 (ja) * 2004-03-29 2010-01-20 信越半導体株式会社 シリコンウエーハの結晶欠陥評価方法
DE602006014551D1 (de) * 2006-10-31 2010-07-08 Soitec Silicon On Insulator Verfahren zur Charakterisierung von Defekten auf Silizium-Oberflächen, Ätzlösung für Silizium-Oberflächen und Verfahren zur Behandlung von Silizium-Oberflächen mit der Ätzlösung
KR20100007461A (ko) * 2008-07-14 2010-01-22 삼성전자주식회사 석영 부품용 세정액 및 이를 이용한 석영 부품 세정방법
TWI403368B (zh) * 2008-12-10 2013-08-01 Lam Res Corp 用於清洗矽電極沉浸式氧化及蝕刻方法
BR112013006364A2 (pt) 2010-09-16 2016-06-28 Specmat Inc método, processo, e tecnologia de fabricação de células solares de silício cristalino de alta eficiência e baixo custo
WO2015143056A1 (en) * 2014-03-18 2015-09-24 Specmat, Inc. Process and fabrication technology for oxide layers
US10619097B2 (en) 2014-06-30 2020-04-14 Specmat, Inc. Low-[HF] room temperature wet chemical growth (RTWCG) chemical formulation
WO2021188452A1 (en) * 2020-03-16 2021-09-23 1366 Technologies, Inc. High temperature acid etch for silicon
CN113106465A (zh) * 2021-04-21 2021-07-13 西安瑞鑫科金属材料有限责任公司 一种高Cr耐蚀不锈钢表面氧化膜脱膜剂及脱膜方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5299101A (en) * 1976-02-16 1977-08-19 Fuji Photo Film Co Ltd Liquid of treating metalic image forming material
US4369099A (en) * 1981-01-08 1983-01-18 Bell Telephone Laboratories, Incorporated Photoelectrochemical etching of semiconductors
JPS57137472A (en) * 1981-02-17 1982-08-25 Nec Corp Etching method for polycrystalline silicon
DE3483164D1 (de) * 1983-01-19 1990-10-18 British Telecomm Zuechtung von halbleiter.
USH291H (en) * 1983-03-01 1987-06-02 The United States Of America As Represented By The Secretary Of The Navy Fully ion implanted junction field effect transistor
US4578419A (en) * 1985-03-28 1986-03-25 Amchem Products, Inc. Iodine compound activation of autodeposition baths
US5111259A (en) * 1989-07-25 1992-05-05 Texas Instruments Incorporated Trench capacitor memory cell with curved capacitors

Also Published As

Publication number Publication date
KR940007157A (ko) 1994-04-26
KR0140688B1 (ko) 1998-06-01
US5409569A (en) 1995-04-25
JP2681433B2 (ja) 1997-11-26
JPH06200384A (ja) 1994-07-19

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent