TW258822B - - Google Patents

Info

Publication number
TW258822B
TW258822B TW084100076A TW84100076A TW258822B TW 258822 B TW258822 B TW 258822B TW 084100076 A TW084100076 A TW 084100076A TW 84100076 A TW84100076 A TW 84100076A TW 258822 B TW258822 B TW 258822B
Authority
TW
Taiwan
Application number
TW084100076A
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of TW258822B publication Critical patent/TW258822B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
TW084100076A 1994-03-04 1995-01-06 TW258822B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/205,423 US6027997A (en) 1994-03-04 1994-03-04 Method for chemical mechanical polishing a semiconductor device using slurry

Publications (1)

Publication Number Publication Date
TW258822B true TW258822B (zh) 1995-10-01

Family

ID=22762127

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084100076A TW258822B (zh) 1994-03-04 1995-01-06

Country Status (5)

Country Link
US (1) US6027997A (zh)
EP (1) EP0670591A3 (zh)
JP (1) JPH07288244A (zh)
KR (1) KR950034564A (zh)
TW (1) TW258822B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11138426A (ja) * 1997-11-11 1999-05-25 Tokyo Electron Ltd 研磨装置
US6727170B2 (en) 1998-02-16 2004-04-27 Renesas Technology Corp. Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof
JPH11233621A (ja) 1998-02-16 1999-08-27 Mitsubishi Electric Corp 半導体装置及びその製造方法
US6180422B1 (en) * 1998-05-06 2001-01-30 International Business Machines Corporation Endpoint detection by chemical reaction
US6284560B1 (en) 1998-12-18 2001-09-04 Eastman Kodak Company Method for producing co-planar surface structures
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
US6777738B2 (en) 1999-06-09 2004-08-17 Renesas Technology Corp. Semiconductor integrated circuit
US6534327B2 (en) 2000-04-13 2003-03-18 Texas Instruments Incorporated Method for reworking metal layers on integrated circuit bond pads
JP2001358214A (ja) 2000-06-15 2001-12-26 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
US6541384B1 (en) 2000-09-08 2003-04-01 Applied Materials, Inc. Method of initiating cooper CMP process
US6593182B2 (en) * 2001-03-19 2003-07-15 Macronix International Co., Ltd. Method for forming multiple gate oxide layer with the plasma oxygen doping
US6515488B1 (en) 2001-05-07 2003-02-04 Stmicroelectronics, Inc. Fingerprint detector with scratch resistant surface and embedded ESD protection grid
DE10133873B4 (de) * 2001-07-12 2005-04-28 Infineon Technologies Ag Verfahren zur Herstellung von Kontakten für integrierte Schaltungen
US20040092102A1 (en) * 2002-11-12 2004-05-13 Sachem, Inc. Chemical mechanical polishing composition and method
US20050022456A1 (en) * 2003-07-30 2005-02-03 Babu S. V. Polishing slurry and method for chemical-mechanical polishing of copper
US7186653B2 (en) * 2003-07-30 2007-03-06 Climax Engineered Materials, Llc Polishing slurries and methods for chemical mechanical polishing
JP2005340328A (ja) * 2004-05-25 2005-12-08 Fujitsu Ltd 半導体装置の製造方法
CN100442108C (zh) * 2004-09-15 2008-12-10 中芯国际集成电路制造(上海)有限公司 用于硅上液晶器件的铝化学机械抛光回蚀
US8124525B1 (en) 2010-10-27 2012-02-28 International Business Machines Corporation Method of forming self-aligned local interconnect and structure formed thereby
US9583442B2 (en) 2015-06-29 2017-02-28 International Business Machines Corporation Interconnect structure including middle of line (MOL) metal layer local interconnect on etch stop layer
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3385682A (en) * 1965-04-29 1968-05-28 Sprague Electric Co Method and reagent for surface polishing
US4475981A (en) * 1983-10-28 1984-10-09 Ampex Corporation Metal polishing composition and process
US4491500A (en) * 1984-02-17 1985-01-01 Rem Chemicals, Inc. Method for refinement of metal surfaces
US4944836A (en) * 1985-10-28 1990-07-31 International Business Machines Corporation Chem-mech polishing method for producing coplanar metal/insulator films on a substrate
US4956313A (en) * 1987-08-17 1990-09-11 International Business Machines Corporation Via-filling and planarization technique
US4959113C1 (en) * 1989-07-31 2001-03-13 Rodel Inc Method and composition for polishing metal surfaces
DE3939661A1 (de) * 1989-11-30 1991-06-13 Wacker Chemitronic Verfahren zur steuerung des einbaues von kupfer in siliciumscheiben beim chemomechanischen polieren
US4992135A (en) * 1990-07-24 1991-02-12 Micron Technology, Inc. Method of etching back of tungsten layers on semiconductor wafers, and solution therefore
US5244534A (en) * 1992-01-24 1993-09-14 Micron Technology, Inc. Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs
US5222329A (en) * 1992-03-26 1993-06-29 Micron Technology, Inc. Acoustical method and system for detecting and controlling chemical-mechanical polishing (CMP) depths into layers of conductors, semiconductors, and dielectric materials
US5340370A (en) * 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing

Also Published As

Publication number Publication date
EP0670591A2 (en) 1995-09-06
EP0670591A3 (en) 1995-12-27
KR950034564A (ko) 1995-12-28
US6027997A (en) 2000-02-22
JPH07288244A (ja) 1995-10-31

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent