TW245836B - Process for trench dynamic random access memory - Google Patents

Process for trench dynamic random access memory

Info

Publication number
TW245836B
TW245836B TW83102069A TW83102069A TW245836B TW 245836 B TW245836 B TW 245836B TW 83102069 A TW83102069 A TW 83102069A TW 83102069 A TW83102069 A TW 83102069A TW 245836 B TW245836 B TW 245836B
Authority
TW
Taiwan
Prior art keywords
dielectric layer
trench
depositing
capacitor
random access
Prior art date
Application number
TW83102069A
Other languages
Chinese (zh)
Inventor
Horng-Huei Tzeng
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW83102069A priority Critical patent/TW245836B/en
Application granted granted Critical
Publication of TW245836B publication Critical patent/TW245836B/en

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  • Semiconductor Memories (AREA)

Abstract

A process for capacitor of dynamic random access memory includes the steps: 1. forming the first dielectric layer; 2. defining pattern of trench capacitor area; 3. depositing the second dielectric layer; 4. by plasma etching technique, anisotropically etching back the second dielectric layer to form oxide spacer, and removing the second dielectric layer of trench outer area surface; 5. depositing the first conductive layer which fills up gaps between the spacers in trench; 6. by plasma etching technique, anisotropically etching back the first dielectric layer to form oxide spacer, and removing the second dielectric layer of trench outer area surface; 7. removing spacer in trench; 8. by plasma etching technique, anisotropically etching the first conductive layer and monolithic-silicon simultaneously; 9. depositing or growing very thin isolation as capacitor dielectric layer, then depositing the second conductive layer, and defining its pattern as electrode of capacitor.
TW83102069A 1994-03-07 1994-03-07 Process for trench dynamic random access memory TW245836B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW83102069A TW245836B (en) 1994-03-07 1994-03-07 Process for trench dynamic random access memory

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW83102069A TW245836B (en) 1994-03-07 1994-03-07 Process for trench dynamic random access memory

Publications (1)

Publication Number Publication Date
TW245836B true TW245836B (en) 1995-04-21

Family

ID=51401117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW83102069A TW245836B (en) 1994-03-07 1994-03-07 Process for trench dynamic random access memory

Country Status (1)

Country Link
TW (1) TW245836B (en)

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MM4A Annulment or lapse of patent due to non-payment of fees