TW251385B - - Google Patents

Info

Publication number
TW251385B
TW251385B TW083105193A TW83105193A TW251385B TW 251385 B TW251385 B TW 251385B TW 083105193 A TW083105193 A TW 083105193A TW 83105193 A TW83105193 A TW 83105193A TW 251385 B TW251385 B TW 251385B
Authority
TW
Taiwan
Application number
TW083105193A
Other languages
Chinese (zh)
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW251385B publication Critical patent/TW251385B/zh

Links

Classifications

    • H10W70/40—
    • H10W70/415—
    • H10W74/00—
    • H10W74/016—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW083105193A 1992-08-27 1994-06-08 TW251385B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/936,159 US5293065A (en) 1992-08-27 1992-08-27 Lead frame having an outlet with a larger cross sectional area than the inlet

Publications (1)

Publication Number Publication Date
TW251385B true TW251385B (enExample) 1995-07-11

Family

ID=25468251

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105193A TW251385B (enExample) 1992-08-27 1994-06-08

Country Status (8)

Country Link
US (1) US5293065A (enExample)
EP (1) EP0589569B1 (enExample)
JP (1) JP3512441B2 (enExample)
KR (1) KR940004793A (enExample)
DE (1) DE69324980T2 (enExample)
MY (1) MY117837A (enExample)
SG (1) SG44614A1 (enExample)
TW (1) TW251385B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888308A (ja) * 1994-09-15 1996-04-02 Toshiba Corp リードフレーム及び半導体装置の製造方法
JP3290869B2 (ja) * 1995-11-16 2002-06-10 株式会社東芝 半導体装置
KR100195513B1 (ko) * 1996-10-04 1999-06-15 윤종용 반도체 칩 패키지
KR100476668B1 (ko) * 1997-06-25 2006-06-13 삼성전자주식회사 공기방출구를갖는볼그리드어레이패키지용인쇄회로기판구조
WO1999008850A2 (de) * 1997-08-20 1999-02-25 Infineon Technologies Ag Pressform sowie verfahren zum herstellen eines kunststoffverbundkörpers
JP4256502B2 (ja) * 1998-11-12 2009-04-22 新光電気工業株式会社 半導体装置用リードフレームと半導体装置
KR100707528B1 (ko) 1998-12-22 2007-04-12 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 데이터 캐리어 및 데이터 캐리어가 설치된 장치
US6265761B1 (en) * 1999-05-07 2001-07-24 Maxim Integrated Products, Inc. Semiconductor devices with improved lead frame structures
US6319450B1 (en) 1999-07-12 2001-11-20 Agere Systems Guardian Corp. Encapsulated circuit using vented mold
EP1075022A1 (en) 1999-08-04 2001-02-07 STMicroelectronics S.r.l. Offset edges mold for plastic packaging of integrated semiconductor devices
JP3773855B2 (ja) * 2001-11-12 2006-05-10 三洋電機株式会社 リードフレーム
EP1441252A4 (en) * 2001-11-30 2007-07-11 Panasonic Photo & Lighting Co STROBOSCOPIC APPARATUS AND METHOD OF MANUFACTURING THE SAME
JP2003224239A (ja) * 2002-01-29 2003-08-08 Sanyo Electric Co Ltd 半導体装置およびその製造方法
KR100559551B1 (ko) * 2003-10-11 2006-03-15 앰코 테크놀로지 코리아 주식회사 반도체 장치용 리드프레임 및 이를 위한 봉지 금형과 봉지방법
US10020211B2 (en) * 2014-06-12 2018-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer-level molding chase design
JP2019079928A (ja) * 2017-10-24 2019-05-23 ルネサスエレクトロニクス株式会社 半導体装置の製造方法およびリードフレーム

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54152970A (en) * 1978-05-24 1979-12-01 Hitachi Ltd Resin-molding method, mold and molded body
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5923554A (ja) * 1982-07-30 1984-02-07 Hitachi Ltd 半導体装置用リ−ドフレ−ム
JPS6059759A (ja) * 1983-09-13 1985-04-06 Toshiba Corp リ−ドフレ−ム
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
US4862245A (en) * 1985-04-18 1989-08-29 International Business Machines Corporation Package semiconductor chip
JPS6224653A (ja) * 1985-07-24 1987-02-02 Hitachi Tokyo Electron Co Ltd リ−ドフレ−ム
JPS63150846A (ja) * 1986-12-16 1988-06-23 Matsushita Electric Ind Co Ltd イオンビ−ム照射装置
JPS6465861A (en) * 1987-09-07 1989-03-13 Toshiba Corp Lead frame for semiconductor device
JPS63265454A (ja) * 1987-12-24 1988-11-01 Nec Corp 半導体装置
JPH01192154A (ja) * 1988-01-28 1989-08-02 Nippon Motoroola Kk リードフレーム
JPH01276657A (ja) * 1988-04-27 1989-11-07 Matsushita Electron Corp リードフレーム
JP2593912B2 (ja) * 1988-04-29 1997-03-26 新光電気工業株式会社 リードフレーム
US5018003A (en) * 1988-10-20 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Lead frame and semiconductor device
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US4965654A (en) * 1989-10-30 1990-10-23 International Business Machines Corporation Semiconductor package with ground plane
JPH03280562A (ja) * 1990-03-29 1991-12-11 Hitachi Ltd リードフレーム及び半導体装置樹脂封止方法
JPH04184966A (ja) * 1990-11-20 1992-07-01 Toshiba Corp 半導体装置のリードフレーム

Also Published As

Publication number Publication date
DE69324980D1 (de) 1999-06-24
US5293065A (en) 1994-03-08
SG44614A1 (en) 1997-12-19
MY117837A (en) 2004-08-30
KR940004793A (ko) 1994-03-16
DE69324980T2 (de) 1999-10-07
JPH06177305A (ja) 1994-06-24
JP3512441B2 (ja) 2004-03-29
EP0589569B1 (en) 1999-05-19
EP0589569A1 (en) 1994-03-30

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